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Programs Catalog

Programs Catalog

>> 2019年 資訊持續更新中!

Special Features 福軒廳 / 南港展覽館一館三樓 Tuesday, September 17
11:25am to 1:00pm
Special Features 504bc 會議室/ 南港展覽館一館五樓 Tuesday, September 17
8:30am to 4:40pm
Advanced Packaging, SiP Global Summit 馥儷廳雅悅會館/ 中信企業總部A棟三樓 Tuesday, September 17
8:30am to 5:40pm

 

Date:Tuesday, September 17th, 2019
Time:08:30 - 17:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: Heterogeneous Integration Packaging Technologies and Smart Manufacturing for 5G & AI  Applications
Outline: (TBD)

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折

*Tax Included

 
 
Sponsored by:
                 
                                    
                               

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
       

 

 

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SiP, SiP Global Summit Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳 Friday, September 20
8:30am to 5:00pm

Date:Friday, September 20th, 2019
Time:08:30 - 16:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: Hybrid SiP Solutions of Heterogeneous & Homogeneous Integration

Outline: 

With the dynamic development of various applications such as automotive, IoT, 5G and AI high performance computing, the ecosystem and manufacturing technology of semiconductor industry have also encountered major paradigm shift. In addition to scaling, another rising wave led by SiP (System in Package) is expanding the landscape of design, integrating options and advanced manufacturing technologies.  The hybrid SiP solutions of Heterogeneous and Homogeneous integrations combining logic, memory, sensors and other functional chips are groundbreaking and enabling all kinds of new applications.

Through SiP Global Summit Day 3 session, we will reveal the charm of HI double shots (Heterogeneous and Homogeneous Integration) from devices and manufacturing perspectives with speakers from chip, package and system such as NXP, MTK, ASE, Micron, Amkor and Mentor followed by an exciting cross-ecosystem panel discussion to further elaborate and enlighten the way to success with hybrid SiP solutions.

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折

*Tax Included

 
 

Sponsored by:

   

 

 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

 

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SiP, SiP Global Summit 馥儷廳雅悅會館/ 中信企業總部A棟三樓 Thursday, September 19
8:30am to 4:55pm

Date:Thursday, September 19th, 2019
Time:08:15 - 17:00 (08:15-08:45 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: AI/5G-driven High Performance Computing, from Cloud to Edge
Outline: 

With the arrival of data-centric era, we are unconsciously immersed in and guided by ubiquitous data generation and processing in our daily life; from remote cloud, data centers, networks, to fleet of personal and sensing devices such as smartphone, wearables, visual monitoring, vocal controls, and smart surveillance. This spurs strong demands on semiconductor logics, memories, and wireless connectivity for data generation, storage, processing, and communication. To meet the escalating demands on data bandwidth and smart computing, the semiconductor industry has re-invented packaging and system integration technologies by providing cost effective solutions in all application domains.

While Moore’s Law transistor scaling continues, semiconductor market has evolved from device centric to data centric. To address market needs, system packages through heterogeneous integration has taken the driver’s seat and  propel system performances toward smart computing, wide data bandwidth, small form factor, with low or zero latency and energy efficiency. And all these are capped by ever better system cost per function as technology and product migrate from generation to generation.

In this forum, speakers from renowned academician, research institute, Design House, EDA tool, foundry, and manufacturing/materials suppliers are sharing their insights and visions. Audience would benefit from this forum to have an in-depth understanding on following subjects

  • Data centric high performance computing industry trends
  • System integration and packaging technologies
  • Chiplets integration: opportunity and challenges
  • Novel enablement ASIC, EDA, and manufacturing tools/materials

 

 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折

*Tax Included

 
 

Sponsored by:

 

 

 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

   

 

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Special Features 宴會廳/台北君悅大飯店三樓 Wednesday, September 18
6:00pm to 9:00pm

科技菁英領袖晚宴跨界全球凝聚產業 年度最具前瞻視野的科技盛宴

SEMICON Taiwan 最具指標性的高階聯誼活動,每年邀請超過600位來自全球半導體業界之卓越企業家、高階經理人及關鍵決策者。

一同齊聚交流,促成跨國、跨領域的合作契機,成功幫助企業品牌行銷與形象提升。

提供一個交流聯誼平台,更希望藉由與會之產業領導者的力量,一起為產業永續發展而努力。

日期:2019年9月18日星期三
時間:18:00-21:00
地點:台北君悅大飯店 三樓宴會廳

*本活動採邀請制

 

 

主辦單位:        
協辦單位:          
白金級贊助:
       
金級贊助:        
銀級贊助:        

 

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Special Features 雅悅會館馥儷廳/中信企業總部A棟三樓 Tuesday, September 17
8:30am to 5:10pm
Special Features 雅悅會館馥儷廳/中信企業總部A棟三樓 Friday, September 20
8:30am to 5:00pm
Special Features 雅悅會館馥儷廳/ 中信企業總部A棟三樓 Thursday, September 19
8:30am to 4:55pm
Friday, July 26 11:30am
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Friday, September 20
8:30am to 11:30am

Date:Friday, September 20th, 2019
Time:08:30 - 11:30 (08:30-09:00 for registration)
Venue: FUTURE Stage, Booth #M1148, 4F, TaiNEX 1/ 台北南港展覽4樓  未來舞台區 攤位號 #M1148
Theme: Leap into the tech future

Outline:

Interested in a full update on the recent developments in the field of nanoelectronics? ITF Taiwan 2019  is your place to be.
Imec and SEMICON Taiwan invite you to the Taipei Nangang Exhibition Center, on September 20th  for a half-a-day program of exclusive insights into research and innovation topics such as advanced 3D scaling, silicon photonics, TDI and pixel imaging, quantum computing, and life sciences by renowned imec experts. Top-notch tech presentations to help you leap into the tech future.

Doors open at 8:30am.
Presentations from 9am till 11:30am
 

Make your visit to SEMICON Taiwan even more worthwhile!

 
 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
Organized by:
     
 

 

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Thursday, September 19
9:00am to 9:30am
Wednesday, September 18 1:30pm
SMART Transportation Wednesday, September 18
10:00am to 10:30am
明日領袖論壇 Friday, September 20
1:30pm to 1:40pm
Thursday, September 19
1:20pm to 1:30pm
Thursday, September 19
4:30pm to 5:00pm
Friday, September 20
2:20pm to 3:20pm
Friday, September 20
2:20pm to 3:20pm

-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Panelist: 
1.Ms. Grace Wang, Taiwan Sales General Manager, Intel  
2.Ms. Poling Liu , HR Director , ASML  
3.Mr. Roger Chang, Vice President, Tokyo Electornic Ltd. 
4. (Inviting) TSMC 

Moderator: 
Mr. Benson Cheng, COO, Deloitte Management Consultant 

View Full Agenda
Friday, September 20
8:30am to 9:00am
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
8:30am to 9:30am
Special Features 凱悅廳二區/ 台北君悅大飯店三樓 Monday, September 16
1:00pm to 3:30pm
Mr. Ian Smythe
Vice President
ARM
Thursday, September 19
11:00am to 11:30am

Abstract of Presentation:

View Full Agenda
Thursday, September 19
4:35pm to 4:50pm
Dr. Eric Kuah
Vice President of Technology
先進太平洋股份有限公司
Thursday, September 19
10:40am to 11:10am

Abstract:

To form die bottom bonding and/or die top bonding for high power application the current state of art is to use different types of sintering material in particular silver dominated metal. We will discuss about newly developed sintering material and pressure sintering processes. In addition, we will discuss on the mechanism behind pressure sintering and the characterization of such sintered bond. The reliability of the sintered bond and bond quality are expound. A variant of results will be compare across different type of materials, which could provide insights to package designers for high-performance power electronics.

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Thursday, September 19
11:10am to 11:40am
Friday, September 20
2:25pm to 2:50pm
Special Features 攤位號#K3276, 南港展覽館一館一樓 Thursday, September 19
10:30am to 12:00pm
Advanced Testing Forum 505ab 會議室/ 南港展覽館一館五樓 Thursday, September 19
9:00am to 4:20pm

Date:Thursday, September. 19th, 2019
Time:09:00 - 16:20 (09:00-09:30 for registration)
Venue:南港展覽館一館5樓 505ab會議室
Theme: 5G & AI-assisted test
Forum Chairs:

  • Dr. Cheng-Wen Wu 吳誠文, 副校長, 國立成功大學/ 共同主席, SEMI Taiwan測試委員會
  • Mr. CJ Hsieh 謝承儒, 總經理, 英特爾創新科技/ 共同主席, SEMI Taiwan測試委員會

Forum Vice Chair:

  • Ms. Wendy Chen 陳文如, 協理, 京元電子/ 副主席, SEMI Taiwan測試委員會

Moderators:

Outline:

With the dynamic development of IC industry driven by applications like 5G, HPC, IoT, AI and Automotive; semiconductor testing faces major paradigm shift with the eager needs to develop new testing concept and capability to cope with the rising complexity of ICs and systems to ensure their reliability and safety.  5G technology, one of the most heated applications, challenges the entire testing ecosystem to develop new system level test methodology for accuracy and quality while at the same time to balance cost and time to volume.  And with the development of AI, testing data generated through design and manufacturing process has become one of the most valuable resources for industry to enhance their testing capability.    

To lead and to facilitate industry technology development on testing, the theme for the very first Advanced Testing Forum in SEMICON Taiwan will be “5G and AI-assisted Test”.  The forum will cover the perspectives from policy and infrastructure to design and manufacturing to discuss standardization, system level test, mmWave test, OTA, AiP device, AI-assisted test and many other exciting topics!  Join us to find out how MOEA 5G Technology Program Office, Qualcomm, MediaTek, SPIL, KYEC, Advantest, Teradyne, CHPT see the future of 5G testing and how installing AI could enhance it to the next level!

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 
Sponsored by:

 

   

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
       
       

 

 

View Full Agenda
Special Features 505ab 會議室/ 南港展覽館一館五樓 Thursday, September 19
9:00am to 4:20pm
Wednesday, September 18 12:20pm

Advanced Materials Technology High-Tech Facility Innovative Technology & Product 

 

2019年9月18日 (星期三)

TechXPOT 1F #K3276

時間 公司 主題 發表語言
12:20 -12:40  中巨芯科技有限公司 中國電子化學材料的思考 中文
13:00 -13:20 重慶群崴電子材料有限公司 納米合金:大功率半導體器件封裝新材料 中文
13:20 -13:40 安格斯化學学公司 安格斯电子化学品 VOLTAN 系列介绍 中文
13:40 - 14:00 台灣納美仕電子材料(股)公司 Copper foil surface treatment technology and low dielectric materials for high-speed transmission 英文
14:00 - 14:20 上杭縣紫金佳博電子新材料科技有限公司 合金線、銅線研究報告 中文
14:20 - 14:40 台灣賀利氏材料科技股份有限公司 保障您明日的電力電子重要材料需求 中文
14:40 - 15:00 Evertech Enterprise Co., Ltd. 公司及產品介紹 中文
15:00 - 15:20 阿科瑪(中國)投資有限公司 阿科瑪KYNAR® PVDF在高純淨工業之應用 中文
15:20 - 15:40 河南國璽超純新材料股份有限公司 超高純金屬材料在半導體領域運用淺析 中文
15:40 - 16:00 5N Plus Inc., Micro Powders Ultra-Fine Metal Powders for a Wide Range of Microelectronic Assemblies 英文

 

TechXPOT 4F #L1216

時間 公司 主題 地點
10:40 - 11:00 施耐德電機股份有限公司 Presentation by 施耐德電機股份有限公司  
11:00 - 11:20 志尚儀器股份有限公司 AMC 暨環境與煙道氣體及 PM 2.5 成分創新分析技術探討 中文
11:20 - 11:40 金兆益科技股份有限公司 半導體無塵室智能在線 AMC 監控技術 中文
11:40 - 12:00 太丞股份有限公司 全新模塊化結構之冷卻水塔設計開發 中文
12:00 - 12:20 SEMI高科技廠房設施委員會 NTUT-晶圓盒門開啟下晶圓污染控制的一有效解決方案 中文、英文
13:20 - 13:40 台灣維諦有限公司 絕佳廠房關鍵設備保障--EXL S1 高效率的運轉模式 ---可靠性和最高能效的兼具 中文
13:40 - 14:00 濾能股份有限公司 MAU化學濾網演進及新世代思維 中文
14:00 - 14:20 漢科系統科技股份有限公司 製程尾氣微塵控制技術 中文
14:40 - 15:00 台灣蓋姆有限公司 WHAT DO SKYSCRAPERS AND MICROCHIPS HAVE IN COMMON? FOCUS ON THE SEMICONDUCTOR INDUSTRY. 中文
15:00 - 15:20 信紘科技股份有限公司 綠色製程:產業未來趨勢及信紘解決方案 中文
15:20 - 15:40 美商儀析科技股份有限公司 台灣分公司 Next generation Chemical process control in Semiconductor Industry 英文
15:40 - 16:00 鈺祥企業股份有限公司 後摩爾定律時代之AMC最佳解決方案 中文
16:00 - 16:20 JACOBI CARBONS AG Semiconductor Gas Filtration Challenge 英文

 

 

 

2018年9月19日 (星期四)

TechXPOT 1F #K3276

時間 公司 主題 發表語言
10:30 - 12:00 國家實驗研究院儀器科技研究中心 「國研院先進半導體設備與製程技術」在地化成果發表會 中文
13:30 - 14:00 CONNECTEC JAPAN Presentation by CONNECTEC JAPAN  
15:00 - 15:30 亞智科技股份有限公司 Manz's Solution in FOPLP RDL Formation 中文
15:30 - 16:00 銦泰公司 倒裝芯片和BGA植球工藝的挑戰以及解決方案 中文

 

TechXPOT 4F #L1216

時間 公司 主題 地點
10:30 - 11:00 台灣檢驗科技股份有限公司 半導體製程化學品與汽車應用微電子產品的品質確認暨可靠性評估的新發展 英文
11:00 - 11:30 廣化科技股份有限公司 Residue Free & Low Void — Formic Acid Vacuum Reflow Oven 英文
11:30 - 12:00 SilcoTek Corporation CVD Coatings to Control Metal-Ion and Particulate Contamination 英文
13:30 - 14:00 韓商穎鈦科技股份有限公司台灣分公司 Presentation by 韓商穎鈦科技股份有限公司台灣分公司  
14:00 - 14:30 億合科技股份有限公司 SmartNIL™ Nanoimprint Lithography enabling advanced functionality of optical devices for AR 英文

 

 

2019年9月20日 (星期五)

TechXPOT 1F #K3276

時間 公司 主題 發表語言
10:20 - 10:50 產業技術總合研究所奈米電子學研究部門 Packaging in Minimal Fab 英文
10:50 - 11:10 台灣斯倍利亞股份有限公司 低溫燒結奈米銀與全方位銲錫產品對應 中文
11:10 - 11:40 培栢艾先進材料股份有限公司 新耐高溫工程塑膠材料 中文
13:30 - 13:50 達興材料股份有限公司 Multi-functional TBDB Material Solutions for Advanced Packaging Technologies 中文
13:50 - 14:10 昀鴻企業有限公司 銅膏進階相關應用 英文

 

TechXPOT 4F #L1216

時間 公司 主題 地點
10:20 - 10:40 SEMI高科技廠房設施委員會 科技部贊助研發之高科技廠房設施消磁系統 中文
11:20 - 11:40 銳澤實業股份有限公司 高科技廠房&廠務規劃設計 中文
11:40 - 12:00 樂盟科技有限公司 T1 VPD 晶圓表面系統與 HST 化學品傳輸系統。 是最新專利的晶圓與化學品的重金屬分析前級設備。 T1 VPD 據有安全且快速,設備為零背景的晶圓蝕刻法設備。 HST 可以把化學品在數分鐘內傳輸適量數十ml , 到幾百米實驗室,順利值接上ICP MS 來分析到 ppt to ppq. 中文

 

 

View Full Agenda
Special Features 攤位號#K3276, 南港展覽館一館一樓 Wednesday, September 18
12:20pm to 4:00pm
Special Features 攤位號#K3276, 南港展覽館一館一樓 Friday, September 20
10:20am to 3:10pm
Special Features 攤位號#K3276, 南港展覽館一館一樓 Thursday, September 19
12:00pm to 4:30pm
Special Features 攤位號#L1216, 南港展覽館一館四樓 Wednesday, September 18
10:40am to 4:40pm
Special Features 攤位號#L1216, 南港展覽館一館四樓 Thursday, September 19
10:30am to 4:30pm
Special Features 攤位號#L1216, 南港展覽館一館四樓 Friday, September 20
10:20am to 1:00pm
Power Electronics and Optoelectronics Semiconductor Technology Forum 401 會議室/ 南港展覽館一館四樓 Thursday, September 19
8:00am to 4:40pm

 

Date:Thursday, September 19th, 2019
Time:08:20 - 16:40 (08:20-08:50 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室

Theme: 

  • Wide Band Gap Power Electronics ​
  • 5G Communications and VCSEL

Chair:

  • Mr. Brian Lee 李宗鴻, 策略長, 穩懋半導體股份有限公司/ 主席, SEMI Taiwan 功率暨化合物半導體委員會

Vice Chairs:

  • Dr. Yi-Cheng Cheng 程一誠, 材料暨光電研究所所長, 國家中山科學研究院/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會
  • Mr. Andy Chuang 莊淵棋, 總經理, 漢磊科技股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會
  • Dr. Barry Jia-Fu Lin 林嘉孚, 技術長, 聯穎光電股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會

​Moderator:

  • Mr. Andy Chuang 莊淵棋, 總經理, 漢磊科技股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會
  • Dr. Barry Lin 林嘉孚, 技術長, 聯穎光電股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會

Outline: 

  • Energy saving and carbon reduction are two major topics in the area of environment protection of the  earth. WBG (Wide Band Gap) technology is one of best solution to enhance the efficiency of energy conversion, it can effectively make power electronics systems much smaller, lighter, more reliable and more efficient, while being capable of operating at higher temperatures. Compared to silicon devices and materials, wide band gap devices based on SiC and GaN have excellent characteristics to achieve a significant improvement in performance such as higher breakdown voltages, higher electron mobility and higher thermal conductivity.
    To popularize WBG power electronics, the forum will address WBG applications in EV industry, wide band gap materials, as well as manufacturing and process technologies for wide band gap devices.

  • 5G communication is rolling out to the field in the coming years. It changes the role of cell phone in a revolutionary way. Cell phone is no longer just a personal tool, it moves to an interaction media between human and environment through IOT connection. In this session, 5G technology and architecture trends will be reviewed by two prominent vendors in the world.
    VCSEL emerges as the “hot shot” in photonics area. In addition to the technology, component module, epi-wafer growth, and on-wafer testing are the other three key areas. Companies in Taiwan play a vital role in providing these key elements.  We will show case some examples in this session.
    In this session, topics on 5G communication and VCSEL demonstrate the impact of compound semiconductor industry on our daily life in the future.

 
 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 3,200 NTD 4,000 NTD 3,200 5人以上再享9折

*Tax Included

 
 
Co-organizer:
   
     

 

Partner:
   
     

 

 

Sponsored by:

 

 

 

 

 

 

 

   

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
       
       

 

View Full Agenda
Special Features 401 會議室/ 南港展覽館一館四樓 Thursday, September 19
8:00am to 4:40pm
Special Features 宴會廳 B Room / 南港展覽館一館三樓 Thursday, September 19
11:30am to 1:30pm
Wednesday, September 18 10:00am

突破矽半導體摩爾定律限制!下世代半導體材料寵兒!「化合物半導體創新應用館」邀請到漢磊、嘉晶、穩懋、GaN Systems、IQE等廠商就「3D Sensing」、「LiDAR & Radar」、「Powertrain」三大主題展示相關技術趨勢,並透過BMW i3純電動車現場亮相呈現化合物半導體產業鏈及由其驅動的終端應用!

 

參展廠商

BMW

工研院電子與光電系統研究所

漢磊先進投資控股股份有限公司

GaN Systems Inc.

高平磊晶科技股份有限公司

穩懋半導體股份有限公司

 

 

SPONSORS 

                                 

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Semiconductor Advanced Inspection and Metrology Forum 505a 會議室/ 南港展覽館一館四樓 Friday, September 20
8:30am to 4:15pm

 

Date:Friday, September 20th, 2019
Time:08:30 - 16:15 (08:30-09:00 for registration)
Venue:Room 505a, 5F, TaiNEX 1 / 台北南港展覽館一館 5樓 505a會議室
Theme:  Inspection and Metrology Technologies Improving Semiconductor Manufacturing
Outline:  The Semiconductor Advanced Inspection and Metrology Forum is focusing on technologies of inspection and metrology which affect the semiconductor manufacturing significantly and drive the growth of market. The global market of semiconductor inspection equipment is expected to reach US$ 5300 million by 2024, from US$ 3360 million in 2019. To facilitate the development of semiconductor inspection and metrology, SEMI Inspection and Metrology Committee has been established. The committee and this forum provide a platform for communications and aim to create the advanced solutions of inspection and metrology for semiconductor industry.

 
 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
View Full Agenda
Special Features 505a 會議室/ 南港展覽館一館四樓 Friday, September 20
8:30am to 4:15pm
IC Forum 401 會議室/ 南港展覽館一館四樓 Friday, September 20
8:00am to 4:20pm

Date:Friday, September 20th, 2019
Time:08:00 - 16:25 (08:00-08:30 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室
Theme: A Big Thing in Semiconductor Industry

Chair:

  • Dr. John Lin 林進祥, 處長, 台灣積體電路製造股份有限公司/ 主席, SEMI Taiwan IC委員會

Vice Chairs:

  • Mr. Rutgers Chow 周雷琪, 總經理, 住程科技系統有限公司/ 副主席, SEMI Taiwan IC委員會
  • Mr. G.C. Hung 洪圭鈞, 副總經理, 聯華電子股份有限公司/ 副主席, SEMI Taiwan IC委員會

Moderator:

  • Mr. Kevin Liu 劉興凱, 副總經理, 科林研發股份有限公司

Outline: 

IC Forum is the global stage where industry leaders share their visions and perspectives on the roadmap of IC technology and how it enables various applications such as AI, quantum computing, HPC and 5G that keep advancing our industry.    

For this year's IC Forum, we are honored to have Microsoft, TSMC, UMC, imec and world leading equipment, materials and EDA companies to jointly address "A Big Thing in Semiconductor Industry."  "A Big Thing" could be a killer application like AI or autonomous driving, a breakthrough in chip design, and it could refer to the value of IC manufacturing in materializing all the innovation of applications through technology like scaling, specialty IC, new memory and heterogeneous integration.  

Through IC forum, we discuss trends, innovation and next generation manufacturing technology that advance the development of human life!

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 3,200 NTD 4,000 NTD 3,200 5人以上再享9折

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

 

 

 

 

 

 

 
       

 

 

View Full Agenda
Special Features 401 會議室/ 南港展覽館一館四樓 Friday, September 20
8:00am to 4:20pm
Special Features 402ab 會議室/ 南港展覽館一館四樓 Wednesday, September 18
9:00am to 12:20pm
Special Features 攤位號#L1216, 南港展覽館一館四樓 Friday, September 20
2:00pm to 3:30pm
Wednesday, September 18 9:00am

>> 2019年 資訊持續更新中!

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Special Features 攤位號#J3258, 南港展覽館一館一樓 Wednesday, September 18
10:30am to 4:30pm
Special Features 攤位號#J3258, 南港展覽館一館一樓 Thursday, September 19
10:30am to 4:30pm
Special Features 攤位號#J3258, 南港展覽館一館一樓 Friday, September 20
10:30am to 4:30pm
Special Features 南港展覽館一館一樓/ 四樓 Wednesday, September 18
10:00am to 5:00pm
Special Features 南港展覽館一館一樓/ 四樓 Thursday, September 19
10:00am to 5:00pm
Special Features 南港展覽館一館一樓/ 四樓 Friday, September 20
10:00am to 5:00pm
Wednesday, September 05 10:00am
MEMS & Sensors 504bc 會議室/ 南港展覽館一館五樓 Tuesday, September 17
8:30am to 4:40pm

Date : Tuesday, September 17th , 2019
Time :  08:30 – 16:40 (8:30-8:55 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme :  Edge Sensing to Edge AI for Life 

Outline:

Human beings currently experience a fast-changing world, which is overwhelmed by artificial intelligence (AI) in all kinds of aspects, thus greatly influencing our life, and this is just the beginning. Although AI has been developed for several decades, its progress is not significant until miniaturized, high performance and cost-effective sensors available. However, there are still many challenges hindering the real implementation of AI into our life (i.e., edge or local), including handling of trillion raw data from sensors, limited bandwidth and speed of wireless communication, and insufficient capacity and calculation efficiency of cloud. As such, this brings “Edge Sensing to Edge AI for Life” to be the main theme of the 2019 SEMICON Taiwan MEMS & Sensors Forum. The invited presentations this year will unveil the state-of-the-art Edge technology and local intelligence in sensors, modules, and application scenarios, as well as their eco-systems such as edge computing, 5G communication, cloud, big data, algorithm, and AI layers, thus enabling a real Edge era. Foreseeing the trends enabled by the Edge era, the forum this year features four categories including automotive and AI/Applications/Smart Life, with excellent presentations offered by flagship companies worldwide.

 

 

早鳥
(7/10-8/30)
原價
(8/31-9/20)
會員 非會員 會員 非會員
NTD1,800 NTD2,250 NTD2,250 NTD2,700

*Tax Included 

 
Sponsored by:
              

 

 

     

     
     
     
     
* Forum agenda is subject to change    
     
     
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
              

 

 

        

 

 

 
 
View Full Agenda
Special Features 攤位號#I2013a, 南港展覽館一館一樓 Friday, September 20
11:50am to 1:00pm
Tuesday, September 04 8:00am
Special Features 攤位號#I3216, 人才培育特展, 南港展覽館一館一樓 Thursday, September 19
1:30pm to 4:00pm
Talent Development Forum 攤位號#I3216, 人才培育特展, 南港展覽館一館一樓 Thursday, September 19
1:30pm to 3:00pm

 

Date:Thursday, September 19th, 2019
Time:13:00 - 15:00 (13:00-13:30 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 / 攤位號#I3216, 人才培育特展, 南港展覽館一樓
Theme: How to Land on the Dream Job and Change the Future ? 
Outline: 
為因應就業市場多元發展以及職涯上迷惘,今年特別舉辦「提升人才競爭力研討會」。藉由研討會模式,提供人才競爭力相關議題對話的平台。
本次研討會以「How to Land on the Dream Job and Change the Future ? 」為主題。一同邀請重量級講師,台灣美光晶圓科技股份有限公司 台灣人力資源策略夥伴 劉素齡  處長蔚華科技股份有限公司 林星福 副總經理絡達科技股份有限公司 朱益德 人力資源處 處長以及東京威力科創股份有限公司 張天豪 執行副總裁分別從人力資源以及公司治理角度分別切入議題,透過不同的面向探討人才競爭力與就業市場。並針對未來就業市場的變遷及如何自我提升競爭力,進一步討論人才競爭力未來願景,共同為台灣人才發揮最大努力。

 

Panel Discussion/討論主題
Theme: How to Land on the Dream Job and Change the Future ? 

Moderator/主持人
Mr. Jason Shin, Senior Vice President of Executive Recruiting Consultancy Division, 104 Corporation
 
Panelists/與會講師
1. Ms. Jessie Liu, Taiwan Country HRBP Director, Micron Technology Taiwan, Inc. / 
   台灣美光晶圓科技股份有限公司 台灣人力資源策略夥伴 劉素齡  處長
2. Mr. Richard Li, Vice President, Spirox 
   蔚華科技股份有限公司 林星福 副總經理
3. Mr. Yi Te Chu, HR Div. Director,  Airoha Technology Corporation    
    絡達科技股份有限公司 朱益德 人力資源處 處長 
4. Mr. Roger Chang, Executive Vice President, Tokyo Electron Taiwan

    東京威力科創股份有限公司 張天豪 執行副總裁             
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

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Special Features 攤位號#I3216, 人才培育特展, 南港展覽館一館一樓 Friday, September 20
1:30pm to 3:00pm
SEMI Talent Forum 攤位號#I3216, 人才培育特展, 南港展覽館一館一樓 Friday, September 20
1:30pm to 3:00pm

 

Date:Friday, September 20th, 2019
Time:13:00 - 15:00 (13:00-13:30 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 / 攤位號#I3216, 人才培育特展, 南港展覽館一樓

-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Outline: 

因應數位世代來臨,如何建構出新世代視野成為重要課題,今年舉辦「明日領袖論壇」。藉由論壇,關注及面對數位時代來臨以及建構AI領域大藍圖為本次論壇對話主題。
本次以「Strategy Thinking in Era of Digital Transformation」、「Vision for Building a Digital Workforce Experience」、 「Preparation for the AI Revolution in Workforce Development」為三大討論主題,邀請到重量級講師,Ms. Fiona Tan, Intel Taiwan Senior
  HR Manager, Intel、Mr. Leon Lu, Chief of Adm. & HR, Wistron Corporation.以及Mr. Charles Lu, Founder ,HR_friday   等,共同談論數位時代來臨、建構視野的重要性以及如何應對新AI時代的到來,希望藉由經驗交流與傳承,共同在這數位變遷的時代提供寶貴的意見以及建構出無限美好的科技未來。

 

Panel Discussion/討論主題
-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Moderator/主持人
Mr. Eugene Huang, Partner, Deloitte Consulting
 德勤管理諮詢 黃于峻 合夥人
 
Panelist/與會講師

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
View Full Agenda
Smart Data Global Summit 504bc 會議室/ 南港展覽館一館五樓 Thursday, September 19
8:30am to 12:15pm

Date:Thursday, September 19th, 2019
Time:08:30 – 12:15 (8:30-8:55 for registration)
Venue:南港展覽館一館5樓 504bc會議室
Theme: Artificial Intelligence and Ubiquitous Computing in the Digitally Transformed Future
Outline:

Artificial intelligence is permeating everybody’s lives through the face recognition, voice recognition, image analysis and natural language processing capabilities built into their smartphones, consumer and industrial appliances.  However, as traditional processors struggle to meet the demands of compute-intensive artificial intelligence applications, dedicated AI chips are playing an increasingly important role in research, development, and on the cloud and edge. 

With its potential market of hundreds of zettabytes and $2 trillion of on top of the existing $1.5-2B information technology industry, AI not only relies on new semiconductor architectures and compute platforms but also brings many growth opportunities for new semiconductor products where new approaches to designs are required because of the complexity of the applications that need to be supported. Join to learn these industry executives’ vision leading the way forward to a fully connected, intelligent world.

 

早鳥
(7/10-8/30)
原價
(8/31-9/20)
會員 非會員 會員 非會員
Free Free Free Free

 

Co-organizer :
                                                        
     
     

* Forum agenda is subject to change    

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

   

 

View Full Agenda
Special Features 504bc 會議室/ 南港展覽館一館五樓 Thursday, September 19
8:30am to 12:15pm
Smart Transportation Forum 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 18
8:30am to 4:20pm

Date : Wednseday, September 18th , 2019
Time :  08:30 – 16:00 (8:30-8:55 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme :  From Silicon to Future Mobility

 

早鳥
(7/10-8/30)
原價
(8/31-9/20)
會員 非會員 會員 非會員
NTD1,800 NTD2,250 NTD2,250 NTD2,700

*Tax Included

Co-organizer:
                    
     
     
Sponsored by:    
                 

     

     
     
Media Partner :    
   
     
     
     
     
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

View Full Agenda
Special Features 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 18
8:30am to 4:20pm
Special Features 宴會廳 A Room / 南港展覽館一館三樓 Wednesday, September 18
11:30am to 1:30pm
Special Features 宴會廳 B Room / 南港展覽館一館三樓 Wednesday, September 18
11:30am to 1:30pm
Smart MedTech Forum 504bc 會議室/ 南港展覽館一館五樓 Friday, September 20
8:30am to 12:00pm

Date:Friday, September 20th , 2019
Time:08:30 – 12:00 (8:30-8:55 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme: Create New Value Chain to Empower Medical Technology
Outline:

According to Global Market Insights, Inc., the global digital health market was valued at USD 86 billion in 2018 and expected to grow at a CAGR of 38.8% over the next seven years, expected to reach USD 504  billion in 2025. Rapidly advancing technologies , including artificial intelligence (AI), machine learning, Robotics,  IoT and wearables, etc. are impacting and accelerating health care industry. Smart MedTech can advance health care quality, improver data controls, decisions making in treatment or pharma and precision medicine, all these require the collaboration between microelectronics and health care industry. 

For microelectronics industry, it’s essential to understand the health care industry’s expectation and provide reliable, efficient and cost-effective solutions to increase the market size. As for health care industry, MedTech comes with immense opportunities to take advantage of latest technologies and  to boost the technology advancement. The close collaboration between these two industries definitely bring the bright future for human life.

The Smart MedTech forum not only initiate the communication between microelectronics industry with MedTech applications, but also accelerate semiconductor industry involvement in MedTech development and invest more resource to realize Smart MedTech.

 

早鳥
(7/10-8/30)
原價
(8/31-9/20)

會員

非會員

會員

非會員

Free

Free

NTD1,800

NTD2,250

*Tax Included

* Forum agenda is subject to change    

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

   

 

View Full Agenda
Special Features 504bc 會議室/ 南港展覽館一館五樓 Friday, September 20
8:30am to 12:00pm
Special Features 攤位號#K2041a, 南港展覽館一館一樓 Thursday, September 19
11:50am to 1:00pm
Wednesday, September 18 10:00am

主宰半導體下世代關鍵技術!「異質展示整合創新技術館」展示異質整合終端應用與重點技術,邀請到日月光及其他5G電信業者、IC設計、封裝、矽光子技術等相關廠商於技術創新館中展示,呈現產業第一手資訊!

參展廠商

公司名稱

展示內容

Techsearch

 Heterogeneous Integration Market Trend

中華電信研究院

 5G Roadmap

聯發科技股份有限公司

 5G/Networking ASIC

日月光半導體製造股份有限公司

 2.5D & 3D  

 Fan Out Packaging 

力成科技股份有限公司

 Fan Out Panel Level Packaging

希鐠科技股份有限公司

 Electronic System integration structures

工業技術研究院

 AI on Chip

 

 

 

 

 

 

 

 

 

 

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E-innovation Forum 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
8:30am to 12:25pm

此場次現場座位已滿,另於Room 504a有現場同步轉播,歡迎報名!

Date:Wednesday, September 18th, 2019
Time:08:30 - 12:25 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1/ 台北南港展覽4樓  未來舞台區 攤位號 #M1148
Outline: 

Innovation is uncertain and could be risky, and yet it is also the biggest drive of technology invention and development which through the creative destruction led by innovation, we witness and experience remarkable changes and improvement of human life.

Behind every innovation, there are painstaking process with countless trial and error and there are also enlightening moments of epiphany.  What drives innovation to success, what we discover throughout the process and how future innovation looks like, we invite a series of distinguished speakers from worldwide leading research institute & academia who have made exceptional contributions to this industry to share their insights and visions. Facing innovative future, let’s learn, unlearn and relearn.

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

View Full Agenda
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
8:30am to 12:25pm
Special Features 攤位號#I3216, 人才培育特展, 南港展覽館一館一樓 Friday, September 20
10:00am to 11:30am
Women-in-Tech Forum 攤位號#I3216, 人才培育特展, 南港展覽館一館一樓 Friday, September 20
10:00am to 11:30am

 

Date:Friday, September 20th, 2019
Time:10:00 - 11:30 (10:00-10:10 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 / 攤位號#I3216, 人才培育特展, 南港展覽館一樓
Theme: Empowering Women for the Future 
Outline: 

近年來科技女性逐漸佔居一席之地,今年舉辦「科技女力論壇」。藉由論壇,分享自身成功經歷,鼓勵勇敢實踐科技夢,期望激發女性在 STEM 領域發光發熱,擁有更多自由發聲、勇於挑戰自我成長的機會。
本次研討會以「Empowering Women for the Future  」為主題。一同邀請重量級講師,明導國際股份有限公司台灣暨東南亞區總經理
   林棨璇 /台灣微軟 營運暨行銷事業群 首席營運長何虹/台灣應用材料股份有限公司 台灣日本中國區半導體事業服務群 幕僚長 陸藍珠 共同談論女力發展趨勢、兩性平等職場環境與女性科技人才培育的重要性,希望藉由不同世代的經驗交流與傳承,一起啟發並幫助懷著科技夢的女性不斷前進,成就更多不凡女性。

 

Theme/主題

Empowering Women for the Future 

Moderator/主持人

 Dr. Tri-Rung Yew, Professor, Department of Materials Science and Engineering , National Tsing Hua University
 國立清華大學 材料與工程學系 游萃蓉 教授 

Panelists/與會講師
1. Ms. Nina Lin, General Manager, Taiwan & ASEAN, Mentor, a Siemens Business

    明導國際股份有限公司 林棨璇 台灣暨東南亞區總經理  
2. Dr. Hedy Ho, Chief of Marketing and Operations , Microsoft Taiwan
   台灣微軟 營運暨行銷事業群 何虹 首席營運長
3. Ms. Julia Lu, Chief of Staff ,Semiconductor Products Group Taiwan, Japan, and China, Sales & Marketing,Applied Materials Taiwan
  台灣應用材料股份有限公司 台灣日本中國區半導體事業服務群 陸藍珠 幕僚長 

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
View Full Agenda
Technology Think Tank Summit 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
1:20pm to 5:00pm

此場次現場座位已滿,另於Room 504a有現場同步轉播,歡迎報名!

Date:Wednesday, September 18th, 2019
Time:13:20 - 17:00 (13:20-13:50 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1/ 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓
Theme: 台灣高科技產業的下個60年
Outline: 

SEMICON Taiwan 國際半導體展是串聯微電子與半導體產業生態圈,展示產業最新設計、製造與應用的年度產業盛會。在眾多活動中, 「科技智庫領袖高峰會」是集結全球產業領袖分享他們對產業未來的見解與願景的指標性活動。憑藉著IC發明60年間打下的厚實基礎,台灣如何能夠在面對全球競爭和變革的過程中,創造另一個輝煌的60年更是我們的使命,也是我們今年「科技智庫領袖高峰會」的主題。我們將邀請來自系統整合、IC設計、記憶體、晶圓製造、封裝測試等領域的業界領袖,及經濟部沈榮津部長主持會談,共同討論並引領台灣高科技產業走出下一個輝煌60年。

 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 
 
Sponsored by:
 
     

 

 
 
* Forum agenda is subject to change
 
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
   
     

 

View Full Agenda
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
1:20pm to 5:00pm
Strategic Materials Conference Taiwan 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Thursday, September 19
8:30am to 5:00pm

Date:Thursday, September 19th, 2019
Time:08:30 - 16:55 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1/ 台北南港展覽4樓  未來舞台區 攤位號 #M1148
Theme: Materials Leading the Smart Future of Semiconductor - Device Performance

Chair:

  • Mr. Min-Te Chen 陳明德, 副處長, 台灣積體電路製造股份有限公司/ 主席, SEMI Taiwan材料委員會

Vice Chairs:

  • Dr. Joe Wu 吳宗禧, 副處長, 台灣積體電路製造股份有限公司/ 副主席, SEMI Taiwan材料委員會
  • Dr.  Jeffrey Yang 楊秉豐, 資深部經理, 日月光半導體製造股份有限公司/ 副主席, SEMI Taiwan材料委員會
  • Mr. Brian Chen 陳致遠, 副總經理, 華立企業股份有限公司/ 副主席, SEMI Taiwan材料委員會

Outline: (TBD)

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 2,500 NTD 3,125 NTD 2,500 5人以上再享9折

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 

 

 

 

 

   

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

 

View Full Agenda
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Thursday, September 19
8:30am to 5:00pm
Special Features 福軒廳 / 南港展覽館一館三樓 Wednesday, September 18
12:25pm to 1:50pm
Cybersecurity Global Summit 401 會議室/ 南港展覽館一館四樓 Wednesday, September 18
8:30am to 11:55am

 

Date:Wednesday, September 18th, 2019
Time:08:30 - 12:05 (08:30-09:00 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 401 會議室/ 南港展覽館一館四樓
Theme: Enabling Cybersecurity for Digital Resilient Factory 
Outline:TBD

 
 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

Sponsored By: 
 

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 

 

View Full Agenda
Special Features 401 會議室/ 南港展覽館一館四樓 Wednesday, September 18
8:30am to 11:55am
Special Features 攤位號#J2838, 工業技術研究院, 南港展覽館一館一樓 Thursday, September 19
1:00pm to 3:00pm
Special Features 504bc 會議室/ 南港展覽館一館五樓 Thursday, September 19
1:00pm to 5:00pm
Quantum Computer: Envision the new era of computing 504bc 會議室/ 南港展覽館一館五樓 Thursday, September 19
1:00pm to 5:00pm

                       

Date:Thursday, September 19th, 2019
Time:13:00 – 17:00 (13:00-13:30 for registration)
Venue:南港展覽館一館5樓 504bc會議室
Outline:

The first quantum revolution is that scientists and tech engineers use the rules of quantum mechanics to build devices including the transistor, the laser, integrated circuit etc. The second quantum revolution is that we are directly using quantum machine including quantum sensor, quantum information and quantum computer. The quantum computer bases on quantum mechanics and gives the new computing that promise to solve some of the currently intractable problems. 

Quantum computer had a lot of potential applications including predictions of new medicine and new material, optimization, quantum machine learning for Artificial intelligence, financial problems, cryptography and so on. The first commercial quantum computer has been established by IBM in this year and it is can be predict that the quantum computer will be rapid development. Also recent two years more than hundred private and startup companies have been found. It is time to connect the future, the quantum era.

 

            

早鳥
(7/10-8/30)

            

            

原價
(8/31-9/20)

            

會員 非會員 會員 非會員
Free Free Free Free

 

Organizer:
                      
     
     
     
     
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

View Full Agenda
Special Features 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 18
11:30am to 11:50am
Special Features URBAN331/ 慕軒飯店一樓 Thursday, September 19
5:30pm to 7:30pm
High-Tech Facility 402abc 會議室/ 南港展覽館一館四樓 Thursday, September 19
8:30am to 5:30pm

Date:Thursday, September 19th, 2019
Time:08:30 - 17:30 (08:30-09:00 for registration)
Venue:Room 402abc, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 402abc會議室
Theme: A.I. Solutions Shaping Future Facilities​ / 新世代廠房設施之人工智慧解決方案 
Outline: 

第四次工業革命最近在技術進化的地平線上爆發式地點燃了人工智慧(AI)之應用。 許多人一定對[人工智慧能為智慧廠房設施做什麼?]感到好奇。 2019年高科技設施國際論壇旨在將邀請 IBM 和 nVidia 的前瞻願景家與其他全球專家齊聚一堂,討論如何在世界上最先進的智慧廠房中引入實施人工智慧(AI)。

隨著每一代新智慧廠房的興建和營運,都會發展出更先進的人工智慧,並提供半導體製造持續提昇改進之廣闊基礎。 當其結果變得可行且明顯時,這就有迫切的需要去多加瞭解人工智慧道理,並務實地實施其技術,俾以提昇高科技廠房設施之智慧化。 今年的論壇旨在向與會者提供最新的人工智慧的應用和其趨勢。

論壇將提供即時的中英文口譯服務。 演講者和座談與會者,將以行業領導者與前瞻研究員和供應廠家代表,同臺相謀的形式分享他們在應用人工智慧及其他需求之最新發現。借此形式,它使業主,廠家和學者得以直接誠摯地公開溝通,來共同協力解決新興的問題。 歡迎各界人士前來參加。

 

 

 
 

早鳥價
(7/10-8/30)

原價
(8/31-9/20)

NTD 4,200 NTD 4,600

*Tax Included

 
 
高科技廠房設施貴賓晚宴
Time : 18:00 - 21:00 
Venue:Ballroom, 3F, TaiNEX 1 / 台北南港展覽館一館 3樓 燴館宴會廳

 

早鳥價
(7/10-8/30)
原價
(8/31-9/20)
NTD 3,200 NTD 4,200

*Tax Included    

 
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

View Full Agenda
Special Features 402abc 會議室/ 南港展覽館一館四樓 Thursday, September 19
8:30am to 5:30pm
Special Features 攤位號#L0100a, 南港展覽館一館四樓 Thursday, September 19
12:20pm to 1:30pm
Special Features 宴會廳 A Room / 南港展覽館一館三樓 Thursday, September 19
5:30pm to 9:00pm
Smart Manufacturing Forum 401 會議室/ 南港展覽館一館四樓 Wednesday, September 18
1:00pm to 4:55pm

Date:Wednesday, September 18th, 2019
Time:13:00 - 16:55 (13:00-13:30 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室
Theme: Leading the New Era of Intelligent Manufacturing with AI, Big Data & Cloud
Outline: We are in the way towards Industrial 4.0, which requires Smart Manufacturing technologies and applications to achieve our digital transformation goal.
In this forum, we will provide development strategy, best known practice, and solutions from the perspectives of fab owner, equipment makers, solution providers, and IC design house.

 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 2,000 NTD 2,500 NTD 2,000 5人以上再享9折

*Tax Included

 
 
Sponsored by:

 

   
                          
                                
 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
       
       

 

View Full Agenda
Special Features 401 會議室/ 南港展覽館一館四樓 Wednesday, September 18
1:00pm to 4:55pm
Sustainable Manufacturing and Circular Economy Forum 505ab 會議室/ 南港展覽館一館五樓 Wednesday, September 18
12:40pm to 5:00pm

Date:Wednesday, September 18th, 2019 
Time : 12:40 – 17:00 (12:40-13:00 for registration)
Venue:Room 505ab, TaiNEX 1 / 台北南港展覽館一館 5樓 505ab會議室 
Theme :  Energy Conservation and Risk Management for Sustainable Manufacturing

Outline :

In conjunction with SEMICON Taiwan 2019, the Sustainable Manufacturing Committee of SEMI Taiwan is organizing an event to provide insights on the latest products and technologies, regulations, technical standards, business continuity plan (BCP), business continuity management (BCM), energy conservation, circular economy and cyber security.

The Sustainable and Circular economy Forum will showcase the expertise and capabilities of companies and speakers from around the word by addressing a wide variety of energy conservation and risk management issues for high tech sustainable manufacturing. The topics includes environmental protection, BCP/BCM, energy conservation, circular economy, occupational health and safety, information and operation security which affect sustainable manufacturing.

 

早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

*Tax Included

 

 

Sponsored by:

     

 

 

    * Forum agenda is subject to change    

 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

   

 
View Full Agenda
Special Features 505ab 會議室/ 南港展覽館一館五樓 Wednesday, September 18
12:40pm to 5:00pm

聯絡人
SEMI Taiwan
李小姐 Lily Lee
TEL: 886.3.560.1777 EXT. 509
Email: llee@semi.org

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