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半導體材料技術論壇

日期:

2017 年 9 月 13 日 (星期三)

時間:

10:00 - 17:10 (10:00 - 10:25 為報到時間)

地點:

中信企業總部三樓雅悅會館翡儷廳

主題:

以「整合性材料供應生態系統」來達成先進半導體製造解決方案的目標

 

 論壇主席: 

Mr. Ming-Te Chen / 陳明德, Deputy Director, TSMC / Chairman, SEMI Taiwan Materials Committee

 論壇主持人: 

Mr. Andy Tuan / 段定夫, Managing Director, Linx Consulting (USA) / Consultant of SEMI Materials Committee

Dr. S. H. Chou/ 周書華, Engineer, TSMC

Mr. Mark Thirsk, Managing Partner, Linx Consulting

 論壇大綱:

 

  材料在推動半導體製造技術進步中扮演越來越重要的角色。 為了應對這一發展趨勢,半導體材料用戶和供應商需要密切合作,共同克服包括新材料創新,成本效益,製程功能控制,品質管理以及環安衛法規遵從等各種新挑戰。 在這個論壇上,來自世界各地參與半導體材料價值鏈的演講者將分享技術,產品,市場和業務管理的最新趨勢與觀點。 同時他們也將提出對以密切協作來實現創新,品質,成本和可持續發展等多元目標之”整合性材料供應生態系統”的見解。 同時這個半天的論壇將是與半導體材料界專家代表們進行交流的絕佳活動,我們熱忱歡迎您的光臨。

 

 

主辦單位:

 

 

 

 

 

 

 

 

 

贊助單位:

 
 
         

議程表

議程表

時間

講題/講者

10:00 - 10:25

 Registration

10:25 - 10:35

 Welcome Remarks by SEMI Executives

 Mr. Tom Salmon, Vice President of Collaborative Technology Platforms, SEMI

 Opening Remarks & Moderator

 Mr. Min-Te Chen / 陳明德, Deputy Director, TSMC / Chairman, SEMI Taiwan Materials Committee

 Mr. Andy Tuan / 段定夫, Managing Director, Linx Consulting (USA) / Consultant of SEMI Materials Committee

10:35 - 11:00

 Topic 1: Advanced Materials Innovation Enabling 7nm and Beyond

 Speaker: Dr. Montray C. Leavy, Deputy CTO, Entegris

11:00 - 11:25

 Topic 2: Multidimensional Collaborations within the Semiconductor Eco System for Materials Innovations: Rewards and Challenges

 Speaker: Dr. Ravi Kanjolia, CTO, Head of RD, Merck

11:25 - 11:50

 Topic 3: Glass-Based Solutions Addressing Key Trends in IoT, Consumer Electronics and Semiconductors

 Speaker: Mr. David R. Velasquez, Vice President and Director of Precision Glass Solutions, Corning

11:50 - 13:15

 Lunch Break

13:15 - 13:20

 Opening Remarks

 Dr. S. H. Chou/ 周書華, Engineer, TSMC

13:20 - 13:45

 Topic 4: Material Challenges & Opportunities in Semiconductor Value Chain

 Speaker: Dr. Ashutosh Misra, CTO, Air Liquide

13:45 - 14:10

 Topic 5: With Jumping Evolution of Materials to Accelerate the Generation Change of Semiconductor Industry

 Speaker: Dr. Chien-Yung Ma / 馬堅勇, Chairman, Solar Applied Materials 

14:10 - 14:35

 Topic 6: Advanced CMP For Next Generation BEOL Integration

 Speaker: Dr. Ming-Shih Tsai / 蔡明蒔, Senior Scientist, Versum Materials

14:35 - 15:00

 Topic 7: Leading Edge Packaging Solution Powered by Open Innovation,  Material clustering and JOINT Project

 Speaker: Dr. Toshhisa Nonaka / 野中敏央, Technical Director, Hitachi Chemical

15:00 - 15:25

 Topic 8: The New 28Si-lk Road:  Challenges and Opportunities in China for Electronic Material Suppliers

 Speaker: Ms. Candice Fan / 范淑珍, Global Strategic Sourcing Manager, Linde Electronics

15:25 - 15:50

 Topic 9: Novel glass for semiconductor packaging in the field of Fan-out WLP/PLP Process and 3D packaging

 Speaker: Mr. Toshihisa Okada / 岡田利久, manager, AGC

15:50 - 16:10

 Break

16:10 - 17:10

 Panel Sessions:

 Moderator: Mr. Mark Thirsk​, Managing Partner, Linx Consulting

 Session 1 - Company Introduction (5 minutes for each panelist)

 Panelist 1: Dr. Joe Wu/ 吳宗禧, Deputy Director, TSMC

 Panelist 2: Dr. Austin Chen/ 陳嘉平, Managing Director of Asia Pacific, Avantor

 Panelist 3: Dr. Hsing-Chia Wang/ 王興嘉, Director, LCY Chemical

 Session 2 - Panel Discussion -  All Panelists and Invited Forum Speakers

17:10

 Adjournment

■ 主辦單位保留議程更改之權利。

■ 論壇演講內容皆以英文為主。

■ 論壇全程禁止錄音/攝錄影。

 

論壇費用 (個人)

早鳥 / 會員價

原價 (8/16 - 現場)

       2400

3000

(幣別:台幣)

 

團體報名  (7/15 - 8/15)

3 - 5人

6人以上

2100

1800

(幣別:台幣)

       
               
       
               
         

 

 


聯絡人

SEMI Taiwan

羅家宇 小姐

電話:886.3.560.1777 分機 511

Email:semiprogramtw@gmail.com

 

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