Programs Catalog

>> 2019年資訊持續更新中！

2018 系統級封測國際高峰論壇 – 第二天

SiP 中信企業總部三樓雅悅會館馥儷廳 Friday, September 07

8:30am to 4:20pm

Date： Friday, September. 07, 2018
Time：08:30-16:20
Venue：Grand Ballroom, 3F, Grand Luxe Banquet, CTBC Financial Park
Theme：Future Package and Test for Smart Integration
Forum Chairman：
• Dr. Yu-Po Wang/ 王愉博, Sr. Director, SPIL
• Dr. Cheng-Wen Wu/ 吳誠文, Distinguished Chair Professor, NTHU

Outline:

AIOT, 5G and Networking will make our live better, and that all need small form factor, high density of system package and high performance computing packaging technologies!

In this session, Discovered Heterogeneous Integration Roadmap(HIR), Package Industries Status and Future Trend, GPU Computing for Semiconductor Design and Manufacturing, chip with TSV Market and Technology Outlook, and it will also include positioning of the TSV solutions.The heterogeneous integration to systems in package (SiPs) is driven by various applications, and this session will show different integration approaches for both thermal bonding and hybrid bonding. Another key is Test and Diagnosis for System Level Package, Fine Pitch Memory, Automotive, ADAS and High Density Fan-Out technologies!

■ Session Focus:

● Future Market and Heterogeneous Integration Trend!

● Advanced Packaging Technologies 2.5D & 3D IC, Fan-Out Solutions, MCM Stacking and SiP for AIOT, Automotive and HPC Applications.

● Test and Diagnosis for High Density Siliconand High Density System Integration with Service Model Migration.

早鳥價	原價
NTD 4,800	NTD 6,000

*Tax Included

*Forum agenda is subject to change

Sponsored by:

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2018 台灣平坦化論壇

CMP Room 504b Friday, September 07

9:00am to 12:00pm

日期：2018 年 9 月 7 日(星期五)
時間：9:00 - 12:00
地點：台北南港展覽館1館5樓 504b

主辦單位： MPUGTW

詳細報名資訊請點選以下連結：

http://www.cmpug.org.tw/signon_detail.php?id_c2=21&act=ok&date_index=c20180625100627

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2018 系統級封測國際高峰論壇-第一天

SiP 中信企業總部三樓雅悅會館馥儷廳 Thursday, September 06

8:00am to 4:50pm

Date: Thursday, September 6th, 2018
Time: 08:00-16:50
Venue：Grand Ballroom, 3F, Grand Luxe Banquet, CTBC Financial Park
Theme: Wafer Level System Integration for Edge Computing, HPC and AI
Forum Chairman: Dr. Douglas Yu/ 余振華, Vice President, TSMC
Moderator: Dr. K.C. Yee/ 余國寵, Director, TSMC
Outline:

Mobile, high-performance computing (HPC), automotive and internet of things (IoT) have been identified as four main growth engines for semiconductor industry. While artificial intelligence (AI) and 5G technologies are the key drivers boosting aforementioned application growths.

The pace of innovation is accelerating to meet ever-increasing diversification. Ubiquitous computing emerges from science fiction into a daily life reality in recent years, in part by handheld mobile computing, and in part by growing popularity of personal wearable devices, inescapable sensors, and by upcoming 5G enablement with affordable cost. On the other end of computing spectrum, machine learning (ML), artificial intelligence (AI) have become key drivers in cloud and high performance market. According IDC 2017, the global data traffic will grow rapidly from 16 ZB in 2016 to 163 ZB in 2026, a 10X growth in 10 years. System architects are hungry for higher performance computing and wider data pipelines to meet such explosive demands.

Foundry wafer level system integration (WLSI) leads the semiconductor industry into a new era of system scaling beyond Moore's Law with two golden examples of technology platforms. One is high density integrated fan-out (aka InFO_PoP) in smartphone and the other is silicon interposer, 3D chip stacking (aka CoWoS®) in HPC, ML, and AI. Adoptions of high density WLSI technologies in application-specific systems like intelligent mobiles, smart networks, 5G AIP (antenna in package), and HPC & AI with a larger Si interposer size, more HBM cubes, higher TDP advanced SoC, and optical interconnects become an unstoppable trend.

In this forum, speakers from leading fabless design, foundry, HBM house, EDA tools, market analysis, optical interconnect, and process tool supply will share their insights and vision. Audience would benefit from this forum with the followings

• Advanced WLSI technologies

• Market opportunity and landscape

• Novel enablement tools, materials, and processes

Early-Bird	Regular
NTD 4,800	NTD 6,000

* Tax Included

* Forum agenda is subject to change

Sponsored by:

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AIOT 時代的驅動力 – 半導體應用發展論壇

IoT Room 402ab Wednesday, September 05

12:50pm to 4:10pm

日期：2018年9月5日 (星期三)
時間：13:20-16:10 (12:50-13:20 報到)
地點：台北南港展覽館1館4樓 402ab

指導單位:

主辦單位:

協辦單位:

大綱：

正當人們對AI的記憶還停留在Google AlphaGo對抗人腦的新聞時，AI已經在2018年實質進入手機、醫學、機器人、智慧城市等各領域商業應用。市場研究機構賽迪指出，人工智能已達到從實驗室走入真實生產環境和日常生活的地步。該研究院預計，今年全球AI市場規模將達到3,272億元，年增長17%。AI應用已經目不暇給，而更重要的是IoT，區塊鏈（Blockchain）等技術與AI之鏈結，讓AI在Smart City、IIOT、無人載具、FinTech等應用外更具有想像空間。而在AI商機中，其中最關鍵，且台灣可扮演重要角色的，正是台灣所擅長的半導體產業。適逢中美貿易大戰的同時，台灣相關業者的機會與挑戰更是值得深思。

台灣物聯網產業技術協會(TwIoTA)整合六大專業委員會(半導體、車聯網、智慧及精準醫療、智慧安全、智慧工業、AI及大數據)的陣容，舉辦一場半導體在 AI的機會與應用研討會，主要會以跨領域/跨界的合作應用為重點，透過實際案例的分享，讓半導體業界能在 AI 及 IOT 的應用上，準確擬定更具體及明確的方向，並贏得商機。

早鳥價	原價
免費	免費

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IC60 大師論壇

Keynotes & Executive Panels 南港展覽館4樓大師論壇舞台區 Wednesday, September 05

8:20am to 5:00pm

>> 2019年資訊持續更新中！

*本論壇402c直播座位已額滿，將於南港展覽館一樓K區開放直播，歡迎多加利用！

Date：Wednesday, September. 05, 2018
Time：08:20 - 17:00 (08:20 - 08:50 for registration)
Venue：Master Forum Stage, 4F, Hall 1, Taipei Nangang Exhibition Center/ 台北南港展覽館一館 4樓大師論壇舞台區 (攤位號：M1156)
Theme：Future Starts Here

共同主辦: MOST科技部

Outline:

本次論壇活動由科技部與 SEMI Taiwan 共同合作，搭配 SEMICON Taiwan 2018 首日活動共同舉行。透過回顧過去-展望未來的論壇主軸規劃，上午邀請對IC發展歷程有卓越貢獻的大師前輩分享經驗及傳承，下午則討論半導體新興發展領域相關議題，藉由論壇點燃更多的青年學子對科技的熱情。

早鳥價	原價
Free	Free

*Tax Included

* Forum agenda is subject to change

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Meet the Expert : Work in SCREEN

Career Trend in Semiconductor Industry 台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016) Thursday, September 06

10:20am to 1:00pm

日期：2018年9月6日星期四

時間：10:20 - 11:00

地點：台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016)

＊此講座以中文進行

＊主辦單位保有臨時變動講師與議程的權利

特別感謝：

贊助商 :					合作夥伴 :

3人以上即可團報,團報請按"立即報名"下載團報資料表，完成表格請寄至semi.workforce@gmail.com 即可完成報名。

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MEMS & Sensors論壇

MEMS & Sensors Room 401 Thursday, September 06

8:30am to 3:35pm

Date：Thursday, September. 06, 2018
Time：08:30 - 15:35 (08:30 - 09:00 for registration)
Venue：Room 401, Hall 1, Taipei Nangang Exhibition Center/ 台北南港展覽館一館 4樓 401會議室
Theme：IoT – From Concept to Reality
Forum Chairman：Mr. H.C. Tuan/ 段孝勤, Director, TSMC/ Chairman, SEMI Taiwan MEMS & Sensors Committee
Forum Vice Chairman：
• Mr. Giuseppe Izzo/尹容, Managing Director of STMicroelectronics Taiwan, Vice President of APAC Region, STMicroelectronics/Vice Chairman, SEMI Taiwan MEMS & Sensors Committee
• Dr. Weileun Fang / 方維倫, Distinguished Professor, PME Dept./NEMS Institute, NTHU/ Vice Chairman, SEMI Taiwan MEMS & Sensors Committee
• Mr. Shao-Pin Ru/ 呂紹萍, President, Tong Hsing/ Vice Chairman, SEMI Taiwan MEMS & Sensors Committee

Co-Organizer: MEMS & Sensors Industry Group

Outline:

2018年SEMICON Taiwan的MEMS & Sensors論壇主題為「物聯網的新世界 - 由概念到實現」。本論壇將提供目前物聯網成功實踐的領域、以及其上中下游的產業鏈結，包含物理層(感知)、邊緣運算、無線通訊(5G)、雲端、大數據、以及人工智慧。物聯網已非早期空泛的名詞，而是如火如荼正在發生的事實。人類正見證一個全新的物聯網世界，也因為人工智慧的強勢崛起而使得物聯網可以更快速走入你我的生活之中，而這僅僅是個開端！台積電已預測物聯網將成為全球半導體產業成長的四大驅動引擎之一。這個物聯網世代的快速普及主要來自於多樣與高性價比之微型感測器、以及具備創新功能的微感知系統。因此傳統的工業、商業、市場模式、甚至是人類生活樣貌都將迅速改變。本年度的論壇期望能帶給與會嘉賓一窺我們在物聯網世界的挑戰與機會，我們邀請來自全球微機電/感測器旗艦級公司，分享從手機、無人機、麥克風、醫療設備等應用面的趨勢，作完整、精彩的剖析。誠摯歡迎您的蒞臨與指導！

早鳥價	原價
NTD 1,800	NTD 2,250

*Tax Included

* Forum agenda is subject to change

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SEMI HTU 成長營 - 第一天 (邀請制)

SEMI HTU Program - Day 1 台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016) Wednesday, September 05

1:30pm to 4:00pm

日期：2018年9月5日星期三

時間：13:30 - 16:00

地點：台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016)

＊主辦單位保有臨時變動講師與議程的權利

特別感謝：

贊助商 :					合作夥伴 :

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SEMI HTU 成長營 - 第二天 (邀請制)

SEMI HTU Program - Day 2 台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016) Thursday, September 06

1:30pm to 4:00pm

日期：2018年9月6日星期四

時間：13:30 - 16:00

地點：台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016)

＊主辦單位保有臨時變動講師與議程的權利

特別感謝：

贊助商 :					合作夥伴 :

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Women in Tech 座談會

Women In Tech Panel Discussion 台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016) Friday, September 07

10:10am to 11:10am

日期：2018年9月7日星期五

時間：10:10 - 11:10

地點：台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016)

＊此講座以中文進行

＊主辦單位保有臨時變動講師與議程的權利

＊敬請點入講師名稱參考更詳細講師介紹與照片

特別感謝：

贊助商 :					合作夥伴 :

3人以上即可團報,團報請按"立即報名"下載團報資料表，完成表格請寄至semi.workforce@gmail.com 即可完成報名。

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先進半導體檢測(計量)國際論壇

Test Room 504a Friday, September 07

8:30am to 4:15pm

日期：2018年9月7日 (星期五)
時間：08:30-16:15 (08:30-09:00 報到)
地點：台北南港展覽館1館5樓 504a

Organized by

早鳥價	原價
免費	免費

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先進封裝技術論壇

Advanced Packaging 中信企業總部三樓雅悅會館馥儷廳 Tuesday, September 04

8:30am to 6:30pm

Date：Tuesday, September. 04, 2018
Time：8:30 - 18:30 (08:30 - 09:00 for registration)
Venue：Grand Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang, Taipei
Theme：Innovative Leadership for 3D-SiP Advanced Packaging Technology
Forum Chairman： Mr. Albert Lan/ 藍章益, Global Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee
Forum Moderator：
• Mr. Albert Lan/ 藍章益, Global Packaging TD, Applied Materials / Vice Chairman, SEMI Taiwan PKG&TEST Committee
• Ms. Kim Arnold, Executive Director, Advanced Packaging Business Unit, Brewer Science

Outline:

New application markets, such as Networking, AI, Autonomous Car, 5G, and IOT/Wearable are enabling a new vision era of advanced packaging technologies, including SiP, Fan Out, 3DIC, and 2.5DIC, and also initializing some innovative Equipment & Material, and CtW/WtW Hybrid Bonding solution developments.

To address equipment & material solutions for advanced packaging technology, the forum have invited lots of experts from Fabless design house, IDM, Foundry, Packaging, Equipment and Materials suppliers to share their treasure experiences on future technology development roadmap, challenges, and packaging solutions.

■ Forum focal points:

● Addressing on advanced packaging technologies, including SiP, Fan Out, 3DIC and 2.5DIC
● Addressing innovative Equipment, Materials, and CtW/WtW Hybrid Bonding technology solutions.

■ Forum will deep dive:

I. Research and market trends of latest new applications

II. System and product applications

III. Innovative packaging technology challenges and solutions

IV. Novel material & equipment solution readiness

Early-Bird	Regular
NTD 4,800	NTD 6,000

* Tax Included

* Forum agenda is subject to change

Sponsored by:

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功率電子暨光電半導體技術論壇

Power & Optoelectronics Semiconductor Room 402ab Friday, September 07

8:20am to 4:20pm

Date：Friday, September 07, 2018
Time：8:30 - 16:40 (08:30 - 08:55 for registration)
Venue：Room 402ab, Hall 1, Taipei Nangang Exhibition Center

Forum Chairman：

　‧ Mr. Brian Lee/ 李宗鴻, CSO, Win Semiconductors/ Co-Chairman of SEMI Taiwan Power and Compound Committee
　‧ Dr. Herman Chang/ 張育銘, General Manager, Energy Infrastructure Solution BG, Delta Electronics/ Co-Chairman of SEMI Taiwan Power and Compound Committee

Forum Vice Chairman：

　‧ Dr. Yi-Cheng Cheng/ 程一誠, General Director, NCSIST/ Vice Chairman of SEMI Taiwan Power and Compound Committee

　‧ Mr. Andy Chuang/ 莊淵棋, President, Episil/ Vice Chairman of SEMI Taiwan Power and Compound Committee

　‧ Barry Lin/ 林嘉孚, CTO, Wavetek/ Vice Chairman of SEMI Taiwan Power and Compound Committee

Session 1
Theme：Wide Band Gap Power Electronics
Outline:
A growing population and changes in life style will increase the demand for energy consumption in various segments including consumer, enterprise, industrial and e-mobility. The needs for more efficient and advanced energy systems are very clear trends. Because semiconductor has the advantage to process energy in micro-electronic way, it can effectively make power electronics systems to be much smaller, lighter, reliable and efficient, while being capable of operating at higher temperatures. While Si-based semiconductors will remain relevant, wide band gap devices based on SiC and GaN will be the main drivers in achieving a significant leap in performance due to their higher breakdown voltages, higher electron mobility and higher thermal conductivity. To bring up the most recent advances into perspective, the forum will address manufacturing and process technologies for wide band gap devices, as well as discuss new design approaches to reap the benefits of using new devices in modern applications such as e-mobility.

Session 2
Theme: 3D Sensing, VCSEL, LiDAR, MicroLED
Outline:
Recently, the application of VCSEL to 3D sensing of facial recognition in i-phone X spurred a hype in consumer market. It provides a flexible biometric verification and promises a broad spectrum of security application. The use of VCSEL in LiDAR enables autonomous vehicle technology and creates a potential huge market for optoelectronics. Similarly, Samsung’s debut of its most premium TV using MicroLED in 2018 CES show drew a lot of attention. It paves a way for a very promising new display technology.
These are just some vivid examples of today’s optoelectronics applications which will change our daily life in years to come.

Early-Bird	Regular
NTD 3,200	NTD 4,000

* Tax Included

*Forum agenda is subject to change

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半導體先進製程科技論壇

AI Room 401 Friday, September 07

8:30am to 4:25pm

Date：Friday, September. 07, 2018
Time：8:30 - 16:25 (08:30 - 09:00 for registration)
Venue：Room 401,Taipei Nangang Exhibition Center, Hall 1
Theme：The AI Era – A Big Thing in Semiconductor Industry
Forum Chairman：Dr. John Lin/林進祥, Director, TSMC/ Chairman, SEMI Taiwan IC Committee
Forum Vice Chairman:
• Mr. Rutgers Chow/周雷琪, President of SPTS Asia, SPTS Technologies/ Vice Chairman, SEMI Taiwan IC Committee
• Mr. G.C. Hung/ 洪圭鈞, Vice President, UMC/ Vice Chairman, SEMI Taiwan IC Committee

Forum Moderator：
• Ms. Mavis Ho/ 何玫玲, Head of Strategic Partnership, Taiwan and Singapore, imec / SEMI Taiwan IC Committee
• Mr. Samuel Chiu/ 邱興邦, Technical Director, Applied Materials Taiwan/ SEMI Taiwan IC Committee

Theme: The AI Era – A Big Thing in Semiconductor Industry
Outline:

人工智慧是人類長久以來的夢想，憑藉著演算法的創新與強大的運算能力，人工智慧的應用已如光速般飛快的影響我們的生活，並帶來巨大的變革。也引領半導體業界，正式迎向人工智慧時代的到來。

演算法猶如人工智慧的靈魂，而IC晶片就像強力的心臟，成功推動人工智慧在汽車、機器人、零售及醫療等等的各種應用。從泛用到專用的人工智慧晶片，藉由半導體科技的樞鈕整合，促成了人工智慧在計算與消費電子的各種發明及長足進展。

面對未來的挑戰與機會，IC設計與製造早已拓展各式應用。諸如Application Processors (APUs) ，Image Sensors，Wireless Communication Chips，GPU與TPU (Tensor Processing Units) 等等，都成為人工智慧不可或缺的元素。同時間High-Performance Computing (HPC)，Internet of Things (IoT)，Machine Learning (ML)，Virtual Reality (VR)與 Augmented Reality (AR)等相關技術的蓬勃發展，也預示著人工智慧對人類與其經濟活動的驚人影響及無窮潛力，並在不久的將來，躍升為一個兆元級的產業。

今年適逢IC六十週年，半導體先進製程科技論壇將邀集各領域的菁英與專家，針對人工智慧與半導體相關發展的現況、應用及展望，與諸位先進分享及研討，共同迎向人工智慧時代，為下一個未來六十年，奠立嶄新科技的里程碑。

早鳥價	原價
NTD 3,200	NTD 4,000

* Tax Included

* Forum agenda is subject to change

Sponsored by:

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半導體市場趨勢論壇

Market Trend Room 401 Wednesday, September 05

1:00pm to 4:30pm

Date：Wednesday, September. 05, 2018
Time：13:00 - 16:30 (13:00 - 13:20 for registration)
Venue：Room 401, Hall 1, Taipei Nangang Exhibition Center/ 台北南港展覽館一館 4樓 401會議室

Outline:

After a record-breaking in 2017, will the surge continue?
The demand from artificial intelligence, cloud, and IoT for semiconductor products is expected to have greater impact on revenue in 2018 compared to prior years. And we expect to portray the current and future scenario of all the segments of semiconductor industry on a global level.

早鳥價	原價
NTD 2,000	NTD 2,500

*Tax Included

* Forum agenda is subject to change

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半導體智慧製造論壇

SMART Manufacturing Room 504bc Wednesday, September 05

1:00pm to 5:00pm

Date：Wednesday, September 5, 2018
Time：13:00 - 17:10 (13:00 - 13:15 for registration)
Venue：Room 504bc, Hall 1, Taipei Nangang Exhibition Center/ 台北南港展覽館一館 5樓 504bc會議室
Theme：Toward Intelligent Manufacturing with AI
Forum Chairman： Mr. Robert Chien/ 簡明正, Deputy Director, TSMC/ Chairman of SEMI Taiwan Smart Manufacturing Committee
Forum Vice Chairman：
• Mr. James Lin/ 林京沛, Deputy Division Director, UMC/ Vice Chairman of SEMI Taiwan Smart Manufacturing Committee
• Dr. Jimmy Chen/ 陳俊銘, Senior Director, ASE/ Vice Chairman of SEMI Taiwan Smart Manufacturing Committee

共同主辦: MOST科技部

Outline:

智慧製造牽涉複雜的製程、利害關係人、以及資訊與溝通技巧，成為現今台灣大部份製造業者共同面臨的挑戰。企業組織與創新技術領導者，勢必要透過結構與數位平台的設計，藉由資訊科技整合AI與客戶、合作夥伴、生態，建構商業與製造的智慧化、自動化。

早鳥價	原價
NTD 2,000	NTD 2,500

*Tax Included

* Forum agenda is subject to change

View Full Agenda

半導體材料技術論壇

Materials 南港展覽館4樓大師論壇舞台區 Thursday, September 06

8:30am to 4:35pm

Date：Thursday, September. 06, 2018
Time：08:30 - 16:35 (08:30 - 09:00 for registration)
Venue：Master Forum Stage, 4F, Hall 1, Taipei Nangang Exhibition Center/ 台北南港展覽館一館 4樓大師論壇主舞台
Theme：Intelligent Material Clouds
Forum Chairman： Mr. Min-Te Chen/ 陳明德, Deputy Director, TSMC/ Chairman of SEMI Taiwan Materials Committee
Forum Vice Chairman：
• Dr. Joe Wu/ 吳宗禧, Deputy Director, TSMC/ Vice Chairman of SEMI Taiwan Materials Committee
• Dr. Jeffrey Yang/ 楊秉豐, Senior Department Manager, ASE/ Vice Chairman of SEMI Taiwan Materials Committee
• Mr. Brian Chen/ 陳致遠, Vice President, Wah Lee/ Vice Chairman of SEMI Taiwan Materials Committee

Outline:
As many new downstream technology applications (like cloud computing, big data analytics, AI, IOT, Autonomous Driving, AR/VR, 5G..) emerge to demand for more powerful and smarter devices from semiconductor supply chain in order to enable a more digitalized and connected world for the mankind, the upstream materials industry needs to cope with these new development trends and adopt more intelligent materials management systems to address increasingly complex and challenging requirements demanded by the semiconductor fabs such as novel materials innovations, robust supply chain management, green chemistry development, end-to-end quality control, total cost of ownership, social responsibility and sustainability…etc. in a fully integrated manner. Each integrated and intelligent materials management system can be considered as a "materials cloud" which virtually administrate one of the most critical fab operation issues on a 24/7 basis.
Looking forward, we envision each self-performing and fully localized materials cloud can closely connect vendors from the supply side and fab users from the demand side to build a highly collaborative community. Collectively all clouds form a seamless network of clouds to become a comprehensive global materials ecosystem which continues to act as a strong foundation to support sustainable growth of the semiconductor industry in the future.
In this one-day forum, speakers from around the world involved in semiconductor materials value chain will share insights of the latest technologies, market trends and products solutions.

早鳥價	原價
NTD 2,500	NTD 3,125

*Tax Included

* Forum agenda is subject to change

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合作單位論壇

Wednesday, September 05

10:00am to 4:00am

>> 2019年資訊持續更新中！

論壇名稱

時間

地點

AIOT 時代的驅動力 – 半導體應用發展論壇

9月5日

台北-南港展覽館 4樓

2018台灣平坦化論壇

9月7日

台北-南港展覽館 5樓

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市場資訊論壇

Wednesday, September 05 10:00am

>> 2019年資訊持續更新中！

論壇名稱

時間

地點

IC 60大師論壇

9月5日

台北-南港展覽館 4樓 Master Forum Stage (#M1156)

半導體市場趨勢論壇

9月5日

台北-南港展覽館 4樓

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循環經濟論壇

Circular Economy Room 504c Friday, September 07

9:30am to 4:30pm

日期：2018年9月7日 (星期五)
時間：09:30-16:30 (09:30-09:50 報到)
地點：台北南港展覽館1館5樓 504c

早鳥價	原價
免費	免費

主辦單位 Organized by
贊助單位 Sponsored by

* Forum agenda is subject to change

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技術趨勢論壇

Tuesday, September 04 8:00am

>> 2019年資訊持續更新中！

論壇名稱	日期	地點
先進封裝技術論壇	9月4日	Grande Luxe Banquet Grand Ballroom / 中信企業總部三樓雅悅會館馥儷廳
半導體智慧製造論壇	9月5日	台北-南港展覽館 5 樓
系統級封測國際高峰論壇 2018 – 第一天	9月6日	Grande Luxe Banquet Grand Ballroom / 中信企業總部三樓雅悅會館馥儷廳
半導體材料技術論壇	9月6日	台北-南港展覽館 4 樓大師論壇舞台區
MEMS & Sensors論壇	9月6日	台北-南港展覽館 4 樓
高科技廠房設施國際論壇	9月6日	台北-南港展覽館 4 樓
雷射論壇	9月6日	台北-南港展覽館 4 樓
系統級封測國際高峰論壇 2018 – 第二天	9月7日	Grande Luxe Banquet Grand Ballroom / 中信企業總部三樓雅悅會館馥儷廳
半導體先進製程科技論壇	9月7日	台北-南港展覽館 4 樓
功率電子暨光電半導體技術論壇	9月7日	台北-南港展覽館 4 樓
高科技產業永續發展論壇	9月7日	台北-南港展覽館 5 樓
循環經濟論壇	9月7日	台北-南港展覽館 5 樓
先進半導體檢測(計量)國際論壇	9月7日	台北-南港展覽館 5 樓

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提升產業人才競爭力講座

Career Development Forum 台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016) Friday, September 07

1:00pm to 3:25pm

日期：2018年9月7日星期五

時間：13:00 - 15:25 (13:00 - 13:30 報到時間)

地點：台北南港展覽館一館 1樓人才培育特展舞台區 (攤位號：I3016)

＊此講座以中文進行

＊主辦單位保有臨時變動講師與議程的權利

特別感謝：

贊助商 :					合作夥伴 :

3人以上即可團報,團報請按"立即報名"下載團報資料表，完成表格請寄至semi.workforce@gmail.com 即可完成報名。

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數位醫療論壇 - 加速半導體與醫療跨界合作

SMART MedTech 中信企業總部三樓雅悅會館寶儷廳 Friday, September 07

9:00am to 12:00pm

日期：2018年9月7日 (星期五)
時間：9:00-12:00 (08:30-08:55 報到)
地點：中信企業總部三樓雅悅會館寶儷廳

*活動將以中文進行

Speakers:
	Long-Sheng Fan / 范龍生 CEO Iridium Medical Technology Company	Chung-Yu Wu / 吳重雨 Professor of Department of Electronics Engineering NCTU
	Ted Chang / 張嘉淵 CTO and Vice President Quanta	Yi-Shao Liu / 劉怡劭 Vice President Helios Bioelectronics Inc.
	Johnsee Lee / 李鍾熙 CEO Personal Genomics, Inc

Panelists:
	Alex Wang / 王其國 President Powerchip	Chii-Wann Lin / 林啟萬 General Director of Biomedical Technology and Device Research Labs ITRI
	Pan-Chyr Yang / 楊泮池 Chairman Taiwan Bio-Development Foundation	Dar-Bin Shieh / 謝達斌 Professor NCKU

Organzied by:
Co-organzied by:
Concurrent Events:

早鳥價	原價
免費	免費

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智慧汽車國際高峰論壇暨展示會

SMART Automotive 中信企業總部三樓雅悅會館寶儷廳 Tuesday, September 04

8:30am to 5:10pm

連結微電子及汽車產業探索更智慧、更安全、更節能的未來汽車趨勢與商機

由於汽車產業特殊的生態鏈及其對於電子零件安全與可靠性的嚴格要求，如何跨足車用電子，發展符合車用電子標準的製程與產品，已成為近年半導體產業最熱門的關鍵話題之一。有鑑於此，SEMI 將於今年 9 月 4 日舉辦「智慧汽車國際高峰論壇暨展示會」，邀請全球來自汽車及微電子產業的專家及意見領袖同台探究最新市場趨勢，帶領您一探通往未來智慧汽車的捷徑。

日期: 2018年9月4日星期二

時間: 08:55 – 17:10 (08:30-08:55 報到時間)

地點: 中信企業總部三樓雅悅會館寶儷廳 - 台北市南港區經貿二路166號A棟3樓 (中國信託金融園區)

主持人: 胡竹生-工業技術研究院機械與機電系統研究所所長；王傑智-工業技術研究院機械與機電系統研究所數位長

講者:

	Robert Brown Operations Manager, Taiwan Magna Electronics			Liu Jingxiu AI Market Director Xilinx
	Ram Shallom VP of Marketing & Business Development Autotalks			Alexandar Da Rocha Marketing Manager, Greater China & South Asia, Asia Pacific Region, Infotainment, Instrument cluster and ADAS STMicroelectronics
	Jacky Xian CEO SitechElectric Automobile			Louay Eldada CEO & Co-founder Quanergy
	Jun Pei CEO Cepton Technologies			Jérôme Azemar Technical Project Development Director Yole Développement
	Chih-Ming Hung Senior Director, Intelligent Automotive Business Unit MediaTek			Anthony Le Senior Director of Marketing Macronix
	Minatake Kashio Director Fomalhaut Techno Solutions			E. Jan Vardaman President and Founder TechSearch International, Inc.

主辦單位:

協辦單位:

頂級贊助:

金級贊助:

參展商:

價格:	SEMI會員早鳥價 :	NT$ 3,150
	非SEMI會員早鳥價 :	NT$ 4,200
	SEMI會員原價 :	NT$ 4,200
	非SEMI會員原價 :	NT$ 5,250
	學生票價 :	NT$ 2,100

(2018年8月24日更新)

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系統級封測國際高峰論壇

Tuesday, September 04 8:30am

>> 2019年資訊持續更新中！

論壇名稱	時間	地點
先進封裝技術論壇	9月4日 08:30 –18:30	Grande Luxe Banquet Grand Ballroom / 中信企業總部三樓雅悅會館馥儷廳
2018 系統級封測國際高峰論壇-第一天	9月6日 08:00 – 16:50	Grande Luxe Banquet Grand Ballroom / 中信企業總部三樓雅悅會館馥儷廳
2018 系統級封測國際高峰論壇-第二天	9月7日 08:30 – 16:20	Grande Luxe Banquet Grand Ballroom / 中信企業總部三樓雅悅會館馥儷廳

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貴賓聯誼午宴 (邀請制)

Friday, September 07 12:00pm

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雷射論壇

Laser Room 402c Thursday, September 06

1:00pm to 4:40pm

雷射技術已經貫穿整個半導體製造業，包含從前段晶圓製造、後段封裝測試甚至電路板、電子組裝及消費性電子產品，隨著輕薄短小的產品趨勢，以及半導體產業對於良率及產量提升需求及先進製程對於晶片質量、檢測的品質提高，雷射製造工藝、參數及類型與不同加工材料的互相搭配變得非常重要，國際半導體產業協會 SEMI持續在國際半導體展 SEMICON Taiwan 將雷射主題獨立出來，打造多元管道，如技術論壇、主題展示專區及聯誼小聚等來探討更多在半導體產業的應用需求。
本次論壇將邀請來自台積電及Amkor專家一起探討更多雷射技術應用於半導體晶圓級封裝的機會與挑戰，包含晶圓及晶粒切割 (wafer cutting and dicing)、下個晶片技術節點雷射技術需求、雷射微加工技術於低介電及硬脆材料晶圓、雷射隱形切割 (laser stealth dicing)等技術，歡迎業界先進共襄盛舉，參與更多技術分享與討論。

日期：2018年9月6日
時間：13:00 - 16:40 (13:00 - 13:40 for registration)
地點：台北南港展覽館一館4樓 402c
主題：How Laser Technologies can Better Support in Advanced Wafer Level Packaging?

主講嘉賓

Mr. Judge Li

Advanced Product Development Division

Mr. WM Chen

Vice Director

Dr. Y. J. Lai

Manager

贊助單位

Early-Bird	Regular
免費	免費

* 主辦單位保留變更議程與講師之權利

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電子系統設計產業聯盟貴賓酒會暨專題座談

ESD Alliance VIP Reception with Executive Panel 台北君悅飯店凱悅廳二區 Tuesday, September 04

5:50pm to 8:30pm

日期: 2018年9月4日星期二

時間: 17:50-20:30 (17:00-17:50 for registration)

地點: 君悅飯店凱悅廳二區 (110台北市信義區松壽路2號)

主持人:

Tzi-Dar Chiueh/ 闕志達

電機系教授

台灣大學

與談人:

Michael Shih/ 石豐瑜

全球副總裁暨亞太及日本區總裁

益華電腦

Danny Perng/ 彭啟煌

全球副總裁暨亞太區總裁

明導國際

David-RJ Lin/ 林榮堅

全球資深副總裁暨亞太總裁

新思科技

Chi-Feng Wu/ 吳奇峯

資深處長

瑞昱半導體

主辦單位 :

聯絡人: 蘇中原先生 / Tel: 886.3.560.1777 ext.289 / Fex: 886.3.560.1555 / Email: staiwan1@semi.org

＊主辦單位保留變更、終止活動及資格審核權

(2018年8月16日更新)

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高科技廠房設施國際論壇

High-Tech Facility Room 402ab Thursday, September 06

8:30am to 5:30pm

日期：2018 年 9 月 6 日(星期四)
時間：8:30 - 17:30 (08:30 - 09:00 報到註冊)
地點：台北南港展覽館1館4樓 402ab
主題：Effective Ways to Make Facility Smart-II 廠房智慧化之妙方(II)
論壇主席：莊子壽資深處長/台灣積體電路製造股份有限公司
論壇共同主席：曹世綸台灣區總裁/國際半導體產業協會
論壇榮譽主席：許金榮總經理暨營運長/漢民科技股份有限公司
主辦單位：SEMI高科技廠房設施委員會
協辦單位：臺大工學院嚴慶齡工業研究中心、臺大土木系高科技廠房設施研究中心

論壇網址：http://www.htftaiwan.org/semicon2018-2.html

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高科技產業永續發展論壇

Sustainable Manufacturing Room 504b Friday, September 07

12:40pm to 5:00pm

日期：2018 年 9 月 7 日(星期五)
時間：12:40 - 17:00 (12:40 - 13:10 報到)
地點：台北南港展覽館1館5樓 504b