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Programs Catalog

Programs Catalog

>> 2019年 資訊持續更新中!

Special Features 福軒廳 / 南港展覽館一館三樓 Tuesday, September 17
11:40am to 1:00pm
Special Features 504bc 會議室/ 南港展覽館一館五樓 Tuesday, September 17
8:30am to 4:40pm
Advanced Packaging, SiP Global Summit 馥儷廳雅悅會館/ 中信企業總部A棟三樓 Tuesday, September 17
8:30am to 5:50pm

 

Date:Tuesday, September 17th, 2019
Time:08:30 - 17:50 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: Heterogeneous Integration Packaging Technologies and Smart Manufacturing for 5G & AI  Applications

Forum Chairs:

  • Mr. Albert Lan, Global Packaging TD, Applied Materials/Vice Chairman, SEMI Taiwan Packaging & Testing Committee

Moderators:

Outline: 

  • 5G (with mm-wave transition features) can effectively enable AI life and can be realized by the packaging technologies, such as SiP, Fan Out, 2.5D/3D TSV, and CoW/WoWhybrid bonding.
  • To address product applications, and its equipment & material technology solutions in advanced packaging, the forum have invited lots of experts from Fabless design house, IDM, Foundry, OSAT, Equipment and Materials suppliers to share their treasure experiences on future technology development roadmap, challenges, and effective solutions.
  • Beside investing in packaging techniques advancement for integrated applications, the driving trend is also to integrate into a full system of high performance and functionality devices with smart manufacturing. The connected system in packaging world shall drive for yield performance excellence in high-tech manufacturing.

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折

*Tax Included

 
 
Sponsored by:
                 
                      
              

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
 

 

 

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SiP, SiP Global Summit Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳 Friday, September 20
8:30am to 4:40pm

Date:Friday, September 20th, 2019
Time:08:30 - 16:40 (08:30-08:55 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: Hybrid SiP Solutions of Heterogeneous & Homogeneous Integration

Forum Chair:

  • Dr. C.P. Hung 洪志斌, 副總經理, 日月光集團/ 主席, SEMI Taiwan封裝與測試委員會

Moderator:

  • Dr. C.P. Hung 洪志斌, 副總經理, 日月光集團/ 主席, SEMI Taiwan封裝與測試委員會
  • Dr. Shih-Chieh Chang 張世杰, 副所長, 工業技術研究院

Outline: 

With the dynamic development of various applications such as automotive, IoT, 5G and AI high performance computing, the ecosystem and manufacturing technology of semiconductor industry have also encountered major paradigm shift. In addition to scaling, another rising wave led by SiP (System in Package) is expanding the landscape of design, integrating options and advanced manufacturing technologies.  The hybrid SiP solutions of Heterogeneous and Homogeneous integrations combining logic, memory, sensors and other functional chips are groundbreaking and enabling all kinds of new applications.

Through SiP Global Summit Day 3 session, we will reveal the charm of HI double shots (Heterogeneous and Homogeneous Integration) from devices and manufacturing perspectives with speakers from chip, package and system such as NXP, MTK, ASE, Micron, Amkor and Mentor followed by an exciting cross-ecosystem panel discussion to further elaborate and enlighten the way to success with hybrid SiP solutions.

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折

*Tax Included

 
 

Sponsored by:

 

 

 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

 

View Full Agenda
SiP, SiP Global Summit 馥儷廳雅悅會館/ 中信企業總部A棟三樓 Thursday, September 19
8:15am to 5:00pm

Date:Thursday, September 19th, 2019
Time:08:15 - 17:00 (08:15-08:45 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: AI/5G-driven High Performance Computing, from Cloud to Edge

 

Forum Chair:

Moderator:

Outline: 

With the arrival of data-centric era, we are unconsciously immersed in and guided by ubiquitous data generation and processing in our daily life; from remote cloud, data centers, networks, to fleet of personal and sensing devices such as smartphone, wearables, visual monitoring, vocal controls, and smart surveillance. This spurs strong demands on semiconductor logics, memories, and wireless connectivity for data generation, storage, processing, and communication. To meet the escalating demands on data bandwidth and smart computing, the semiconductor industry has re-invented packaging and system integration technologies by providing cost effective solutions in all application domains.

While Moore’s Law transistor scaling continues, semiconductor market has evolved from device centric to data centric. To address market needs, system packages through heterogeneous integration has taken the driver’s seat and  propel system performances toward smart computing, wide data bandwidth, small form factor, with low or zero latency and energy efficiency. And all these are capped by ever better system cost per function as technology and product migrate from generation to generation.

In this forum, speakers from renowned academician, research institute, Design House, EDA tool, foundry, and manufacturing/materials suppliers are sharing their insights and visions. Audience would benefit from this forum to have an in-depth understanding on following subjects

  • Data centric high performance computing industry trends
  • System integration and packaging technologies
  • Chiplets integration: opportunity and challenges
  • Novel enablement ASIC, EDA, and manufacturing tools/materials

 

 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折

*Tax Included

 
 

Sponsored by:

 

 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

 

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Special Features 凱悅廳/ 台北君悅大飯店三樓 Wednesday, September 18
6:00pm to 9:00pm

科技菁英領袖晚宴跨界全球凝聚產業 年度最具前瞻視野的科技盛宴

SEMICON Taiwan 最具指標性的高階聯誼活動,每年邀請超過600位來自全球半導體業界之卓越企業家、高階經理人及關鍵決策者。

一同齊聚交流,促成跨國、跨領域的合作契機,成功幫助企業品牌行銷與形象提升。

提供一個交流聯誼平台,更希望藉由與會之產業領導者的力量,一起為產業永續發展而努力。

日期:2019年9月18日星期三
時間:18:00-21:00
地點:台北君悅大飯店 三樓宴會廳

*本活動採邀請制

 

 

主辦單位:        
協辦單位:          
白金級贊助:
       
金級贊助:        
銀級贊助:        

 

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Special Features 雅悅會館馥儷廳/中信企業總部A棟三樓 Tuesday, September 17
8:30am to 5:50pm
Special Features 雅悅會館馥儷廳/中信企業總部A棟三樓 Friday, September 20
8:30am to 4:40pm
Special Features 雅悅會館馥儷廳/ 中信企業總部A棟三樓 Thursday, September 19
8:15am to 5:00pm
Friday, July 26 11:30am
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Friday, September 20
8:30am to 11:30am

Date:Friday, September 20th, 2019
Time:08:30 - 11:30 (08:30-09:00 for registration)
Venue: FUTURE Stage, Booth #M1148, 4F, TaiNEX 1/ 台北南港展覽4樓  未來舞台區 攤位號 #M1148
Theme: Leap into the tech future

Outline:

Interested in a full update on the recent developments in the field of nanoelectronics? ITF Taiwan 2019  is your place to be.
Imec and SEMICON Taiwan invite you to the Taipei Nangang Exhibition Center, on September 20th  for a half-a-day program of exclusive insights into research and innovation topics such as advanced 3D scaling, silicon photonics, TDI and pixel imaging, quantum computing, and life sciences by renowned imec experts. Top-notch tech presentations to help you leap into the tech future.

Doors open at 8:30am.
Presentations from 9am till 11:30am
 

Make your visit to SEMICON Taiwan even more worthwhile!

 
 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
Organized by:
     
 

 

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Thursday, September 19
9:00am to 9:30am
SMART Transportation Wednesday, September 18
10:00am to 10:30am
明日領袖論壇 Friday, September 20
1:30pm to 1:40pm
Thursday, September 19
1:20pm to 1:30pm
Thursday, September 19
4:30pm to 5:00pm
Friday, September 20
2:20pm to 3:20pm
Friday, September 20
2:20pm to 3:20pm

-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Panelist: 
1.Ms. Grace Wang, Taiwan Sales General Manager, Intel  
2.Ms. Poling Liu , HR Director , ASML  
3.Mr. Roger Chang, Vice President, Tokyo Electornic Ltd. 
4. (Inviting) TSMC 

Moderator: 
Mr. Benson Cheng, COO, Deloitte Management Consultant 

View Full Agenda
Friday, September 20
8:30am to 9:00am
Special Features 攤位號#J3258, 高科技智慧製造未來展區/ 南港展覽館一館一樓 Thursday, September 19
2:30pm to 3:30pm
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
8:20am to 9:30am
Special Features 凱悅廳二區/ 台北君悅大飯店三樓 Monday, September 16
1:00pm to 3:15pm
Mr. Ian Smythe
終端產品事業部 市場行銷副總裁
Arm
Thursday, September 19
11:00am to 11:30am

Abstract of Presentation:

View Full Agenda
Thursday, September 19
3:40pm to 4:10pm
Thursday, September 19
4:35pm to 4:50pm
Dr. Eric Kuah
Vice President of Technology
先進太平洋股份有限公司
Thursday, September 19
10:40am to 11:10am

Abstract:

To form die bottom bonding and/or die top bonding for high power application the current state of art is to use different types of sintering material in particular silver dominated metal. We will discuss about newly developed sintering material and pressure sintering processes. In addition, we will discuss on the mechanism behind pressure sintering and the characterization of such sintered bond. The reliability of the sintered bond and bond quality are expound. A variant of results will be compare across different type of materials, which could provide insights to package designers for high-performance power electronics.

View Full Agenda
Thursday, September 19
11:10am to 11:40am
Friday, September 20
2:25pm to 2:50pm
Special Features 攤位號#K3276, TechXPOT / 南港展覽館一館一樓 Thursday, September 19
10:30am to 12:00pm
Advanced Testing Forum 505ab 會議室/ 南港展覽館一館五樓 Thursday, September 19
9:00am to 4:20pm

Date:Thursday, September. 19th, 2019
Time:09:00 - 16:20 (09:00-09:30 for registration)
Venue:南港展覽館一館5樓 505ab會議室
Theme: 5G & AI-assisted test
Forum Chairs:

  • Dr. Cheng-Wen Wu 吳誠文, 副校長, 國立成功大學/ 共同主席, SEMI Taiwan測試委員會
  • Mr. CJ Hsieh 謝承儒, 總經理, 英特爾創新科技/ 共同主席, SEMI Taiwan測試委員會

Forum Vice Chair:

  • Ms. Wendy Chen 陳文如, 協理, 京元電子/ 副主席, SEMI Taiwan測試委員會

Moderators:

Outline:

With the dynamic development of IC industry driven by applications like 5G, HPC, IoT, AI and Automotive; semiconductor testing faces major paradigm shift with the eager needs to develop new testing concept and capability to cope with the rising complexity of ICs and systems to ensure their reliability and safety.  5G technology, one of the most heated applications, challenges the entire testing ecosystem to develop new system level test methodology for accuracy and quality while at the same time to balance cost and time to volume.  And with the development of AI, testing data generated through design and manufacturing process has become one of the most valuable resources for industry to enhance their testing capability.    

To lead and to facilitate industry technology development on testing, the theme for the very first Advanced Testing Forum in SEMICON Taiwan will be “5G and AI-assisted Test”.  The forum will cover the perspectives from policy and infrastructure to design and manufacturing to discuss standardization, system level test, mmWave test, OTA, AiP device, AI-assisted test and many other exciting topics!  Join us to find out how MOEA 5G Technology Program Office, Qualcomm, MediaTek, SPIL, KYEC, Advantest, Teradyne, CHPT see the future of 5G testing and how installing AI could enhance it to the next level!

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 
Sponsored by:

 

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
     
       

 

 

View Full Agenda
Special Features 505ab 會議室/ 南港展覽館一館五樓 Thursday, September 19
9:00am to 4:20pm
Wednesday, September 18 12:20pm

 

 

*本處簡報下載僅提供經講師授權之簡報檔,欲引用者請尊重講師之智財權。

Advanced Materials Technology High-Tech Facility Innovative Technology & Product 

 

2019年9月18日 (星期三)

TechXPOT 1F #K3276

時間 公司 主題 簡報下載
12:40 - 13:00 邯鄲淨化設備研究所 中國大陸特殊電子級氣體發展現狀及未來
13:00 - 13:20 重慶群崴電子材料有限公司 大尺寸、高密度封裝材料簡述-銅核球和焊柱 下載
13:20 - 13:40 安格斯化學公司 安格斯電子化學品 VOLTAN 系列介紹 下載
13:40 - 14:00 台灣納美仕電子材料(股)公司 Copper foil surface treatment technology and low dielectric materials for high-speed transmission
14:00 - 14:20 上杭縣紫金佳博電子新材料科技有限公司 合金線、銅線研究報告
14:20 - 14:40 賀利氏 保障您明日的功率電子重要材料需求 下載
14:40 - 15:00 Evertech Enterprise Co., Ltd. 公司及產品介紹 下載
15:00 - 15:20 阿科瑪(中國)投資有限公司 阿科瑪KYNAR® PVDF在高純淨工業之應用 下載
15:20 - 15:40 河南國璽超純新材料股份有限公司 超高純金屬材料在半導體領域運用淺析 下載
15:40 - 16:00 5N Plus Inc., Micro Powders Ultra-Fine Metal Powders for a Wide Range of Microelectronic Assemblies 下載

 

TechXPOT 4F #L1316

時間 公司 主題 簡報下載
10:40 - 11:00 施耐德電機股份有限公司 工業物聯網時代之創新半導體電源管理
11:00 - 11:20 志尚儀器股份有限公司 AMC 暨環境與煙道氣體及 PM 2.5 成分創新分析技術探討 下載
11:20 - 11:40 金兆益科技股份有限公司 半導體無塵室智能在線 AMC 監控技術
11:40 - 12:00 太丞股份有限公司 全新模塊化結構之冷卻水塔設計開發 下載
12:00 - 12:20 SEMI Taiwan 高科技廠房設施委員會 北科大-晶圓盒門開啟下晶圓污染控制的一有效解決方案
13:20 - 13:40 台灣維諦有限公司 絕佳廠房關鍵設備保障--EXL S1 高效率的運轉模式 ---可靠性和最高能效的兼具 下載
13:40 - 14:00 濾能股份有限公司 MAU化學濾網演進及新世代思維
14:00 - 14:20 漢科系統科技股份有限公司 製程尾氣微塵控制技術 下載
14:40 - 15:00 台灣蓋姆有限公司 WHAT DO SKYSCRAPERS AND MICROCHIPS HAVE IN COMMON? FOCUS ON THE SEMICONDUCTOR INDUSTRY. 下載
15:00 - 15:20 信紘科技股份有限公司 綠色製程:產業未來趨勢及信紘解決方案
15:20 - 15:40 美商儀析科技股份有限公司 台灣分公司 Next generation Chemical process control in Semiconductor Industry
15:40 - 16:00 鈺祥企業股份有限公司 後摩爾定律時代之AMC最佳解決方案
16:00 - 16:20 JACOBI CARBONS AG Semiconductor Gas Filtration Challenge 下載

 

 

 

2018年9月19日 (星期四)

TechXPOT 1F #K3276

時間 公司 主題 簡報下載
10:30 - 12:00 財團法人國家實驗研究院台灣儀器科技研究中心 「國研院先進半導體設備與製程技術」在地化成果發表會
13:00 - 13:30 希鐠科技股份有限公司 整合性基板在異質整合平台上的應用 下載
13:30 - 14:00 CONNECTEC JAPAN Corporation Low Temp. / Low Load Flip Chip Bonding Technology 下載
14:00 - 14:30 深祥發展有限公司 真空回流焊接改善半導體芯片焊接良率的論述 下載
14:30 - 15:00 賀利氏 5G: 未來手機中的電磁屏蔽 下載
15:00 - 15:30 亞智科技股份有限公司 Manz's Solution in FOPLP RDL Formation
15:30 - 16:00 銦泰公司 倒裝芯片和BGA植球工藝的挑戰以及解決方案 下載

 

TechXPOT 4F #L1316

時間 公司 主題 簡報下載
10:30 - 11:00 台灣檢驗科技股份有限公司 半導體製程化學品與汽車應用微電子產品的品質確認暨可靠性評估的新發展 下載
11:00 - 11:30 廣化科技股份有限公司 Residue Free & Low Void — Formic Acid Vacuum Reflow Oven 下載
11:30 - 12:00 SilcoTek Corporation CVD Coatings to Control Metal-Ion and Particulate Contamination 下載
13:30 - 14:00 韓商穎鈦科技股份有限公司台灣分公司 QUALITY ASSURANCE SOLUTION ON HETEROGENEOUS INTEGRATION
14:00 - 14:30 億合科技股份有限公司 SmartNIL™ Nanoimprint Lithography enabling advanced functionality of optical devices for AR

 

 

2019年9月20日 (星期五)

TechXPOT 1F #K3276

時間 公司 主題 簡報下載
10:20 - 10:50 產業技術總合研究所奈米電子學研究部門 Packaging in Minimal Fab 下載
10:50 - 11:10 台灣斯倍利亞股份有限公司 低溫燒結奈米銀與全方位銲錫產品對應 下載
11:10 - 11:30 培栢艾先進材料股份有限公司 新耐高溫工程塑膠材料 下載
11:30 - 11:50 深圳市福英達工業技術有限公司 適用於半導體封裝用的超微連接材料 下載
13:30 - 13:50 達興材料股份有限公司 Multi-functional TBDB Material Solutions for Advanced Packaging Technologies
13:50 - 14:10 昀鴻企業有限公司 銅膏進階相關應用

 

TechXPOT 4F #L1316

時間 公司 主題 簡報下載
10:20 - 10:40 SEMI Taiwan 高科技廠房設施委員會 科技部贊助研發之高科技廠房設施消磁系統 下載
11:20 - 11:40 銳澤實業股份有限公司 高科技廠房&廠務規劃設計 下載
11:40 - 12:00 樂盟科技有限公司 T1 VPD 晶圓表面系統與 HST 化學品傳輸系統。 是最新專利的晶圓與化學品的重金屬分析前級設備。 T1 VPD 據有安全且快速,設備為零背景的晶圓蝕刻法設備。 HST 可以把化學品在數分鐘內傳輸適量數十ml , 到幾百米實驗室,順利值接上ICP MS 來分析到 ppt to ppq. 下載
14:00 - 15:40 社團法人台灣永續供應協會 台灣永續供應循環經濟聯盟

 

 

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Special Features 攤位號#K3276, TechXPOT / 南港展覽館一館一樓 Wednesday, September 18
12:40pm to 4:00pm
Special Features 攤位號#K3276, TechXPOT / 南港展覽館一館一樓 Friday, September 20
10:20am to 2:10pm
Special Features 攤位號#K3276, TechXPOT / 南港展覽館一館一樓 Thursday, September 19
1:00pm to 4:00pm
Special Features 攤位號#L1316, TechXPOT / 南港展覽館一館四樓 Wednesday, September 18
10:40am to 4:20pm
Special Features 攤位號#L1316, TechXPOT / 南港展覽館一館四樓 Thursday, September 19
10:30am to 4:30pm
Special Features 攤位號#L1316, TechXPOT / 南港展覽館一館四樓 Friday, September 20
10:20am to 12:00pm
Power Electronics and Optoelectronics Semiconductor Technology Forum 401 會議室/ 南港展覽館一館四樓 Thursday, September 19
8:20am to 4:15pm

 

Date:Thursday, September 19th, 2019
Time:08:20 - 16:15 (08:20-08:50 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室

Theme: 

  • Wide Band Gap Power Electronics ​
  • 5G Communications and VCSEL

Chair:

  • Mr. Brian Lee 李宗鴻, 策略長, 穩懋半導體股份有限公司/ 主席, SEMI Taiwan 功率暨化合物半導體委員會

Vice Chairs:

  • Dr. Yi-Cheng Cheng 程一誠, 材料暨光電研究所所長, 國家中山科學研究院/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會
  • Mr. Andy Chuang 莊淵棋, 總經理, 漢磊科技股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會
  • Dr. Barry Jia-Fu Lin 林嘉孚, 技術長, 聯穎光電股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會

​Moderator:

  • 上午場:Mr. Andy Chuang 莊淵棋, 總經理, 漢磊科技股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會
  • 下午場:Dr. Barry Lin 林嘉孚, 技術長, 聯穎光電股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會

Outline: 

  • Energy saving and carbon reduction are two major topics in the area of environment protection of the  earth. WBG (Wide Band Gap) technology is one of best solution to enhance the efficiency of energy conversion, it can effectively make power electronics systems much smaller, lighter, more reliable and more efficient, while being capable of operating at higher temperatures. Compared to silicon devices and materials, wide band gap devices based on SiC and GaN have excellent characteristics to achieve a significant improvement in performance such as higher breakdown voltages, higher electron mobility and higher thermal conductivity.
    To popularize WBG power electronics, the forum will address WBG applications in EV industry, wide band gap materials, as well as manufacturing and process technologies for wide band gap devices.

  • 5G communication is rolling out to the field in the coming years. It changes the role of cell phone in a revolutionary way. Cell phone is no longer just a personal tool, it moves to an interaction media between human and environment through IOT connection. In this session, 5G technology and architecture trends will be reviewed by two prominent vendors in the world.
    VCSEL emerges as the “hot shot” in photonics area. In addition to the technology, component module, epi-wafer growth, and on-wafer testing are the other three key areas. Companies in Taiwan play a vital role in providing these key elements.  We will show case some examples in this session.
    In this session, topics on 5G communication and VCSEL demonstrate the impact of compound semiconductor industry on our daily life in the future.

 
 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 3,200 NTD 4,000 NTD 3,200 5人以上再享9折

*Tax Included

 
 
Co-organizer:
   
     

 

Partner:
   
     

 

 

Sponsored by:

 

 

 

 

 

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
     
       

 

View Full Agenda
Special Features 401 會議室/ 南港展覽館一館四樓 Thursday, September 19
8:20am to 4:15pm
Special Features 宴會廳 B Room / 南港展覽館一館三樓 Thursday, September 19
11:30am to 1:30pm
Wednesday, September 18 10:00am

誰是下一波終端產品大勢?「5G通訊」、「車用電子」與「光通訊領域」等相關應用無庸置疑的會是榜上名單。傳統矽半導體隨摩爾定律發展面臨物理極限,化合物半導體材料的高電子遷移率、直接能隙與寬能帶等特性成為下世代半導體材料的新解。「化合物半導體創新應用館」邀請到漢磊、嘉晶、穩懋、GaN SystemsIQE等廠商就「3D Sensing」、「LiDAR & RADAR」、「Powertrain」三大主題展示相關技術趨勢,並透過全新純電BMW i3s純電動車現場亮相呈現化合物半導體產業鏈及由其驅動的終端應用!

地點 : 南港展覽館1館1F (Booth #I2700)

專家開講

Sep. 18 (Wed.)

公司

主題

檔案下載

10:50 - 11:00

 

致歡迎詞

 

11:00 - 11:20

漢磊科技股份有限公司

SiC市場與技術

 

11:20 - 11:40

GaN Systems Inc.

GaN & Electric Vehicles: A Small Change that’s Revolutionizing the Industry

Download

11:40 - 12:00

工研院電子與光電系統研究所

雙面散熱碳化矽功率模組

 

13:40 - 14:00

台灣茂矽電子股份有限公司

Power Semiconductor
IGBT for EV/HEV Car

 

15:00 - 15:20

瀚薪科技股份有限公司

新能源車用碳化矽技術發展

 

15:20 - 15:40

台達電子工業股份有限公司

台達電動車充電解決方案

Download

Sep. 19 (Thu.)

公司

主題

 

11:00 - 11:20

錼創顯示科技股份有限公司

新世代面板技術 - MicroLED 顯示器

 

13:40 - 14:00

台灣茂矽電子股份有限公司

Power Semiconductor
IGBT for EV/HEV Car

 

14:00 - 14:20

嘉晶電子股份有限公司

氮化鎵&碳化矽化合物半導體技術與現況

 

14:20 - 14:40

台達電子工業股份有限公司

台達電動車充電解決方案

Download

Sep. 20 (Fri.)

公司

主題

 

11:00 - 11:20

GaN Systems Inc.

Adapting GaN into Products we use everyday

 

11:20 - 11:40

工研院電子與光電系統研究所

高轉換效率12V-48V雙向直流變頻器開發

 

11:40 - 12:00

瀚薪科技股份有限公司

新能源車用碳化矽技術發展

 

 

參展廠商

BMW

台達電子工業股份有限公司

工研院電子與光電系統研究所

漢磊先進投資控股股份有限公司

GaN Systems Inc.

高平磊晶科技股份有限公司

台灣茂矽電子股份有限公司
錼創顯示科技股份有限公司

穩懋半導體股份有限公司

 

贊助單位

       
 
         

                                 

View Full Agenda
Special Features 攤位號#I2700, 化合物半導體創新應用館/ 南港展覽館一館一樓 Wednesday, September 18
10:50am to 3:40pm
Special Features 攤位號#I2700, 化合物半導體創新應用館/ 南港展覽館一館一樓 Thursday, September 19
11:00am to 2:40pm
Special Features 攤位號#I2700, 化合物半導體創新應用館/ 南港展覽館一館一樓 Friday, September 20
11:00am to 12:00pm
Semiconductor Advanced Inspection and Metrology Forum 505a 會議室/ 南港展覽館一館五樓 Friday, September 20
8:30am to 4:15pm

 

Date:Friday, September 20th, 2019
Time:08:30 - 16:15 (08:30-09:00 for registration)
Venue:Room 505a, 5F, TaiNEX 1 / 台北南港展覽館一館 5樓 505a會議室
Theme:  Inspection and Metrology Technologies Improving Semiconductor Manufacturing
Outline:  The Semiconductor Advanced Inspection and Metrology Forum is focusing on technologies of inspection and metrology which affect the semiconductor manufacturing significantly and drive the growth of market. The global market of semiconductor inspection equipment is expected to reach US$ 5300 million by 2024, from US$ 3360 million in 2019. To facilitate the development of semiconductor inspection and metrology, SEMI Inspection and Metrology Committee has been established. The committee and this forum provide a platform for communications and aim to create the advanced solutions of inspection and metrology for semiconductor industry.

 
 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
View Full Agenda
Special Features 505a 會議室/ 南港展覽館一館五樓 Friday, September 20
8:30am to 4:15pm
IC Forum 401 會議室/ 南港展覽館一館四樓 Friday, September 20
8:00am to 4:20pm

Date:Friday, September 20th, 2019
Time:08:00 - 16:25 (08:00-08:30 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室
Theme: A Big Thing in Semiconductor Industry

Chair:

  • Dr. John Lin 林進祥, 處長, 台灣積體電路製造股份有限公司/ 主席, SEMI Taiwan IC委員會

Vice Chairs:

  • Mr. G.C. Hung 洪圭鈞, 副總經理, 聯華電子股份有限公司/ 副主席, SEMI Taiwan IC委員會
  • Mr. Rutgers Chow 周雷琪, 總經理, 住程科技系統有限公司/ 副主席, SEMI Taiwan IC委員會

Moderator:

Outline: 

IC Forum is the global stage where industry leaders share their visions and perspectives on the roadmap of IC technology and how it enables various applications such as AI, quantum computing, HPC and 5G that keep advancing our industry.    

For this year's IC Forum, we are honored to have Microsoft, TSMC, UMC, imec and world leading equipment, materials and EDA companies to jointly address "A Big Thing in Semiconductor Industry."  "A Big Thing" could be a killer application like AI or autonomous driving, a breakthrough in chip design, and it could refer to the value of IC manufacturing in materializing all the innovation of applications through technology like scaling, specialty IC, new memory and heterogeneous integration.  

Through IC forum, we discuss trends, innovation and next generation manufacturing technology that advance the development of human life!

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 3,200 NTD 4,000 NTD 3,200 5人以上再享9折

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

 

 

 

 

 

 

 
       

 

 

View Full Agenda
Special Features 401 會議室/ 南港展覽館一館四樓 Friday, September 20
8:00am to 4:20pm
Special Features 402ab 會議室/ 南港展覽館一館四樓 Wednesday, September 18
9:00am to 12:20pm
Special Features 攤位號#J3258, 高科技智慧製造未來展區/ 南港展覽館一館一樓 Thursday, September 19
3:30pm to 4:30pm
Special Features 攤位號#L1316, TechXPOT / 南港展覽館一館四樓 Friday, September 20
2:00pm to 3:40pm
Wednesday, September 18 9:00am

>> 2019年 資訊持續更新中!

View Full Agenda
Special Features 南港展覽館一館一樓/ 四樓 Wednesday, September 18
10:00am to 5:00pm
Special Features 南港展覽館一館一樓/ 四樓 Thursday, September 19
10:00am to 5:00pm
Special Features 南港展覽館一館一樓/ 四樓 Friday, September 20
10:00am to 4:00pm
Wednesday, September 05 10:00am
MEMS & Sensors 504bc 會議室/ 南港展覽館一館五樓 Tuesday, September 17
8:30am to 4:40pm

Date : Tuesday, September 17th , 2019
Time :  08:30 – 16:40 (8:30-8:55 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme :  Edge Sensing to Edge AI for Life 

Outline:

Human beings currently experience a fast-changing world, which is overwhelmed by artificial intelligence (AI) in all kinds of aspects, thus greatly influencing our life, and this is just the beginning. Although AI has been developed for several decades, its progress is not significant until miniaturized, high performance and cost-effective sensors available. However, there are still many challenges hindering the real implementation of AI into our life (i.e., edge or local), including handling of trillion raw data from sensors, limited bandwidth and speed of wireless communication, and insufficient capacity and calculation efficiency of cloud. As such, this brings “Edge Sensing to Edge AI for Life” to be the main theme of the 2019 SEMICON Taiwan MEMS & Sensors Forum. The invited presentations this year will unveil the state-of-the-art Edge technology and local intelligence in sensors, modules, and application scenarios, as well as their eco-systems such as edge computing, 5G communication, cloud, big data, algorithm, and AI layers, thus enabling a real Edge era. Foreseeing the trends enabled by the Edge era, the forum this year features four categories including automotive and AI/Applications/Smart Life, with excellent presentations offered by flagship companies worldwide.

 

 

早鳥
(7/10-8/30)
原價
(8/31-9/20)
會員 非會員 會員 非會員
NTD1,800 NTD2,250 NTD2,250 NTD2,700

*Tax Included 

 
Sponsored by:
              

 

 

     

     
     
     
     
* Forum agenda is subject to change    
     
     
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
              

 

 

        

 

 

 
 
View Full Agenda
Special Features 攤位號#I2013a / 南港展覽館一館一樓 Friday, September 20
11:50am to 1:00pm
Tuesday, September 04 8:00am
Special Features 攤位號#I3216, 人才培育特展/ 南港展覽館一館一樓 Thursday, September 19
1:00pm to 3:00pm
Talent Development Forum 攤位號#I3216, 人才培育特展/ 南港展覽館一館一樓 Thursday, September 19
1:00pm to 3:00pm

 

Date:Thursday, September 19th, 2019
Time:13:00 - 15:00 (13:00-13:30 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 / 攤位號#I3216, 人才培育特展, 南港展覽館一樓
Theme: How to Land on the Dream Job and Change the Future ? 
Outline: 
為因應就業市場多元發展以及職涯上迷惘,今年特別舉辦「提升人才競爭力研討會」。藉由研討會模式,提供人才競爭力相關議題對話的平台。
本次研討會以「How to Land on the Dream Job and Change the Future ? 」為主題。一同邀請重量級講師,絡達科技股份有限公司 朱益德 人力資源處 處長台灣美光晶圓科技股份有限公司 北亞區策略人資夥伴 劉素齡  處長、蔚華科技股份有限公司 林星福 副總經理以及東京威力科創股份有限公司 張天豪 執行副總裁分別從人力資源以及公司治理角度分別切入議題,透過不同的面向探討人才競爭力與就業市場。並針對未來就業市場的變遷及如何自我提升競爭力,進一步討論人才競爭力未來願景,共同為台灣人才發揮最大努力。

 

Panel Discussion/討論主題
Theme: How to Land on the Dream Job and Change the Future ? 

Moderator/主持人
Mr. Jason Chin, Senior Vice President of Executive Recruiting Consultancy Division, 104 Corporation
一零四資訊科技股份有限公司 晉麗明 資深副總經理 
 
Panelists/與會講師
1. Mr. Yi Te Chu, HR Div. Director,  Airoha Technology Corporation    
    絡達科技股份有限公司 朱益德 人力資源處 處長 
2. Ms. Jessie Liu, North Asia, Human Resources Business Partner Director, Micron Technology Taiwan
   台灣美光晶圓科技股份有限公司 北亞區策略人資夥伴 劉素齡  處長
3. Mr. Richard Li, Vice President, Spirox Corporation 

   蔚華科技股份有限公司 林星福 副總經理
4. Mr. Roger Chang, Executive Vice President, Tokyo Electron Taiwan

    東京威力科創股份有限公司 張天豪 執行副總裁             
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

View Full Agenda
Special Features 攤位號#I3216, 人才培育特展/ 南港展覽館一館一樓 Friday, September 20
1:00pm to 3:00pm
SEMI Talent Forum 攤位號#I3216, 人才培育特展/ 南港展覽館一館一樓 Friday, September 20
1:00pm to 3:00pm

 

Date:Friday, September 20th, 2019
Time:13:00 - 15:00 (13:00-13:30 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 / 攤位號#I3216, 人才培育特展, 南港展覽館一樓

-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Outline: 

因應數位世代來臨,如何建構出新世代視野成為重要課題,今年舉辦「明日領袖論壇」。藉由論壇,關注及面對數位時代來臨以及建構AI領域大藍圖為本次論壇對話主題。
本次以「Strategy Thinking in Era of Digital Transformation」、「Vision for Building a Digital Workforce Experience」、 「Preparation for the AI Revolution in Workforce Development」為三大討論主題,邀請到重量級講師,Ms. Fiona Tan, Intel Taiwan Senior
  HR Manager, Intel、Mr. Leon Lu, Chief of Adm. & HR, Wistron Corporation.、Ms. Venus Hu , Dept. Manager, Recruiting Dept., HR Operation Center, TSMC以及Mr. Ben Wang, Chairman, Global Career Development Association.    等,共同談論數位時代來臨、建構視野的重要性以及如何應對新AI時代的到來,希望藉由經驗交流與傳承,共同在這數位變遷的時代提供寶貴的意見以及建構出無限美好的科技未來。

 

Panel Discussion/討論主題
-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Moderator/主持人
Mr. Eugene Huang, Partner, Deloitte Consulting
 德勤管理諮詢 黃于峻 合夥人
 
Panelist/與會講師
1. Mr. Alex Cheng/鄭智成, Director, Business Consumption,Sales and marketing, Taiwan, Intel 
2. Mr. Leon Lu/呂錦龍, Chief of Adm. & HR, Wistron Corporation.
3. Ms. Venus Hu / 胡雯雯, Dept. Manager, Recruiting Dept., HR Operation Center, TSMC 
4. Mr. Ben Wang/王星威, Chairman, Global Career Development Association.

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
View Full Agenda
Smart Data Global Summit 504bc 會議室/ 南港展覽館一館五樓 Thursday, September 19
8:30am to 12:15pm

感謝您的支持,智慧數據國際論壇已報名額滿,請留下您的聯絡資訊,以利為您排論壇候補名單及會後寄送講師授權講義。

點我留資料!

Date:Thursday, September 19th, 2019
Time:08:30 – 12:15 (8:30-8:55 for registration)
Venue:南港展覽館一館5樓 504bc會議室
Theme: Artificial Intelligence and Ubiquitous Computing in the Digitally Transformed Future
Outline:

Artificial intelligence is permeating everybody’s lives through the face recognition, voice recognition, image analysis and natural language processing capabilities built into their smartphones, consumer and industrial appliances.  However, as traditional processors struggle to meet the demands of compute-intensive artificial intelligence applications, dedicated AI chips are playing an increasingly important role in research, development, and on the cloud and edge. 

With its potential market of hundreds of zettabytes and $2 trillion of on top of the existing $1.5-2B information technology industry, AI not only relies on new semiconductor architectures and compute platforms but also brings many growth opportunities for new semiconductor products where new approaches to designs are required because of the complexity of the applications that need to be supported. Join to learn these industry executives’ vision leading the way forward to a fully connected, intelligent world.

 

早鳥
(7/10-8/30)
原價
(8/31-9/20)
會員 非會員 會員 非會員
Free Free Free Free

 

Co-organizer :
                                                                      
     
     
Sponsored by :

 

                  

           

               

 

 

 

 

     

 
     
Media Partner :    
               

* Forum agenda is subject to change    

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

   

 

View Full Agenda
Special Features 504bc 會議室/ 南港展覽館一館五樓 Thursday, September 19
8:30am to 12:15pm
Smart Transportation Forum 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 18
8:30am to 4:10pm

Date : Wednseday, September 18th , 2019
Time :  08:30 – 16:10 (8:30-9:00 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme :  From Silicon to Future Mobility

 

早鳥
(7/10-8/30)
原價
(8/31-9/20)
會員 非會員 會員 非會員
NTD1,800 NTD2,250 NTD2,250 NTD2,700

*Tax Included

Co-organizer:
                    
     
     
Sponsored by:    
                 

     

     
     
Media Partner :    
   
     
     
     
     
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

View Full Agenda
Special Features 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 18
8:30am to 4:10pm
Special Features 宴會廳 A Room / 南港展覽館一館三樓 Wednesday, September 18
11:40am to 1:30pm
Special Features 宴會廳 B Room / 南港展覽館一館三樓 Wednesday, September 18
11:30am to 1:30pm
Smart MedTech Forum 504bc 會議室/ 南港展覽館一館五樓 Friday, September 20
8:30am to 12:00pm

Date:Friday, September 20th , 2019
Time:08:30 – 12:00 (8:30-8:55 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme: Create New Value Chain to Empower Medical Technology
Outline:

According to Global Market Insights, Inc., the global digital health market was valued at USD 86 billion in 2018 and expected to grow at a CAGR of 38.8% over the next seven years, expected to reach USD 504  billion in 2025. Rapidly advancing technologies , including artificial intelligence (AI), machine learning, Robotics,  IoT and wearables, etc. are impacting and accelerating health care industry. Smart MedTech can advance health care quality, improver data controls, decisions making in treatment or pharma and precision medicine, all these require the collaboration between microelectronics and health care industry. 

For microelectronics industry, it’s essential to understand the health care industry’s expectation and provide reliable, efficient and cost-effective solutions to increase the market size. As for health care industry, MedTech comes with immense opportunities to take advantage of latest technologies and  to boost the technology advancement. The close collaboration between these two industries definitely bring the bright future for human life.

The Smart MedTech forum not only initiate the communication between microelectronics industry with MedTech applications, but also accelerate semiconductor industry involvement in MedTech development and invest more resource to realize Smart MedTech.

 

早鳥
(7/10-8/30)
原價
(8/31-9/20)

會員

非會員

會員

非會員

Free

Free

NTD2,250

NTD2,700

*Tax Included

* Forum agenda is subject to change    

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

   

 

View Full Agenda
Special Features 504bc 會議室/ 南港展覽館一館五樓 Friday, September 20
8:30am to 12:00pm
Special Features 攤位號#K2041a / 南港展覽館一館一樓 Thursday, September 19
11:50am to 1:00pm
Wednesday, September 18 10:00am

以系統級封裝技術(SiP)結合個別晶粒、微機電系統(MEMS)、記憶體、電源管等多項獨立晶片而成的異質整合晶片(H.I. chips),將強力主宰半導體下世代關鍵發展!

「異質整合創新技術館」邀請來自中華電信、聯發科、瑞昱、日月光、矽品、力成、工研院等領導廠商共同於館中展示最具代表性的異質整合終端應用與重點技術,聚焦異質整合應用市場走向,呈現產業第一手前瞻資訊!

地點 : 南港展覽館1館1F (Booth #J3234)

參展廠商

公司名稱 展示內容
日月光半導體製造股份有限公司 2.5D, 3D, Fan-Out Packaging 
中華電信研究院 5G Enabling Innovative Services
工業技術研究院
(1) High Speed SiPh Opto-electronics Measurement Platform
(2) Micro LED Chip Process and Mass Transfer Platforms
(3) 3DIC Heterogeneous Integration Process Platform
(4) Sub-THz System Laboratory
工業技術研究院
(1) Heterogeneous Integration Platform for AITA
(2) Advance AI Heterogeneous Integration Technology
聯發科技股份有限公司 More than Moore: Heterogeneous Integration Technologies
力成科技股份有限公司 Panel Fan-Out & 3D IC Technology
瑞昱半導體股份有限公司 Full Range of Connectivity Solutions
矽品精密工業股份有限公司 Heterogeneous Integration for future Advanced Packaging Solution
希鐠科技股份有限公司
(1) SiPlus Heterogeneous Integration platform - Integrated Substrate solutions
(2) eHDF Substrate
(3) Advance Hybrid Space Transformer
TechSearch Heterogeneous Integration Market Trend

Brought to you by

 

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E-innovation Forum 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
8:30am to 12:00pm

此場次現場座位及Room 504a同步直播區之報名踴躍,已全數額滿,報名截止。

Date:Wednesday, September 18th, 2019
Time:08:30 - 12:00 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1/ 台北南港展覽4樓  未來舞台區 攤位號 #M1148
Outline: 

Innovation is uncertain and could be risky, and yet it is also the biggest drive of technology invention and development which through the creative destruction led by innovation, we witness and experience remarkable changes and improvement of human life.

Behind every innovation, there are painstaking process with countless trial and error and there are also enlightening moments of epiphany.  What drives innovation to success, what we discover throughout the process and how future innovation looks like, we invite a series of distinguished speakers from worldwide leading research institute & academia who have made exceptional contributions to this industry to share their insights and visions. Facing innovative future, let’s learn, unlearn and relearn.

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

View Full Agenda
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
9:30am to 12:00pm
Special Features 攤位號#I3216, 人才培育特展/ 南港展覽館一館一樓 Friday, September 20
10:00am to 11:30am
Women-in-Tech Forum 攤位號#I3216, 人才培育特展/ 南港展覽館一館一樓 Friday, September 20
10:00am to 11:30am

 

Date:Friday, September 20th, 2019
Time:10:00 - 11:30 (10:00-10:10 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 / 攤位號#I3216, 人才培育特展, 南港展覽館一樓
Theme: Empowering Women for the Future 
Outline: 

近年來科技女性逐漸佔居一席之地,今年舉辦「科技女力論壇」。藉由論壇,分享自身成功經歷,鼓勵勇敢實踐科技夢,期望激發女性在 STEM 領域發光發熱,擁有更多自由發聲、勇於挑戰自我成長的機會。
本次研討會以「Empowering Women for the Future  」為主題。一同邀請重量級講師,明導國際股份有限公司台灣暨東南亞區總經理
   林棨璇 /台灣微軟 營運暨行銷事業群 首席營運長何虹/台灣應用材料股份有限公司 台灣日本中國區半導體事業服務群 幕僚長 陸藍珠 共同談論女力發展趨勢、兩性平等職場環境與女性科技人才培育的重要性,希望藉由不同世代的經驗交流與傳承,一起啟發並幫助懷著科技夢的女性不斷前進,成就更多不凡女性。

 

Theme/主題

Empowering Women for the Future 

Moderator/主持人

 Dr. Tri-Rung Yew, Professor, Department of Materials Science and Engineering , National Tsing Hua University
 國立清華大學 材料與工程學系 游萃蓉 教授 

Panelists/與會講師
1. Ms. Nina Lin, General Manager, Taiwan & ASEAN, Mentor, a Siemens Business

    明導國際股份有限公司 林棨璇 台灣暨東南亞區總經理  
2. Dr. Hedy Ho, Chief of Marketing and Operations , Microsoft Taiwan
   台灣微軟 營運暨行銷事業群 何虹 首席營運長
3. Ms. Julia Lu, Chief of Staff ,Semiconductor Products Group Taiwan, Japan, and China, Sales & Marketing,Applied Materials Taiwan
  台灣應用材料股份有限公司 台灣日本中國區半導體事業服務群 陸藍珠 幕僚長 

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
View Full Agenda
Technology Think Tank Summit 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
1:20pm to 5:00pm

此場次現場座位及Room 504a同步直播區之報名踴躍,已全數額滿,報名截止。

Date:Wednesday, September 18th, 2019
Time:13:20 - 17:00 (13:20-13:40 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1/ 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓
Theme: 台灣高科技產業的下個60年
Outline: 

SEMICON Taiwan 國際半導體展是串聯微電子與半導體產業生態圈,展示產業最新設計、製造與應用的年度產業盛會。在眾多活動中, 「科技智庫領袖高峰會」是集結全球產業領袖分享他們對產業未來的見解與願景的指標性活動。憑藉著IC發明60年間打下的厚實基礎,台灣如何能夠在面對全球競爭和變革的過程中,創造另一個輝煌的60年更是我們的使命,也是我們今年「科技智庫領袖高峰會」的主題。我們將邀請來自系統整合、IC設計、記憶體、晶圓製造、封裝測試等領域的業界領袖,及經濟部沈榮津部長主持會談,共同討論並引領台灣高科技產業走出下一個輝煌60年。

 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

 
 
 
Sponsored by:
     

 

 
 
* Forum agenda is subject to change
 
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
 
     

 

View Full Agenda
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 18
1:20pm to 5:00pm
Strategic Materials Conference Taiwan Thursday, September 19
9:30am to 4:00pm

 

Display Time Location
09:00 – 17:00, September 19, 2019 FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
10:00 – 16:00, September 20, 2019 K Zone

 

 

 

 

Poster Topic Presenter Author(s)
1. Vertically Stacked GeSi GAA n-Channels on a Si Channel by CVD Epitaxy

Chung-En Tsai

C. W. Liu, Chung-En Tsai, Yi-Chun Liu, Yu-Shiang Huang, Fang-Liang Lu, and Hung-Yu Ye
2. Atomic Layer Technologies: Atomic Layer Annealing, Bombardment, Crystallization, Densification, Epitaxy, and Etching Miin-Jang Chen Yu-Tung Yin, Miin-Jang Chen
3. Reliability Improvement of HfO2-based Ferroelectric Memory by Interface Engineering Yung-Hsien Wu Kuen-Yi Chen, Pin-Hsuan Chen, Ruei-Wen Kao, Chuan-Pu Chou, Yan-Xiao Lin, Yan-Hua Huang and Yung-Hsien Wu
4. High Sensitivity Ion Detector by 16nm FinFET CMOS Technology Chien-Ping Wang Chien-Ping Wang
5. The Interface Electrical Properties of Tens-of-Nanometer Thick Graphene on Few-Layer MoS2 Flakes Hao-Wei Tu Hao-Wei Tu, Chin-Lung Lin, Jing-Jia Lin, Wen-Bin Jian, Chenming Hu
6. Large-Scale Growth of Two-Dimensional Materials toward Phase-Engineered Hybrid Films Ling Lee Ling Lee(李寧), and Yu‐Lun Chueh(闕郁倫)
7. Dielectric Properties Measurement Technology of  Material in mmWave Application Chun An Lu Chiung Hsiung Chen, Chun An Lu, Yi Chen Wu, Cheng Ping Lin, Kyoko Nishidono
8. From wafer to solution: Organic impurities analysis strategy in advanced node Po-Cheng Chen Po-Cheng Chen, Hao Chang, Edward Chan, C.R.Liang, Chunghsi Joe Wu
9. Material impurity control: The staples of the quality assurance Shu-Hua Chou Shu-Hua Chou, Yi-Hsiu Hsiao, Chunghsi Joe Wu
10. Importance of electrostatic discharge (ESD) at advanced semiconductor materials manufactory Yu-Lun Hsiao Yu-Lun Hsiao, Chung-Yu Lin, Joe Wu, Y.K. Fan, W.C Yang,
11. A Novel Metal Gate Protective Film and Device Structures Thereof Chandrashekhar Prakash SAVANT Chandrashekhar Prakash SAVANT, Tien-Wei YU, Chia-Ming TSAI
12. Material Quality Roadmap Ming-Yuan Lin Ming-Yuan Lin, Ming-Hsi Sung , Liang-Chen Chi, Chunghsi Joe Wu
13. CMR Screening in semiconductor manufacturing chemicals Zack Su Zack Su, Zoe Chung, C.F. Wang , Shih-Hao Wang
14. History and Development of Trace Metal Impurities Analysis Technology

toward Semiconductor advance process

Heng-Yan Liu Heng-Yan Liu, Takuya Morimoto, Sylvia Huang, Henry Tseng, Jerry Lu
15. Real-time measurement of precursor vapor concentration using the non-dispersive Infrared spectroscopy Masakazu Minami M. Minami and Dr. YL Tsai
16. AlN Removal Formulation with modified anisotropic silicon etching property Chung Yi Chang Chung Yi Chang, Wen Dar Liu, Yi Chia Lee, John G Langan, Tianniu Rick Chen, Aiping Wu , Hung-Yu Chen

 

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Strategic Materials Conference Taiwan 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Thursday, September 19
8:30am to 4:55pm

Date:Thursday, September 19th, 2019
Time:08:30 - 16:55 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1/ 台北南港展覽4樓  未來舞台區 攤位號 #M1148
Theme: Materials Leading the Smart Future of Semiconductor - Device Performance

Chair:

  • Mr. Min-Te Chen 陳明德, 副處長, 台灣積體電路製造股份有限公司/ 主席, SEMI Taiwan材料委員會

Vice Chairs:

  • Dr. Joe Wu 吳宗禧, 副處長, 台灣積體電路製造股份有限公司/ 副主席, SEMI Taiwan材料委員會
  • Dr.  Jeffrey Yang 楊秉豐, 資深部經理, 日月光半導體製造股份有限公司/ 副主席, SEMI Taiwan材料委員會
  • Mr. Brian Chen 陳致遠, 副總經理, 華立企業股份有限公司/ 副主席, SEMI Taiwan材料委員會

Moderator: 

Outline: (TBD)

 

 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 2,500 NTD 3,125 NTD 2,500 5人以上再享9折

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

 

View Full Agenda
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Thursday, September 19
8:30am to 4:55pm
Monday, September 17 8:30am

聚焦「異質整合先進封裝及智慧製造在5G及AI時代的技術突破及應用機會」、「先進封裝技術實現高密度高效能運算」、「系統級封裝異質與同質整合技術趨勢」等主題,台積電、日月光、矽品、美光、力成、Amkor、ASMPT、Camtek、imec、Lam Research、SPTS、UCLA 帶您了解下世代先進封裝技術

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Special Features 福軒廳 / 南港展覽館一館三樓 Wednesday, September 18
12:00pm to 1:20pm
Cybersecurity Global Summit 401 會議室/ 南港展覽館一館四樓 Wednesday, September 18
8:30am to 12:05pm

 

因報名踴躍,本場次已額滿並關閉線上報名,如欲參與,可至現場候位。

Date:Wednesday, September 18th, 2019
Time:08:30 - 12:05 (08:30-09:00 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 401 會議室/ 南港展覽館一館四樓
Theme: Enabling Cybersecurity for Resilient Smart Factory 

Forum Chair:

  • Dr. Cheney Chiu 邱煜程, 副處長, 日月光集團/ 共同主席, SEMI Taiwan智慧製造委員會

Moderator:

  • Dr. Cheney Chiu 邱煜程, 副處長, 日月光集團/ 共同主席, SEMI Taiwan智慧製造委員會

Outline:TBD

 
 
 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

 

Sponsored By: 
 

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 

 

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Special Features 401 會議室/ 南港展覽館一館四樓 Wednesday, September 18
8:30am to 12:05pm
Special Features 504bc 會議室/ 南港展覽館一館五樓 Thursday, September 19
1:00pm to 5:00pm
Quantum Computer: Envision the new era of computing 504bc 會議室/ 南港展覽館一館五樓 Thursday, September 19
1:00pm to 5:00pm

                       

感謝您的支持,量子電腦論壇已報名額滿,請留下您的聯絡資訊,以利為您排論壇候補名單及會後寄送講師授權講義。

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Date:Thursday, September 19th, 2019
Time:13:00 – 17:00 (13:00-13:30 for registration)
Venue:南港展覽館一館5樓 504bc會議室
Outline:

The first quantum revolution is that scientists and tech engineers use the rules of quantum mechanics to build devices including the transistor, the laser, integrated circuit etc. The second quantum revolution is that we are directly using quantum machine including quantum sensor, quantum information and quantum computer. The quantum computer bases on quantum mechanics and gives the new computing that promise to solve some of the currently intractable problems. 

Quantum computer had a lot of potential applications including predictions of new medicine and new material, optimization, quantum machine learning for Artificial intelligence, financial problems, cryptography and so on. The first commercial quantum computer has been established by IBM in this year and it is can be predict that the quantum computer will be rapid development. Also recent two years more than hundred private and startup companies have been found. It is time to connect the future, the quantum era.

 

            

早鳥
(7/10-8/30)

            

            

原價
(8/31-9/20)

            

會員 非會員 會員 非會員
Free Free Free Free

 

Organizer:

                  

 
     
 
Media Partner :                                                                                                            
           
     
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
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Special Features 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 18
10:10am to 10:30am
Special Features URBAN331 / 慕軒飯店一樓 Thursday, September 19
5:30pm to 7:30pm
High-Tech Facility 402abc 會議室/ 南港展覽館一館四樓 Thursday, September 19
8:30am to 5:30pm

Date:Thursday, September 19th, 2019
Time:08:30 - 17:30 (08:30-09:00 for registration)
Venue:Room 402abc, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 402abc會議室
Theme: A.I. Solutions Shaping Future Facilities​ / 新世代廠房設施之人工智慧解決方案 
Outline: 

第四次工業革命最近在技術進化的地平線上爆發式地點燃了人工智慧(AI)之應用。 許多人一定對[人工智慧能為智慧廠房設施做什麼?]感到好奇。 2019年高科技設施國際論壇旨在將邀請 IBM 和 nVidia 的前瞻願景家與其他全球專家齊聚一堂,討論如何在世界上最先進的智慧廠房中引入實施人工智慧(AI)。

隨著每一代新智慧廠房的興建和營運,都會發展出更先進的人工智慧,並提供半導體製造持續提昇改進之廣闊基礎。 當其結果變得可行且明顯時,這就有迫切的需要去多加瞭解人工智慧道理,並務實地實施其技術,俾以提昇高科技廠房設施之智慧化。 今年的論壇旨在向與會者提供最新的人工智慧的應用和其趨勢。

論壇將提供即時的中英文口譯服務。 演講者和座談與會者,將以行業領導者與前瞻研究員和供應廠家代表,同臺相謀的形式分享他們在應用人工智慧及其他需求之最新發現。借此形式,它使業主,廠家和學者得以直接誠摯地公開溝通,來共同協力解決新興的問題。 歡迎各界人士前來參加。

 

 

【NEW!】2019 論壇 Highlight 請至 http://www.htftaiwan.org/
 
 

早鳥價
(7/10-8/30)

原價
(8/31-9/20)

NTD 4,200 NTD 4,600

*Tax Included

 
 
高科技廠房設施貴賓晚宴
Time : 18:00 - 21:00 
Venue:Ballroom, 3F, TaiNEX 1 / 台北南港展覽館一館 3樓 燴館宴會廳

 

早鳥價
(7/10-8/30)
原價
(8/31-9/20)
NTD 3,200 NTD 4,200

*Tax Included    

 
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

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Special Features 402 會議室/ 南港展覽館一館四樓 Thursday, September 19
8:30am to 5:30pm
Special Features 攤位號#L0100a / 南港展覽館一館四樓 Thursday, September 19
12:20pm to 1:30pm
Special Features 宴會廳 A Room / 南港展覽館一館三樓 Thursday, September 19
5:30pm to 9:00pm
Special Features 攤位號#J3258, 高科技智慧製造未來展區/ 南港展覽館一館一樓 Wednesday, September 18
10:30am to 4:30pm
Special Features 攤位號#J3258, 高科技智慧製造未來展區/ 南港展覽館一館一樓 Thursday, September 19
10:30am to 2:30pm
Special Features 攤位號#J3258, 高科技智慧製造未來展區/ 南港展覽館一館一樓 Friday, September 20
10:30am to 2:30pm
Smart Manufacturing Forum 401 會議室/ 南港展覽館一館四樓 Wednesday, September 18
1:00pm to 4:55pm

Date:Wednesday, September 18th, 2019
Time:13:00 - 16:55 (13:00-13:30 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室
Theme: Leading the New Era of Intelligent Manufacturing with AI, Big Data & Cloud

Forum Chair:

  • Mr. James Lin 林京沛, 副處長, 聯華電子股份有限公司/ 共同主席, SEMI Taiwan智慧製造委員會

Moderators:

  • Mr. James Lin 林京沛, 副處長, 聯華電子股份有限公司/ 共同主席, SEMI Taiwan智慧製造委員會
  • Dr. Scott Yu 游志源, 部經理, 台積電/ 共同主席, SEMI Taiwan智慧製造委員會

Outline: We are in the way towards Industrial 4.0, which requires Smart Manufacturing technologies and applications to achieve our digital transformation goal.
In this forum, we will provide development strategy, best known practice, and solutions from the perspectives of fab owner, equipment makers, solution providers, and IC design house.

 
 
 
早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
NTD 2,000 NTD 2,500 NTD 2,000 5人以上再享9折

*Tax Included

 
 
Sponsored by:

 

   
                          
                                
 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
   
       

 

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Special Features 401 會議室/ 南港展覽館一館四樓 Wednesday, September 18
1:00pm to 4:55pm
Sustainable Manufacturing and Circular Economy Forum 505ab 會議室/ 南港展覽館一館五樓 Wednesday, September 18
12:40pm to 5:00pm

因報名踴躍,本場次已額滿並關閉線上報名,如欲參與,可至現場候位。

Date:Wednesday, September 18th, 2019 
Time : 12:40 – 17:00 (12:40-13:10 for registration)
Venue:Room 505ab, TaiNEX 1 / 台北南港展覽館一館 5樓 505ab會議室 
Theme :  Energy Conservation and Risk Management for Sustainable Manufacturing

Outline :

In conjunction with SEMICON Taiwan 2019, the Sustainable Manufacturing Committee of SEMI Taiwan is organizing an event to provide insights on the latest products and technologies, regulations, technical standards, business continuity plan (BCP), business continuity management (BCM), energy conservation, circular economy and cyber security.

The Sustainable and Circular economy Forum will showcase the expertise and capabilities of companies and speakers from around the word by addressing a wide variety of energy conservation and risk management issues for high tech sustainable manufacturing. The topics includes environmental protection, BCP/BCM, energy conservation, circular economy, occupational health and safety, information and operation security which affect sustainable manufacturing.

 

早鳥價
(7/10-8/30)
原價
(8/31-9/20)
SEMI 會員價
(7/10-9/20)
團報價
(7/10-9/20)
免費 免費 免費 免費

*Tax Included

 

 

Sponsored by:

   

 

 

    * Forum agenda is subject to change    

 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

   

View Full Agenda
Special Features 505ab 會議室/ 南港展覽館一館五樓 Wednesday, September 18
12:40pm to 5:00pm

聯絡人
SEMI Taiwan
李小姐 Lily Lee
TEL: 886.3.560.1777 EXT. 509
Email: llee@semi.org

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