>> 2019年 資訊持續更新中！
Programs Catalog
Programs Catalog
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Date：Tuesday, September 17th, 2019 Forum Chairs:
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date：Friday, September 20th, 2019 Forum Chair:
Moderator:
Outline: With the dynamic development of various applications such as automotive, IoT, 5G and AI high performance computing, the ecosystem and manufacturing technology of semiconductor industry have also encountered major paradigm shift. In addition to scaling, another rising wave led by SiP (System in Package) is expanding the landscape of design, integrating options and advanced manufacturing technologies. The hybrid SiP solutions of Heterogeneous and Homogeneous integrations combining logic, memory, sensors and other functional chips are groundbreaking and enabling all kinds of new applications. Through SiP Global Summit Day 3 session, we will reveal the charm of HI double shots (Heterogeneous and Homogeneous Integration) from devices and manufacturing perspectives with speakers from chip, package and system such as NXP, MTK, ASE, Micron, Amkor and Mentor followed by an exciting cross-ecosystem panel discussion to further elaborate and enlighten the way to success with hybrid SiP solutions.
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date：Thursday, September 19th, 2019
Forum Chair:
Moderator:
Outline: With the arrival of data-centric era, we are unconsciously immersed in and guided by ubiquitous data generation and processing in our daily life; from remote cloud, data centers, networks, to fleet of personal and sensing devices such as smartphone, wearables, visual monitoring, vocal controls, and smart surveillance. This spurs strong demands on semiconductor logics, memories, and wireless connectivity for data generation, storage, processing, and communication. To meet the escalating demands on data bandwidth and smart computing, the semiconductor industry has re-invented packaging and system integration technologies by providing cost effective solutions in all application domains. While Moore’s Law transistor scaling continues, semiconductor market has evolved from device centric to data centric. To address market needs, system packages through heterogeneous integration has taken the driver’s seat and propel system performances toward smart computing, wide data bandwidth, small form factor, with low or zero latency and energy efficiency. And all these are capped by ever better system cost per function as technology and product migrate from generation to generation. In this forum, speakers from renowned academician, research institute, Design House, EDA tool, foundry, and manufacturing/materials suppliers are sharing their insights and visions. Audience would benefit from this forum to have an in-depth understanding on following subjects
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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科技菁英領袖晚宴跨界全球凝聚產業 年度最具前瞻視野的科技盛宴
SEMICON Taiwan 最具指標性的高階聯誼活動，每年邀請超過600位來自全球半導體業界之卓越企業家、高階經理人及關鍵決策者。
一同齊聚交流，促成跨國、跨領域的合作契機，成功幫助企業品牌行銷與形象提升。
提供一個交流聯誼平台，更希望藉由與會之產業領導者的力量，一起為產業永續發展而努力。
日期：2019年9月18日星期三
時間：18:00-21:00
地點：台北君悅大飯店 三樓宴會廳
*本活動採邀請制
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Date：Friday, September 20th, 2019 Outline: Interested in a full update on the recent developments in the field of nanoelectronics? ITF Taiwan 2019 is your place to be. Doors open at 8:30am. Make your visit to SEMICON Taiwan even more worthwhile! |
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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-Strategy Thinking in Era of Digital Transformation
-Vision for Building a Digital Workforce Experience
-Preparation for the AI Revolution in Workforce Development
Panelist:
1.Ms. Grace Wang, Taiwan Sales General Manager, Intel
2.Ms. Poling Liu , HR Director , ASML
3.Mr. Roger Chang, Vice President, Tokyo Electornic Ltd.
4. (Inviting) TSMC
Moderator:
Mr. Benson Cheng, COO, Deloitte Management Consultant
Mr. Ian Smythe
終端產品事業部 市場行銷副總裁
Arm
Abstract of Presentation:
Dr. Eric Kuah
Vice President of Technology
先進太平洋股份有限公司
Abstract:
To form die bottom bonding and/or die top bonding for high power application the current state of art is to use different types of sintering material in particular silver dominated metal. We will discuss about newly developed sintering material and pressure sintering processes. In addition, we will discuss on the mechanism behind pressure sintering and the characterization of such sintered bond. The reliability of the sintered bond and bond quality are expound. A variant of results will be compare across different type of materials, which could provide insights to package designers for high-performance power electronics.
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Date：Thursday, September. 19th, 2019
Forum Vice Chair:
Moderators:
Outline: With the dynamic development of IC industry driven by applications like 5G, HPC, IoT, AI and Automotive; semiconductor testing faces major paradigm shift with the eager needs to develop new testing concept and capability to cope with the rising complexity of ICs and systems to ensure their reliability and safety. 5G technology, one of the most heated applications, challenges the entire testing ecosystem to develop new system level test methodology for accuracy and quality while at the same time to balance cost and time to volume. And with the development of AI, testing data generated through design and manufacturing process has become one of the most valuable resources for industry to enhance their testing capability. To lead and to facilitate industry technology development on testing, the theme for the very first Advanced Testing Forum in SEMICON Taiwan will be “5G and AI-assisted Test”. The forum will cover the perspectives from policy and infrastructure to design and manufacturing to discuss standardization, system level test, mmWave test, OTA, AiP device, AI-assisted test and many other exciting topics! Join us to find out how MOEA 5G Technology Program Office, Qualcomm, MediaTek, SPIL, KYEC, Advantest, Teradyne, CHPT see the future of 5G testing and how installing AI could enhance it to the next level!
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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| Advanced Materials Technology | High-Tech Facility | Innovative Technology & Product |
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2019年9月18日 (星期三) TechXPOT 1F #K3276 |
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| 時間 | 公司 | 主題 | 發表語言 |
| 12:40 - 13:00 | 邯鄲淨化設備研究所 | 中國大陸特殊電子級氣體發展現狀及未來 | 中文 |
| 13:00 - 13:20 | 重慶群崴電子材料有限公司 | 大尺寸、高密度封裝材料簡述-銅核球和焊柱 | 中文 |
| 13:20 - 13:40 | 安格斯化學公司 | 安格斯電子化學品 VOLTAN 系列介紹 | 中文 |
| 13:40 - 14:00 | 台灣納美仕電子材料(股)公司 | Copper foil surface treatment technology and low dielectric materials for high-speed transmission | 英文 |
| 14:00 - 14:20 | 上杭縣紫金佳博電子新材料科技有限公司 | 合金線、銅線研究報告 | 中文 |
| 14:20 - 14:40 | 賀利氏 | 保障您明日的功率電子重要材料需求 | 中文 |
| 14:40 - 15:00 | Evertech Enterprise Co., Ltd. | 公司及產品介紹 | 中文 |
| 15:00 - 15:20 | 阿科瑪(中國)投資有限公司 | 阿科瑪KYNAR® PVDF在高純淨工業之應用 | 中文 |
| 15:20 - 15:40 | 河南國璽超純新材料股份有限公司 | 超高純金屬材料在半導體領域運用淺析 | 中文 |
| 15:40 - 16:00 | 5N Plus Inc., Micro Powders | Ultra-Fine Metal Powders for a Wide Range of Microelectronic Assemblies | 英文 |
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TechXPOT 4F #L1316 |
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| 時間 | 公司 | 主題 | 地點 |
| 10:40 - 11:00 | 施耐德電機股份有限公司 | 工業物聯網時代之創新半導體電源管理 | 英文 |
| 11:00 - 11:20 | 志尚儀器股份有限公司 | AMC 暨環境與煙道氣體及 PM 2.5 成分創新分析技術探討 | 中文 |
| 11:20 - 11:40 | 金兆益科技股份有限公司 | 半導體無塵室智能在線 AMC 監控技術 | 中文 |
| 11:40 - 12:00 | 太丞股份有限公司 | 全新模塊化結構之冷卻水塔設計開發 | 中文 |
| 12:00 - 12:20 | SEMI Taiwan 高科技廠房設施委員會 | 北科大-晶圓盒門開啟下晶圓污染控制的一有效解決方案 | 中文、英文 |
| 13:20 - 13:40 | 台灣維諦有限公司 | 絕佳廠房關鍵設備保障--EXL S1 高效率的運轉模式 ---可靠性和最高能效的兼具 | 中文 |
| 13:40 - 14:00 | 濾能股份有限公司 | MAU化學濾網演進及新世代思維 | 中文 |
| 14:00 - 14:20 | 漢科系統科技股份有限公司 | 製程尾氣微塵控制技術 | 中文 |
| 14:40 - 15:00 | 台灣蓋姆有限公司 | WHAT DO SKYSCRAPERS AND MICROCHIPS HAVE IN COMMON? FOCUS ON THE SEMICONDUCTOR INDUSTRY. | 中文 |
| 15:00 - 15:20 | 信紘科技股份有限公司 | 綠色製程：產業未來趨勢及信紘解決方案 | 中文 |
| 15:20 - 15:40 | 美商儀析科技股份有限公司 台灣分公司 | Next generation Chemical process control in Semiconductor Industry | 英文 |
| 15:40 - 16:00 | 鈺祥企業股份有限公司 | 後摩爾定律時代之AMC最佳解決方案 | 中文 |
| 16:00 - 16:20 | JACOBI CARBONS AG | Semiconductor Gas Filtration Challenge | 英文 |
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2018年9月19日 (星期四) TechXPOT 1F #K3276 |
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| 時間 | 公司 | 主題 | 發表語言 |
| 10:30 - 12:00 | 財團法人國家實驗研究院台灣儀器科技研究中心 | 「國研院先進半導體設備與製程技術」在地化成果發表會 | 中文 |
| 13:00 - 13:30 | 希鐠科技股份有限公司 | 整合性基板在異質整合平台上的應用 | 英文 |
| 13:30 - 14:00 | CONNECTEC JAPAN Corporation | Low Temp. / Low Load Flip Chip Bonding Technology | 英文 |
| 14:00 - 14:30 | 深祥發展有限公司 | 真空回流焊接改善半導體芯片焊接良率的論述 | 中文 |
| 14:30 - 15:00 | 賀利氏 | 5G: 未來手機中的電磁屏蔽 | 英文 |
| 15:00 - 15:30 | 亞智科技股份有限公司 | Manz's Solution in FOPLP RDL Formation | 中文 |
| 15:30 - 16:00 | 銦泰公司 | 倒裝芯片和BGA植球工藝的挑戰以及解決方案 | 中文 |
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TechXPOT 4F #L1316 |
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| 時間 | 公司 | 主題 | 地點 |
| 10:30 - 11:00 | 台灣檢驗科技股份有限公司 | 半導體製程化學品與汽車應用微電子產品的品質確認暨可靠性評估的新發展 | 英文 |
| 11:00 - 11:30 | 廣化科技股份有限公司 | Residue Free & Low Void — Formic Acid Vacuum Reflow Oven | 英文 |
| 11:30 - 12:00 | SilcoTek Corporation | CVD Coatings to Control Metal-Ion and Particulate Contamination | 英文 |
| 13:30 - 14:00 | 韓商穎鈦科技股份有限公司台灣分公司 | QUALITY ASSURANCE SOLUTION ON HETEROGENEOUS INTEGRATION | 英文 |
| 14:00 - 14:30 | 億合科技股份有限公司 | SmartNIL™ Nanoimprint Lithography enabling advanced functionality of optical devices for AR | 英文 |
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2019年9月20日 (星期五) TechXPOT 1F #K3276 |
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| 時間 | 公司 | 主題 | 發表語言 |
| 10:20 - 10:50 | 產業技術總合研究所奈米電子學研究部門 | Packaging in Minimal Fab | 英文 |
| 10:50 - 11:10 | 台灣斯倍利亞股份有限公司 | 低溫燒結奈米銀與全方位銲錫產品對應 | 中文 |
| 11:10 - 11:30 | 培栢艾先進材料股份有限公司 | 新耐高溫工程塑膠材料 | 中文 |
| 11:30 - 11:50 | 深圳市福英達工業技術有限公司 | 適用於半導體封裝用的超微連接材料 | 中文 |
| 13:30 - 13:50 | 達興材料股份有限公司 | Multi-functional TBDB Material Solutions for Advanced Packaging Technologies | 中文 |
| 13:50 - 14:10 | 昀鴻企業有限公司 | 銅膏進階相關應用 | 英文 |
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TechXPOT 4F #L1316 |
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| 時間 | 公司 | 主題 | 地點 |
| 10:20 - 10:40 | SEMI Taiwan 高科技廠房設施委員會 | 科技部贊助研發之高科技廠房設施消磁系統 | 中文 |
| 11:20 - 11:40 | 銳澤實業股份有限公司 | 高科技廠房&廠務規劃設計 | 中文 |
| 11:40 - 12:00 | 樂盟科技有限公司 | T1 VPD 晶圓表面系統與 HST 化學品傳輸系統。 是最新專利的晶圓與化學品的重金屬分析前級設備。 T1 VPD 據有安全且快速，設備為零背景的晶圓蝕刻法設備。 HST 可以把化學品在數分鐘內傳輸適量數十ml , 到幾百米實驗室，順利值接上ICP MS 來分析到 ppt to ppq. | 中文 |
| 14:00 - 15:40 | 社團法人台灣永續供應協會 | 台灣永續供應循環經濟聯盟 | 中文 |
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Date：Thursday, September 19th, 2019 Theme:
Chair:
Vice Chairs:
Moderator:
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誰是下一波終端產品大勢？「5G通訊」、「車用電子」與「光通訊領域」等相關應用無庸置疑的會是榜上名單。傳統矽半導體隨摩爾定律發展面臨物理極限，化合物半導體材料的高電子遷移率、直接能隙與寬能帶等特性成為下世代半導體材料的新解。「化合物半導體創新應用館」邀請到漢磊、嘉晶、穩懋、GaN Systems、IQE等廠商就「3D Sensing」、「LiDAR & RADAR」、「Powertrain」三大主題展示相關技術趨勢，並透過全新純電BMW i3s純電動車現場亮相呈現化合物半導體產業鏈及由其驅動的終端應用！
地點 : 南港展覽館1館1F (Booth #I2700)
專家開講
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Sep. 18 (Wed.) |
公司 |
主題 |
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10:50 - 11:00 |
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致歡迎詞 |
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11:00 - 11:20 |
漢磊科技股份有限公司 |
SiC市場與技術 |
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11:20 - 11:40 |
GaN Systems Inc. |
GaN & Electric Vehicles: A Small Change that’s Revolutionizing the Industry |
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11:40 - 12:00 |
工研院電子與光電系統研究所 |
雙面散熱碳化矽功率模組 |
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13:40 - 14:00 |
台灣茂矽電子股份有限公司 |
Power Semiconductor |
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15:00 - 15:20 |
瀚薪科技股份有限公司 |
新能源車用碳化矽技術發展 |
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15:20 - 15:40 |
台達電子工業股份有限公司 |
台達電動車充電解決方案 |
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Sep. 19 (Thu.) |
公司 |
主題 |
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11:00 - 11:20 |
錼創顯示科技股份有限公司 |
新世代面板技術 - MicroLED 顯示器 |
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13:40 - 14:00 |
台灣茂矽電子股份有限公司 |
Power Semiconductor |
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14:00 - 14:20 |
嘉晶電子股份有限公司 |
氮化鎵&碳化矽化合物半導體技術與現況 |
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14:20 - 14:40 |
台達電子工業股份有限公司 |
台達電動車充電解決方案 |
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Sep. 20 (Fri.) |
公司 |
主題 |
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11:00 - 11:20 |
GaN Systems Inc. |
Adapting GaN into Products we use everyday |
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11:20 - 11:40 |
工研院電子與光電系統研究所 |
高轉換效率12V-48V雙向直流變頻器開發 |
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11:40 - 12:00 |
瀚薪科技股份有限公司 |
新能源車用碳化矽技術發展 |
參展廠商
| BMW |
| 台灣茂矽電子股份有限公司 |
| 錼創顯示科技股份有限公司 |
贊助單位
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Date：Friday, September 20th, 2019 |
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date：Friday, September 20th, 2019 Chair:
Vice Chairs:
Moderator:
Outline: IC Forum is the global stage where industry leaders share their visions and perspectives on the roadmap of IC technology and how it enables various applications such as AI, quantum computing, HPC and 5G that keep advancing our industry. For this year's IC Forum, we are honored to have Microsoft, TSMC, UMC, imec and world leading equipment, materials and EDA companies to jointly address "A Big Thing in Semiconductor Industry." "A Big Thing" could be a killer application like AI or autonomous driving, a breakthrough in chip design, and it could refer to the value of IC manufacturing in materializing all the innovation of applications through technology like scaling, specialty IC, new memory and heterogeneous integration. Through IC forum, we discuss trends, innovation and next generation manufacturing technology that advance the development of human life!
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date：Wednesday, September 18th, 2019 Moderator:
Outline: The rise of new end-market applications like AI, 5G, IoT leads to the revolutions in semiconductor industry with continuous investment in leading-edge foundry and packaging technologies. Along with the growing investment, the uncertainties triggered by the rising cost of advanced node R&D and global market economy also increased. We face situation like sluggish global market, weak memory demand and intensifying trade tension. In this forum, we will cover a wide variety of market analysis from application to manufacturing, including a midyear update of trends and drivers shaping these markets, geopolitical implications on business opportunities and challenges and Taiwan's strategic position in the era of 5G & AI.
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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>> 2019年 資訊持續更新中！
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Date : Tuesday, September 17th , 2019 Outline: Human beings currently experience a fast-changing world, which is overwhelmed by artificial intelligence (AI) in all kinds of aspects, thus greatly influencing our life, and this is just the beginning. Although AI has been developed for several decades, its progress is not significant until miniaturized, high performance and cost-effective sensors available. However, there are still many challenges hindering the real implementation of AI into our life (i.e., edge or local), including handling of trillion raw data from sensors, limited bandwidth and speed of wireless communication, and insufficient capacity and calculation efficiency of cloud. As such, this brings “Edge Sensing to Edge AI for Life” to be the main theme of the 2019 SEMICON Taiwan MEMS & Sensors Forum. The invited presentations this year will unveil the state-of-the-art Edge technology and local intelligence in sensors, modules, and application scenarios, as well as their eco-systems such as edge computing, 5G communication, cloud, big data, algorithm, and AI layers, thus enabling a real Edge era. Foreseeing the trends enabled by the Edge era, the forum this year features four categories including automotive and AI/Applications/Smart Life, with excellent presentations offered by flagship companies worldwide.
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date：Thursday, September 19th, 2019
Time：13:00 - 15:00 (13:00-13:30 for registration) Venue：Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 / 攤位號#I3216, 人才培育特展, 南港展覽館一樓 Theme: How to Land on the Dream Job and Change the Future ? Outline: 為因應就業市場多元發展以及職涯上迷惘，今年特別舉辦「提升人才競爭力研討會」。藉由研討會模式，提供人才競爭力相關議題對話的平台。
本次研討會以「How to Land on the Dream Job and Change the Future ? 」為主題。一同邀請重量級講師，絡達科技股份有限公司 朱益德 人力資源處 處長、台灣美光晶圓科技股份有限公司 北亞區策略人資夥伴 劉素齡 處長、蔚華科技股份有限公司 林星福 副總經理以及東京威力科創股份有限公司 張天豪 執行副總裁分別從人力資源以及公司治理角度分別切入議題，透過不同的面向探討人才競爭力與就業市場。並針對未來就業市場的變遷及如何自我提升競爭力，進一步討論人才競爭力未來願景，共同為台灣人才發揮最大努力。
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Panel Discussion/討論主題 Moderator/主持人
Mr. Jason Chin, Senior Vice President of Executive Recruiting Consultancy Division, 104 Corporation
一零四資訊科技股份有限公司 晉麗明 資深副總經理
Panelists/與會講師
1. Mr. Yi Te Chu, HR Div. Director, Airoha Technology Corporation 絡達科技股份有限公司 朱益德 人力資源處 處長 |
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If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation. For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance |
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Date：Friday, September 20th, 2019 -Strategy Thinking in Era of Digital Transformation Outline: 因應數位世代來臨，如何建構出新世代視野成為重要課題，今年舉辦「明日領袖論壇」。藉由論壇，關注及面對數位時代來臨以及建構AI領域大藍圖為本次論壇對話主題。 |
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Panel Discussion/討論主題 Moderator/主持人
Mr. Eugene Huang, Partner, Deloitte Consulting
德勤管理諮詢 黃于峻 合夥人 Panelist/與會講師
1. Mr. Alex Cheng/鄭智成, Director, Business Consumption,Sales and marketing, Taiwan, Intel
2. Mr. Leon Lu/呂錦龍, Chief of Adm. & HR, Wistron Corporation.
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If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation. For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance |
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感謝您的支持，智慧數據國際論壇已報名額滿，請留下您的聯絡資訊，以利為您排論壇候補名單及會後寄送講師授權講義。 Date：Thursday, September 19th, 2019 Artificial intelligence is permeating everybody’s lives through the face recognition, voice recognition, image analysis and natural language processing capabilities built into their smartphones, consumer and industrial appliances. However, as traditional processors struggle to meet the demands of compute-intensive artificial intelligence applications, dedicated AI chips are playing an increasingly important role in research, development, and on the cloud and edge. With its potential market of hundreds of zettabytes and $2 trillion of on top of the existing $1.5-2B information technology industry, AI not only relies on new semiconductor architectures and compute platforms but also brings many growth opportunities for new semiconductor products where new approaches to designs are required because of the complexity of the applications that need to be supported. Join to learn these industry executives’ vision leading the way forward to a fully connected, intelligent world. |
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早鳥
(7/10-8/30)
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原價
(8/31-9/20)
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* Forum agenda is subject to change
如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date : Wednseday, September 18th , 2019 |
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早鳥
(7/10-8/30)
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原價
(8/31-9/20)
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| 會員 | 非會員 | 會員 | 非會員 |
| NTD1,800 | NTD2,250 | NTD2,250 | NTD2,700 |
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date：Friday, September 20th , 2019 According to Global Market Insights, Inc., the global digital health market was valued at USD 86 billion in 2018 and expected to grow at a CAGR of 38.8% over the next seven years, expected to reach USD 504 billion in 2025. Rapidly advancing technologies , including artificial intelligence (AI), machine learning, Robotics, IoT and wearables, etc. are impacting and accelerating health care industry. Smart MedTech can advance health care quality, improver data controls, decisions making in treatment or pharma and precision medicine, all these require the collaboration between microelectronics and health care industry. For microelectronics industry, it’s essential to understand the health care industry’s expectation and provide reliable, efficient and cost-effective solutions to increase the market size. As for health care industry, MedTech comes with immense opportunities to take advantage of latest technologies and to boost the technology advancement. The close collaboration between these two industries definitely bring the bright future for human life. The Smart MedTech forum not only initiate the communication between microelectronics industry with MedTech applications, but also accelerate semiconductor industry involvement in MedTech development and invest more resource to realize Smart MedTech.
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早鳥
(7/10-8/30)
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原價
(8/31-9/20)
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會員 |
非會員 |
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非會員 |
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Free |
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NTD2,250 |
NTD2,700 |
*Tax Included
* Forum agenda is subject to change
如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
以系統級封裝技術（SiP）結合個別晶粒、微機電系統（MEMS）、記憶體、電源管等多項獨立晶片而成的異質整合晶片（H.I. chips），將強力主宰半導體下世代關鍵發展！
「異質整合創新技術館」邀請來自中華電信、聯發科、瑞昱、日月光、矽品、力成、工研院等領導廠商共同於館中展示最具代表性的異質整合終端應用與重點技術，聚焦異質整合應用市場走向，呈現產業第一手前瞻資訊！
地點 : 南港展覽館1館1F (Booth #J3234)
參展廠商
| 公司名稱 | 展示內容 |
| 日月光半導體製造股份有限公司 | 2.5D, 3D, Fan-Out Packaging |
| 中華電信研究院 | 5G Enabling Innovative Services |
| 工業技術研究院 |
(1) High Speed SiPh Opto-electronics Measurement Platform
(2) Micro LED Chip Process and Mass Transfer Platforms
(3) 3DIC Heterogeneous Integration Process Platform
(4) Sub-THz System Laboratory
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| 工業技術研究院 |
(1) Heterogeneous Integration Platform for AITA
(2) Advance AI Heterogeneous Integration Technology
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| 聯發科技股份有限公司 | More than Moore: Heterogeneous Integration Technologies |
| 力成科技股份有限公司 | Panel Fan-Out & 3D IC Technology |
| 瑞昱半導體股份有限公司 | Full Range of Connectivity Solutions |
| 矽品精密工業股份有限公司 | Heterogeneous Integration for future Advanced Packaging Solution |
| 希鐠科技股份有限公司 |
(1) SiPlus Heterogeneous Integration platform - Integrated Substrate solutions
(2) eHDF Substrate
(3) Advance Hybrid Space Transformer
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| TechSearch | Heterogeneous Integration Market Trend |
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此場次現場座位及Room 504a同步直播區之報名踴躍，已全數額滿，報名截止。 Date：Wednesday, September 18th, 2019 Innovation is uncertain and could be risky, and yet it is also the biggest drive of technology invention and development which through the creative destruction led by innovation, we witness and experience remarkable changes and improvement of human life. Behind every innovation, there are painstaking process with countless trial and error and there are also enlightening moments of epiphany. What drives innovation to success, what we discover throughout the process and how future innovation looks like, we invite a series of distinguished speakers from worldwide leading research institute & academia who have made exceptional contributions to this industry to share their insights and visions. Facing innovative future, let’s learn, unlearn and relearn.
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date：Friday, September 20th, 2019 |
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近年來科技女性逐漸佔居一席之地，今年舉辦「科技女力論壇」。藉由論壇，分享自身成功經歷，鼓勵勇敢實踐科技夢，期望激發女性在 STEM 領域發光發熱，擁有更多自由發聲、勇於挑戰自我成長的機會。 |
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Theme/主題 Empowering Women for the Future Moderator/主持人 Dr. Tri-Rung Yew, Professor, Department of Materials Science and Engineering , National Tsing Hua University
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此場次現場座位及Room 504a同步直播區之報名踴躍，已全數額滿，報名截止。 Date：Wednesday, September 18th, 2019 SEMICON Taiwan 國際半導體展是串聯微電子與半導體產業生態圈，展示產業最新設計、製造與應用的年度產業盛會。在眾多活動中， 「科技智庫領袖高峰會」是集結全球產業領袖分享他們對產業未來的見解與願景的指標性活動。憑藉著IC發明60年間打下的厚實基礎，台灣如何能夠在面對全球競爭和變革的過程中，創造另一個輝煌的60年更是我們的使命，也是我們今年「科技智庫領袖高峰會」的主題。我們將邀請來自系統整合、IC設計、記憶體、晶圓製造、封裝測試等領域的業界領袖，及經濟部沈榮津部長主持會談，共同討論並引領台灣高科技產業走出下一個輝煌60年。 |
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If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.
For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance |
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| Display Time | Location |
| 09:00 – 17:00, September 19, 2019 | FUTURE Stage, Booth #M1148, 4F, TaiNEX 1 |
| 10:00 – 16:00, September 20, 2019 | K Zone |
| Poster Topic | Presenter | Author(s) |
| 1. Vertically Stacked GeSi GAA n-Channels on a Si Channel by CVD Epitaxy |
Chung-En Tsai |
C. W. Liu, Chung-En Tsai, Yi-Chun Liu, Yu-Shiang Huang, Fang-Liang Lu, and Hung-Yu Ye |
| 2. Atomic Layer Technologies: Atomic Layer Annealing, Bombardment, Crystallization, Densification, Epitaxy, and Etching | Miin-Jang Chen | Yu-Tung Yin, Miin-Jang Chen |
| 3. Reliability Improvement of HfO2-based Ferroelectric Memory by Interface Engineering | Yung-Hsien Wu | Kuen-Yi Chen, Pin-Hsuan Chen, Ruei-Wen Kao, Chuan-Pu Chou, Yan-Xiao Lin, Yan-Hua Huang and Yung-Hsien Wu |
| 4. High Sensitivity Ion Detector by 16nm FinFET CMOS Technology | Chien-Ping Wang | Chien-Ping Wang |
| 5. The Interface Electrical Properties of Tens-of-Nanometer Thick Graphene on Few-Layer MoS2 Flakes | Hao-Wei Tu | Hao-Wei Tu, Chin-Lung Lin, Jing-Jia Lin, Wen-Bin Jian, Chenming Hu |
| 6. Large-Scale Growth of Two-Dimensional Materials toward Phase-Engineered Hybrid Films | Ling Lee | Ling Lee(李寧), and Yu‐Lun Chueh(闕郁倫) |
| 7. Dielectric Properties Measurement Technology of Material in mmWave Application | Chun An Lu | Chiung Hsiung Chen, Chun An Lu, Yi Chen Wu, Cheng Ping Lin, Kyoko Nishidono |
| 8. From wafer to solution: Organic impurities analysis strategy in advanced node | Po-Cheng Chen | Po-Cheng Chen, Hao Chang, Edward Chan, C.R.Liang, Chunghsi Joe Wu |
| 9. Material impurity control: The staples of the quality assurance | Shu-Hua Chou | Shu-Hua Chou, Yi-Hsiu Hsiao, Chunghsi Joe Wu |
| 10. Importance of electrostatic discharge (ESD) at advanced semiconductor materials manufactory | Yu-Lun Hsiao | Yu-Lun Hsiao, Chung-Yu Lin, Joe Wu, Y.K. Fan, W.C Yang, |
| 11. A Novel Metal Gate Protective Film and Device Structures Thereof | Chandrashekhar Prakash SAVANT | Chandrashekhar Prakash SAVANT, Tien-Wei YU, Chia-Ming TSAI |
| 12. Material Quality Roadmap | Ming-Yuan Lin | Ming-Yuan Lin, Ming-Hsi Sung , Liang-Chen Chi, Chunghsi Joe Wu |
| 13. CMR Screening in semiconductor manufacturing chemicals | Zack Su | Zack Su, Zoe Chung, C.F. Wang , Shih-Hao Wang |
| 14. History and Development of Trace Metal Impurities Analysis Technology
toward Semiconductor advance process |
Heng-Yan Liu | Heng-Yan Liu, Takuya Morimoto, Sylvia Huang, Henry Tseng, Jerry Lu |
| 15. Real-time measurement of precursor vapor concentration using the non-dispersive Infrared spectroscopy | Masakazu Minami | M. Minami and Dr. YL Tsai |
| 16. AlN Removal Formulation with modified anisotropic silicon etching property | Chung Yi Chang | Chung Yi Chang, Wen Dar Liu, Yi Chia Lee, John G Langan, Tianniu Rick Chen, Aiping Wu , Hung-Yu Chen |
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Date：Thursday, September 19th, 2019 Chair:
Vice Chairs:
Moderator:
Outline: (TBD)
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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聚焦「異質整合先進封裝及智慧製造在5G及AI時代的技術突破及應用機會」、「先進封裝技術實現高密度高效能運算」、「系統級封裝異質與同質整合技術趨勢」等主題，台積電、日月光、矽品、美光、力成、Amkor、ASMPT、Camtek、imec、Lam Research、SPTS、UCLA 帶您了解下世代先進封裝技術
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因報名踴躍，本場次已額滿並關閉線上報名，如欲參與，可至現場候位。 Date：Wednesday, September 18th, 2019 Forum Chair:
Moderator:
Outline:TBD |
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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感謝您的支持，量子電腦論壇已報名額滿，請留下您的聯絡資訊，以利為您排論壇候補名單及會後寄送講師授權講義。 Date：Thursday, September 19th, 2019 The first quantum revolution is that scientists and tech engineers use the rules of quantum mechanics to build devices including the transistor, the laser, integrated circuit etc. The second quantum revolution is that we are directly using quantum machine including quantum sensor, quantum information and quantum computer. The quantum computer bases on quantum mechanics and gives the new computing that promise to solve some of the currently intractable problems. Quantum computer had a lot of potential applications including predictions of new medicine and new material, optimization, quantum machine learning for Artificial intelligence, financial problems, cryptography and so on. The first commercial quantum computer has been established by IBM in this year and it is can be predict that the quantum computer will be rapid development. Also recent two years more than hundred private and startup companies have been found. It is time to connect the future, the quantum era. |
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早鳥
(7/10-8/30)
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原價
(8/31-9/20)
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| 會員 | 非會員 | 會員 | 非會員 |
| Free | Free | Free | Free |
| Organizer: | ||
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| Media Partner : | ||
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| * Forum agenda is subject to change | ||
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date：Thursday, September 19th, 2019 第四次工業革命最近在技術進化的地平線上爆發式地點燃了人工智慧(AI）之應用。 許多人一定對［人工智慧能為智慧廠房設施做什麼？］感到好奇。 2019年高科技設施國際論壇旨在將邀請 IBM 和 nVidia 的前瞻願景家與其他全球專家齊聚一堂，討論如何在世界上最先進的智慧廠房中引入實施人工智慧(AI）。 隨著每一代新智慧廠房的興建和營運，都會發展出更先進的人工智慧，並提供半導體製造持續提昇改進之廣闊基礎。 當其結果變得可行且明顯時，這就有迫切的需要去多加瞭解人工智慧道理，並務實地實施其技術，俾以提昇高科技廠房設施之智慧化。 今年的論壇旨在向與會者提供最新的人工智慧的應用和其趨勢。
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| 【NEW!】2019 論壇 Highlight 請至 http://www.htftaiwan.org/ | ||||
*Tax Included |
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| 高科技廠房設施貴賓晚宴 | ||||
| Time : 18:00 - 21:00 | ||||
| Venue：Ballroom, 3F, TaiNEX 1 / 台北南港展覽館一館 3樓 燴館宴會廳 | ||||
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| 早鳥價 (7/10-8/30) |
原價 (8/31-9/20) |
| NTD 3,200 | NTD 4,200 |
*Tax Included
如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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Date：Wednesday, September 18th, 2019 Forum Chair:
Moderators:
Outline: We are in the way towards Industrial 4.0, which requires Smart Manufacturing technologies and applications to achieve our digital transformation goal. |
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*Tax Included |
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| * Forum agenda is subject to change | ||||||||||||||
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如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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因報名踴躍，本場次已額滿並關閉線上報名，如欲參與，可至現場候位。 Date：Wednesday, September 18th, 2019 Outline : In conjunction with SEMICON Taiwan 2019, the Sustainable Manufacturing Committee of SEMI Taiwan is organizing an event to provide insights on the latest products and technologies, regulations, technical standards, business continuity plan (BCP), business continuity management (BCM), energy conservation, circular economy and cyber security. The Sustainable and Circular economy Forum will showcase the expertise and capabilities of companies and speakers from around the word by addressing a wide variety of energy conservation and risk management issues for high tech sustainable manufacturing. The topics includes environmental protection, BCP/BCM, energy conservation, circular economy, occupational health and safety, information and operation security which affect sustainable manufacturing. |
| 早鳥價 (7/10-8/30) |
原價 (8/31-9/20) |
SEMI 會員價 (7/10-9/20) |
團報價 (7/10-9/20) |
| 免費 | 免費 | 免費 | 免費 |
*Tax Included
Sponsored by:
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* Forum agenda is subject to change
如因天災、事變或其他不可抗力因素(如：颱風、地震)，主辦單位得調整活動內容，甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知，另行於官方網站公告相關事宜。
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聯絡人
SEMI Taiwan
李小姐 Lily Lee
TEL: 886.3.560.1777 EXT. 509
Email: llee@semi.org
