As high performance computing, automotive electronics, 5G communications, IoT and AR/VR applications are rapidly growing, their requirements for smaller form factors, higher data rates, low power and cost reduction will significantly increase the adoption of advanced packaging technologies. Researchers at Yole Développement estimated that overall revenues of the advanced packaging industry will enjoy a 7% CAGR between 2016 and 2022. Fan-out (FO) will be the fastest growing advanced packaging platform, registering a 36% CAGR between 2016 and 2022. By 2022, the FO packaging market will grow to over US$3 billion.
In view of this market trend, SEMICON Taiwan 2020 will include an exhibition area for FO packaging for the first time where local and foreign vendors can demonstrate manufacturing equipment, materials and components that are critical to FO packaging process.
SEMICON Taiwan 2020 Fan Out Packaging Pavilion Exhibitors
|I2816||E and R Engineering Corporation|
|I2822||TechMax Technical Co., Ltd.|
|I2828||TA LIANG Technology Co., LTD.|
|I2923||Mingkun Technologies Co., Ltd.|
|I2928||Manz Taiwan Ltd.|
|I3023||Takano Co., Ltd.|
|J2834||Utechzone Co., Ltd.|
|J2838||Industrial Technology Research Institute - ITRI|
|J2934||Horng Terng Automation Co., Ltd.|