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Programs Catalog

Special Features Grand Ballroom, 3F, Grand Hyatt Taipei Wednesday, September 23
6:00pm to 9:00pm
Room 505a, 5F, TaiNEX 1 Friday, September 25
8:20am to 4:30pm

2020 Content will be updated continuously!

Date:Friday, September 25th, 2020
Time:08:50 - 16:30 (08:20-08:50 for registration)
Venue:Room505a, 5F, TaiNEX 1/ 南港展覽館一館5樓 505a會議室 

Forum Chairs:

  • Dr. Cheng-Wen Wu, Executive Vice President, NCKU;Senior Vice President, General Director of Southern Region Campus, ITRI / Co-chair of SEMI Taiwan Testing Committee
  • Mr. CJ Hsieh, General Manager, INTEL Innovation Technologies Ltd./ Co-chair of SEMI Taiwan Testing Committee

Forum Vice Chair:

  • Ms. Wendy Chen, Associate Vice President, KYEC/ Vice Chair of SEMI Taiwan Testing Committee

Moderators: 

  • Mr. Roger Hwang, Senior Director, ASE Group
  • Dr. Ching Cheng Tien, CTO, Sigurd Corporation

Theme: Next generation test architectures and systems for AIoT and 5G
Outline: 

  • Taiwan became the spot light of Semiconductor Manufacturing supply chains center.  The most advanced innovative process of Semiconductor and  creative IC design structure be realized and succeeded mass production fulfill the blooming applications in new generation communication, intelligent transportation , advance medical technologies and smart manufacture.  However , the challenges are coming along with how to ensure the manufacturing procedure could have high  production yield .  Therefore the advance test technologies are getting important and also can’t stick in the traditional testing concepts. As we know, the high percentage of test systems were composed of semiconductor IC. This traditional concepts of test system will induce a lot of problems which come from using old generation of technologies to verified novel IC with new generation of technologies.  The breakthrough test architecture and methods should be take into account with brainstorming . 
  • In this 2nd Advance Test Forum , the main theme was steamed from this concept as “The Next Generation Test Architecture and System for AIOT and 5G “ and invited specialists from the leading edge of Semiconductor supply chains to share their viewpoints. At the same time, lots of  academic researcher and professor also will participate this event together through the corporation with IEEE International Test Conference Asia which will be hold at Taiwan this year. The 2nd Advance Test Forum will be positioned as Corporate Session of IEEE International Test Conference Asia and arranged at the best part of finale to show up the best industrial practices for enriching this great event.
早鳥價
(7/13-8/31)
原價
(9/1-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)

學生價 (不含EMBA)
(7/13-9/25)

NTD2,500 NTD3,150

NTD2,500

5人以上享NT$2180

NTD800
*Tax included
 
 
Sponsored by:
         
 
* Forum agenda is subject to change
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.
 
         
         
 
     
     

 

View Full Agenda
Wednesday, September 18
4:00pm to 4:10pm
Wednesday, September 18 9:00am
Ms. Pola Chang
Director of Public Affairs Department
104 Corporation
Mr. Eddie Chung
Consultant of Headhunter Business Group
104 Corporation
Ms. Vivi Wong
Director of Customer Value Management
104 Job Bank
K3076, 1F, TaiNEX 1  Wednesday, September 23
10:30am to 12:00pm

Date:Wednesday, September 23th , 2020
Time:10:30 – 12:00 (10:10-10:30 for registration)
Venue: K3076,1F,TaiNEX 1 

10:10-10:30 Registration

10:30-11:00 Talent Recruiting and Workplace in Semiconductor Industry

  • Ms. Pola Chang, Director of Public Affairs Department, 104 Corporation

11:00-11:30 Key Elements to Start your Career in Semiconductor Industry

  • Mr. Eddie Chung, Consultant of Headhunter Business Group, 104 Corporation

11:30-12:00 Tips for Interviews: Do’s and Don’ts

  • Ms. Vivi Wong,  Director of Customer Value Management, 104 Job Bank

 

*Forum is conducted in Chinese

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

 

View Full Agenda
Mr. Isaac Liang
Director
Spring Professional Taiwan
Mr. Gary Cheng
Senior Manager
Spring Professional Taiwan
Ms. Noelle Ni
Executive Assistant
Spirox Corporation
Ms. Gloria Lin
Director, Human Resources and Administration Division
Sigurd Microelectronic Corporation
K3076, 1F, TaiNEX 1  Thursday, September 24
10:30am to 12:00pm

Date:Thursday, September 24th , 2020
Time:10:30 – 12:00
Venue:K3076,1F,TaiNEX 1 

10:10-10:30 Registration

10:30-11:00 Communication Between Generations in the Workplace

  • Mr. Isaac Liang, Director, Spring Professional Taiwan

11:00-12:00 Panel Discussions: Leading the Future- to maximize the communication between generations in semiconductor industry

Moderator:

  • Mr. Gary Cheng, Senior Manager, Spring Professional Taiwan

Panelists:

  • Ms. Noelle Ni, Executive Assistant, Spirox Corporation 

  • Ms. Gloria LIn, Director, Sigurd Microelectronic Corporation

* Forum is conducted in Chinese

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

 

View Full Agenda
Thursday, September 19
4:15pm to 4:45pm

As silicon chips are reaching their limits, compound semiconductor seems to be the answer to the industry future! Compound Semiconductor Innovation Zone invites leading companies including Episil, Epi, WIN Semiconductors, GaN Systems, IQE to present the latest trend on 3D Sensing, LiDAR & Radar and Powertrain. Meanwhile, BMW i3 will be showcased at the scene to demonstrate the autonomous applications of compound semiconductor! (READ MORE)

Venue : Booth #I2700, 1F, TaiNEX 1 

 

MEET TEH EXPERT

Wednesday, September 23, 2020

Time Topic Company Language Slides
10:40 - 11:20 Opening Remarks      
11:00 - 11:20 Fire Up GaN-Based Semiconductor by Optimizing The Substrate Wafer Works Corporation Mandarin N/A
11:20 - 11:40 Opportunities and Challenges in High-Volume Production of Wide-Bandgap Power Technologies Applied Materials Mandarin N/A
11:40 - 12:00 TRANSFORMING THE WORLD: High Power, Small, Efficient Chargers with GaN GaN Systems Inc. English N/A
13:40 - 14:00 Advanced Telecom Power in 5G Era Delta Electronics, Inc. Mandarin Download
14:00 - 14:20 FET 5G Journey- 5G PN Cornerstone of Vertical Services Far EasTone Telecommunications Co., Ltd. Mandarin N/A
14:20 - 14:40 Modularization Technology Trend of High Frequency/ Power Semiconductor Devices Industrial Technology Research Institute Mandarin N/A
14:40 - 15:00 Hexawave Brief & GaN HEMT Device Technology Introduction Hexawave, Inc. Mandarin Download
15:00 - 15:20 Far EasTone Telecommunications Co., Ltd. FET 5G friDay Video and VR Experience Mandarin N/A

 

Thursday, September 24, 2020

Time Topic Company Language Slides
11:00 - 11:20 MOCVD Technology Enabling GaN on Si Power/RF Application AIXTRON Mandarin Download
11:20 - 11:40 The Opportunity of Compound Semiconductor Electronics Device for 5G and Next Generation Power Device United Microelectronics Corporation Englsih N/A
11:40 - 12:00 FET 5G friDay Video and VR Experience Far EasTone Telecommunications Co., Ltd. Mandarin N/A
14:00 - 14:20 Realize Compound Semiconductor Potential!  Unikorn Semiconductor Corp. Mandarin Download
14:20 - 14:40 Modularization Technology Trend of High Frequency/ Power Semiconductor Devices Industrial Technology Research Institute Mandarin N/A

 

Thursday, September 25, 2020

Time Topic Company Language Slides
11:20 - 11:40 Opportunities and Challenges in High-Volume Production of Wide-Bandgap Power Technologies Applied Materials Mandarin N/A
11:40 - 12:00 FET 5G friDay Video and VR Experience Far EasTone Telecommunications Co., Ltd. Mandarin N/A
14:30 - 15:00 Jing Jing Lucky Draw       

Meet the Expert Presentation Material can be downloaded until 11/30 (Mon.)!

 

SPONSORS 

                                          
 
         

                                 

View Full Agenda
Special Features Booth #2700, Compound Semiconductor Innovation Zone, 1F, TaiNEX 1 Wednesday, September 23
10:50am to 3:40pm
Special Features Booth #2700, Compound Semiconductor Innovation Zone, 1F, TaiNEX 1 Thursday, September 24
11:00am to 2:40pm
Special Features Booth #2700, Compound Semiconductor Innovation Zone, 1F, TaiNEX 1 Friday, September 25
11:00am to 12:00pm
Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 17
9:00am to 5:00pm
SiP Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 19
9:00am to 4:25pm
SiP Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 20
9:00am to 4:25pm
Special Features 1F & 4F, TaiNEX 1 Wednesday, September 23
10:00am to 5:00pm
Special Features 1F & 4F, TaiNEX 1 Thursday, September 24
10:00am to 5:00pm
Special Features 1F & 4F, TaiNEX 1 Friday, September 25
10:00am to 4:00pm
Special Features Booth #I2013a, 1F, TaiNEX 1 Friday, September 25
12:30pm to 1:30pm
Special Features Room 504bc, 5F, TaiNEX 1 Thursday, September 24
8:50am to 4:50pm
Room 504bc, 5F, TaiNEX 1 Thursday, September 24
9:20am to 4:50pm

 

Date:Thursday, September 24th, 2020
Time:09:20 – 16:50 (09:20-09:40 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 

  • Flexible Hybrid Electronics (FHE) are high-performance, integrated devices with curved, stretchable, bendable and variable in form factor. According to IDTechEx, it will grow from $31.7 billion to $77.3 billion in 2029 and will revolutionize the industry of electronics and gadgets by providing entirely modern and futuristic flexible, smart-looking, and transparent devices and products with enhanced performance.
     
  • Recent development on the semiconductors, displays and sensors with an extremely thin form factor and their integration on and in flexible substrate using new materials and cost-effective processing techniques, have enabled numerous futuristic applications such as smart system for sport, wellness and mHealth, wearable systems, transportation, smart cities, and IoT to achieve a smarter world.
     
  • FLEX Taiwan brings a wealth of speakers worldwide and with informative sharing on the newest technology and application.

     

  • With more possible applications that FHE can apply, it shaped our future and brings the revolution in many ways. Come to FLEX Taiwan 2020 to image the FLEXBILE future.

 

Early-Bird
(07/13-09/04)
Original
(09/05-09/25)
Group-Early-Bird
(more than 5 ppl)
(07/13-09/04)
Group-Original
(more than 5 ppl)
(09/05-09/25)
Student
(EMBA Excluded)
(07/13-09/25)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member -
NTD4,000 NTD5,000 NTD5,500 NTD6,875 NTD3,600 NTD4,500 NTD4,500 NTD5,625 NTD1,200

*Tax Included

 

Organizer : 
 

    

 

                    

Co-organizer : 
 

      

 

   

Sponsored by : 
 

          

 

Exhibitor : 
 
                                                                                                           

                                  

       
    

 

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
View Full Agenda
#K2988, ITRI, 1F, TWTC Nangang Exhibition Hall Thursday, September 19
2:00pm to 2:50pm
Special Features Room 507, 5F, TaiNEX 1 Thursday, September 24
1:30pm to 4:30pm

Outgrow to Next Era! Heterogeneous Integration Innovation Zone will present you the key approach and terminal application on HI technology, ASE and other industry players from 5G, IC design, packaging, and silicon photonic fields to showcase the latest trend and the possible future of AI Chips!

Venue : Booth #I3016, 1F, TaiNEX 1 

 

Brought to you by

 

 

 

 

 

Fan-Out Packaging Technology Seminar

Wednesday, September 23, 2020

Venue : Booth #I3016, 1F, TaiNEX 1 

Orgnizer:

Co-Orgnizer:

Register Now

 

Time Topic Speaker
13:00-13:30 Registration  
13:30-13:40 Welcome Remarks  
13:40-14:10 Recent Progress of Chiplets Integrated Packages in Semiconductor Industry Mr. Key Chung, Senior Director, Siliconware Precision Industries Co., Ltd.
14:10-14:40 Laser & Plasma Applications Employed in Fan-Out Assembly Processes E&R Engineering Corp.
14:40-15:10 Manz Novel Plating Solutions for FOPLP RDL Formation Mr. Eric Cheng, Department Manager, Manz Taiwan Ltd.
15:10-15:40 Advanced Packaging Market Trend (TBC) Mr. Favier SHOO, Technology and Market Analyst, Yole Développement

 

 

Meet the experts

Thursday, September 24, 2020

Venue : Booth #I3016, 1F, TaiNEX 1 

Time Topic Company Language
14:00 - 14:30 Heterogeneous Integration Technology and Development  AI on Chip Taiwan Alliance Mandarin
14:30 - 15:00 FET 5G Journey- Drive cross-domain Opportunities Far EasTone Telecommunications Co., Ltd.  Mandarin
15:00 - 15:30 Booming LifeSense®* Age Fueled by AI-on-Chips and Tackling COVID Hardships Etron Technology Inc. English

 

 

Fan-out Packaging Get Together (By Invitation Only)

Friday, September 25, 2020

Venue : Booth #I3016, 1F, TaiNEX 1 

Time: 12:30-13:30 (Registration at 12:20)

 

 

 

View Full Agenda
Room 500, 5F, TaiNEX 1  Thursday, September 24
9:30am to 12:30pm

Innovation is what it takes to stay ahead and deliver best results. Corporates need to evolve quickly to keep up with the changes caused by digitization and disrupt technologies. Aside from internal R&D, the global semiconductor industry is increasingly using M&A , corporate venturing and other external innovation approaches to access new technologies and accelerate innovation.

As such, SEMI, partnering with Taiwania Capital  and Taiwan Tech Arena (TTA), presents Hi-Tech Corporate Growth & Innovation Forum at SEMICON TAIWAN 2020. We invite thought leaders, corporate venturing professionals and entrepreneurs to share their perspectives, engaging C-level executives and startup founders in discussions on how to embrace the unknown and venture into the future. A dozen of select startups are also invited to introduce technologies potentially to unleash breakthrough innovations in the industry.

ㄧInformation

Date:Thursday, September 24th, 2020
Time:09:30 – 12:30 (09:30-09:50 Registration)
Venue:Room 500, Taipei Nangang Exhibition Center 1 (5F)

 

ㄧContactㄧ

This event is by-invitation-only, for more information please contact Ms.Lin

([email protected]).

 

 * Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.
For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance
 
 
 
 
 
 
 
 
 
View Full Agenda
Room 500, 5F, TaiNEX 1 Thursday, September 24
1:30pm to 5:30pm

 

Innovation is what it takes to stay ahead and deliver best results. Corporates need to evolve quickly to keep up with the changes caused by digitization and disrupt technologies. Aside from internal R&D, the global semiconductor industry is increasingly using M&A , corporate venturing and other external innovation approaches to access new technologies and accelerate innovation.

As such, SEMI, partnering with Taiwania Capital and Taiwan Tech Arena (TTA), presents Hi-Tech Corporate Growth & Innovation Forum at SEMICON TAIWAN 2020. We invite thought leaders, corporate venturing professionals and entrepreneurs to share their perspectives, engaging C-level executives and startup founders in discussions on how to embrace the unknown and venture into the future. A dozen of select startups are also invited to introduce technologies potentially to unleash breakthrough innovations in the industry.

ㄧInformationㄧ

Date:Thursday, September 24th, 2020
Time:13:30 – 17:30 (13:30-13:50 Registration)
Venue:Room 500, Taipei Nangang Exhibition Center 1 (5F)

 

ㄧContactㄧ

This event is by-invitation-only, for more information please contact Ms.Lin

([email protected]).

 

 

 * Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.
For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance
 

 

 

 

 

 

 

 

View Full Agenda
Special Features Booth #L0100a, 4F, TaiNEX 1 Thursday, September 24
12:30pm to 1:30pm
High-Tech Facility International Forum Room 402abc, 4F, TaiNEX 1 Thursday, September 24
8:30am to 5:30pm

Date:Thursday, September 24th, 2020
Time:08:30 - 17:30 (08:30-09:00 for registration)
Venue:Room 402abc, 4F, TaiNEX 1
Theme: Intelligent Solutions Shaping Future Facilities in 5G Era​
Outline: (TBD)

 

 

 

【NEW!】2019 Forum Highlight: http://www.htftaiwan.org/
 
Forum Agenda:  http://www.htftaiwan.org/2020-forum.html
 
Early-bird
(7/13-8/31)

Original
(9/1-9/24)

Academia
(7/13-9/24)
NTD 4,200 NTD 4,600 NTD 800

*Tax Included

 
 

 

VIP Banquet 
Time : 18:00 - 21:00 
Venue:Ballroom, 3F, TaiNEX 1
 
 
Early-bird
(7/13-8/31)
Original
(9/1-9/24)
NTD 3,200 NTD 4,200
*Tax Included

 

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

View Full Agenda
Special Features Room 402abc, 4F, TaiNEX 1 Thursday, September 24
8:30am to 5:30pm
Special Features Room 401, 4F, TaiNEX 1 Friday, September 25
9:00am to 3:55pm
Room 401, 4F, TaiNEX 1 Friday, September 25
8:30am to 4:40pm

Date:Friday, September 25th, 2020
Time:08:30 - 16:40 (08:30-09:00 
for registration)
Venue:Room 401, 4F, TaiNEX 1

Theme: Key Advanced Technologies Enabling 5G, AI and Beyond

Chair:

  • Dr. John Lin, Director, Taiwan Semiconductor Manufacturing Company Ltd./ Chairman, SEMI Taiwan IC Committee

Vice Chairs:

  • Mr. G.C. Hung, Vice President, United Microelectronics Corporation/ Vice Chairman, SEMI Taiwan IC Committee 
  • Mr. Rutgers ChowEVP Worldwide Sales, SPTS Technologies, A KLA CompanyVice Chairman, SEMI Taiwan IC Committee

Moderator:

Outline: 

Semiconductor Technologies are key enablers of 5G and AI and play a vital role in delivering a world of on-demand experiences and continuous connectivity. As we enter a new decade and the Information Era, semiconductor devices and their many applications continue to serve as the growth engine for the semiconductor industry. IC designers, producers and semiconductor companies need to prepare for 5G’s opportunities and harnessing the benefits of employing AI in chip design to building collaborative ecosystems and supply chains, to identifying future use cases 5G will enable.

At the upcoming SEMICON Taiwan, the IC Forum will feature exciting topics around 5G mmWave technologies, smart chip design, process technologies for 5G and beyond, materials innovation, latest on patterning with the EUV and EUV assisted materials/technologies, and so on. Scaling factors and key enabling technology challenges will be discussed and solutions to address these challenges will also be presented.

Renowned experts in the industry are invited to share their perspectives and discuss the vast commercial opportunities for the electronics industries and semiconductor supply chain in this new and exciting era.

 

 
Early-bird
(7/13-9/4)
Original
(9/5-9/25)
SEMI Member
(7/13-9/25)
Group Registration
(7/13-9/25)
Academia 
(EMBA Excluded)
(7/13-9/25)
NTD 3,200 NTD 4,000 NTD 3,200

Extra 10% discount
(More than 5 people)

NTD 800

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 

 
 

    * Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

 

 

       

 

 

View Full Agenda
Special Features Room 501, 5F, TaiNEX 1 Thursday, September 24
9:00am to 12:10pm
IoT Room 402ab, 4F, TWTC Nangang Exhibition Hall Wednesday, September 18
9:00am to 12:00pm
Special Features Room 505abc, 5F, TaiNEX 1 Wednesday, September 23
1:30pm to 4:50pm
Special Features Room 505abc, 5F, TaiNEX 1 Thursday, September 24
9:00am to 5:00pm
Special Features Room 505abc, 5F, TaiNEX 1 Friday, September 25
9:00am to 5:00pm
Room 505abc, 5F, TaiNEX 1 Wednesday, September 23
1:30pm to 4:20pm

Date:Wednesday, September 23rd, 2020
Time:13:30 - 16:20 (08:30-13:30 for registration)
Venue:Room 505abc, 5F, TaiNEX 1

To know more about ITC-Asia, please visit our wesite!

Click here for ITC-Asia 2020 registration!

 

 

*Tax included

 
Co-organized by:
 
 
Sponsored by:
Daimond
 
 
       
         
 
Platinum
 
 
         
 
Gold
 
 
     
         
 
Advanced Testing Forum Sponsor
* Forum agenda is subject to change
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.
 
 
           
           

 

View Full Agenda
Room 505abc, 5F, TaiNEX 1 Thursday, September 24
8:50am to 4:20pm

Date:Thursday, September 24th, 2020
Time:08:50 - 16:20 (08:20-08:50 for registration)
Venue:Room 505abc, 5F, TaiNEX 1
Theme: TBD

Outline: Coming soon!

To know more about ITC-Asia, please visit our wesite!

Click here for ITC-Asia 2020 registration!

 

 

*Tax included

 
Co-organized by:
 
 
Sponsored by:
Daimond
 
 
       
         
 
Platinum
 
 
         
 
Gold
 
 
     
         
 
Advanced Testing Forum
* Forum agenda is subject to change
 
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

 
 
         
         
         

 

 

View Full Agenda
Room 505abc, 5F, TaiNEX 1 Friday, September 25
8:50am to 4:05pm

2020 Content will be updated continuously!

Date:Friday, September 25th, 2020
Time:08:50- 16:05 (08:20-08:50 for registration)
Venue:Room505abc, 5F, TaiNEX 1

To know more about ITC-Asia, please visit our wesite!

Click here for ITC-Asia 2020 registration!

 

 

 

*Tax included

 
Co-organized by:
 
 
Sponsored by:
Daimond
 
 
       
         
 
Platinum
 
 
         
 
Gold
 
 
     
         
 
Advanced Testing Forum Sponsor
* Forum agenda is subject to change
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.
 
         
         
         
 
     
     

 

View Full Agenda
Thursday, September 19 9:00am
Special Features Room 401, 4F, TaiNEX 1 Wednesday, September 23
1:20pm to 5:00pm
Room 401, 4F, TaiNEX 1 Wednesday, September 23
1:20pm to 5:00pm

 

Date:Wednesday, September 23rd, 2020
Time:13:20 - 17:00 (13:20-13:40 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室

Theme: 5G x AI = Infinite Opportunities enabled by Semiconductor / 5G x AI 半導體產業大未來

Outline: 
With the dynamic development of applications like mobility, connectivity and computing led by AI and 5G, semiconductor is the key of enabling all the major innovations.  Meanwhile, the severe pandemic impact, the ever-changing geopolitics, and the growing global coopetition make semiconductor and its ecosystem strategically vital.  Taiwan, at the core of this global industry, leads the way through cutting-edge technology, manufacturing capability and symbiotic collaboration with worldwide pioneering semiconductor and application leaders.  With this forum, we invite leaders from Taiwan, US and Europe to explore and envision that at this unprecedented era when risk and opportunity co-exist like never before, how semiconductor continuously leads the countless innovations like 5G & AI technologies and how 5G & AI, in return, empower semiconductor industry for its sustainable competitiveness.

 
 
早鳥價
Early-bird
(7/13-9/4)
原價
Original
(9/5-9/25)
SEMI會員價
SEMI Member
(7/13-9/25)
團報價
Group Registration
(7/13-9/25)
學生價(不含EMBA)
Academia
(EMBA Excluded)
(7/13-9/25)
NTD3,000 NTD3,750 NTD3,000 Extra 10% discount
(More than 5 people)
NTD800

*Tax Included

 
 

 

 

Sponsored By: 

    
     

 

 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。

主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 
       
       
       

 

 

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Wednesday, September 18 10:50am
Special Features Room 504bc, 5F, TaiNEX 1 Tuesday, September 22
8:30am to 4:15pm
Room 504bc, 5F, TaiNEX 1 Tuesday, September 22
8:30am to 4:15pm

 

Date : Tuesday, September 22nd ​, 2020
Time :  08:30 – 16:15 (8:30-8:50 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 

Theme : Healthcare/Environmental Sensors For A Better Life

2020 becomes a very challenging and tough year for all human beings since unexpected COVID-19 virus rapidly spreads worldwide and without doubts puts catastrophic effects on earth, which significantly damages the life and public health, medical systems, transportation, economics, and even our daily life pattern.

Till now, there’s no effective solution, such as medication and vaccine, to the epidemic and we might have to live with it for a long time. As a result, the sensor society and industry are expected to play an important role on this battle against the virus, and this brings “Healthcare/Environmental Sensors for a Better (Real) Life” being the main theme of 2020 SEMICON Taiwan MEMS & Sensors Forum.

In connection with this topic, the forum will invite experts from leading company  to share their perspective about system & application, advanced sensor device including environmental monitoring sensor, ultrasonic diagnostic instrument, spectrometer…etc, manufacturing & material and market trend about life science. This event would be a great platform to mingle with experts and foster cross industry collaborations.

 

 

Early-Bird
(07/13-09/04)
Original
(09/05-09/25)
Group-Early-Bird
(more than 5 ppl)
(07/13-09/04)
Group-Original
(more than 5 ppl)
(09/05-09/25)
Student
(EMBA Excluded)
(07/13-09/25)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member -
NTD1,800 NTD2,250 NTD2,500 NTD2,900 NTD1,620 NTD2,025 NTD2,250 NTD2,610 NTD800

*Tax Included

 

Organizer :

    

 

            

Sponsored by : 
 

                   

     

 

Cooperation Media : 
 

  

   
     
* Forum agenda is subject to change    
     
     

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 

 

            

 

 

   

           

 

 

 

 

View Full Agenda
Special Features Room Happiness, 3F, TaiNEX 1 Tuesday, September 22
12:00pm to 1:30pm
Thursday, September 19
1:20pm to 1:30pm
Thursday, September 19
4:30pm to 5:00pm
Wednesday, September 18 9:00am

2019 Coming Soon!

View Full Agenda
Special Features Luxury Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 24
12:00pm to 1:30pm
Special Features Luxury Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 24
8:50am to 4:15pm
Power & Optoelectronics Semiconductor Luxury Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 24
8:20am to 4:50pm

 

Date:Thursday, September 24th, 2020
Time:08:20 - 16:50 (08:20-08:50 for registration)
Venue:
Luxury Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park

Theme: Compound Semiconductor’s Killer Applications, Challenges and Opportunities

Chair:

  • Mr. Brian Lee, CSO, Win Semiconductors Corp./ Chairman, SEMI Taiwan Power & Compound Semiconductor Committee

Vice Chairs:

  • Dr. Yi-Cheng Cheng, General Director, National Chung-Shan Institute of Science & Technology/ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee
  • Mr. Andy Chuang, President, Episil Technologies Inc./ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee
  • Dr. Barry Jia-Fu Lin, CTO, Wavetek Microelectronics Corporation/ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee

Moderator:

  • Morning Session: Mr. Andy Chuang, President, Episil Technologies Inc./ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee
  • Afternoon Session: Dr. Barry Jia-Fu Lin, CTO, Wavetek Microelectronics Corporation/ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee

Outline:

  In the past decade, compound semiconductor came out from the big shadow of silicon and now it has taken the center stage of several killer applications which will impact our daily life in the future. Among them, TRx for 5G communication, Lidar for automotive, 3D sensing for industrial machine and security, and WGB (wide band gap) FET for efficient power conversions are the key focus areas.

  In this session, we will take you to understand the technical challenges faced today and to foresee the killer applications. Meanwhile, our view points of solutions will be provided in terms of device & circuit designs, tool developments, packaging techniques and system integrations. World leaders in this industry will give you deep & insightful discussions. Definitely, the session will not be concluded without an in-depth market trend presentation by a leading consulting firm.

 
 
 
 
 
Early-bird
(7/13-9/4)
Original
(9/5-9/25)
SEMI Member
(7/13-9/25)
Group Registration
(7/13-9/25)

Academia 
(EMBA Excluded)
(7/13-9/25)

NTD 3,200 NTD 4,000 NTD 3,200

Extra 10% discount
(More than 5 people)

NTD 800

*Tax Included

 
 
Organizer:
     
   

Co-organizer:

 
   

 

Sponsored by:

                                       

 
 
* Forum agenda is subject to change
 
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 

 

 

 

 

 

       
View Full Agenda
RISC-V Taipei Day Room 504 bc, 5F, TaiNEX 1, Nangang Exhibition Center Friday, September 25
1:00pm to 5:00pm

Date : Friday, September 25th, 2020
Time : 13:00 - 17:00
Venue : Room 504bc, 5F, TaiNEX 1, Nangang Exhibition Center
Theme : RISC-V / Edge AI

 

 

 

Organizer : 

                

 

Co-organizer : 

       

 

Sponsorship : 

                           

 

 

* Forum agenda is subject to change
 
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Friday, September 25
8:30am to 12:20pm
Room 504bc, 5F, TaiNEX 1 Friday, September 25
8:30am to 12:20pm

Date : Friday, September 25th , 2020
Time :  08:30 – 12:20 (8:30-8:50 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室

Moderator :
Dr. Hsie-Chia Chang, Professor, Depart of Electronics Engineering, National Chiao Tung University
Dr. Tsung-Yi Ho, Professor, Department of Computer Science, National Tsing Hua University

With the internet of things (IoT) explosion on the horizon, device security is the risk to business, national infrastructure even to personal health. Chip security becomes a major issue. For example, recently discovered hardware vulnerabilities such as Meltdown and Spectre are difficult or even impossible to patch.

But in real world, chip designers and makers usually struggle with technical issues such as performance and energy efficiency. However, with the ubiquitous of security in the modern word, it should be front and center of how chips are designed. The topics of security are perhaps even more important than beating Moore’s Law since it becomes difficult in fixing problems that do arise.

On the path of realizing intelligent world, we need to think about how to build secured system at the most fundamental architectural level of the system itself. Semiconductor security is dynamic and should evolve organically to intelligently and proactively protect changing workloads and applications. Security on Chip forum will share insights about security concern in today and future design.

 

Early-Bird
(07/13-09/04)
Original
(09/05-09/25)
Group-Early-Bird
(more than 5 ppl)
(07/13-09/04)
Group-Original
(more than 5 ppl)
(09/05-09/25)
Student
(EMBA Excluded)
(07/13-09/25)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member -
Free Free Free Free Free Free Free Free Free

*Tax Includeo

Organizer :

              

    Sponsored By : 

                                        
     
 

 

   
     
                                                                                                             
            

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.* Forum agenda is subject to change    

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

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Special Features Booth #J3246, Smart Workforce Pavilion, 1F, TaiNEX 1 Wednesday, September 23
1:30pm to 4:00pm
Special Features Booth #J3246, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 25
1:00pm to 3:00pm
Booth #M1156, Master Forum Stage, 4F, TWTC Nangang Exhibition Hall Wednesday, September 18
9:00am to 9:30am
Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 23
8:20am to 9:30am
Room 402ab, 4F, TaiNEX 1 Friday, September 25
8:30am to 4:30pm

Date:Friday, September 25th, 2020
Time:08:30 - 16:30 (08:30-09:00 for registration)
Venue:Room 402ab, 4F, TaiNEX 1

Theme:  Innovation and Commercialization of Semiconductor Inspection and Metrology Technologies

Forum Chairs and Vice Chairs:

  • Mr. Leo Huang, Chairman & CEO, Chroma ATE Inc./Chairman, SEMI Taiwan Inspection & Metrology Committee
  • Dr. Fong-Zhi Chen, Deputy Director General, Instrument Technology Research Center, National Applied Research Laboratories/Vice Chairmen, SEMI Taiwan Inspection & Metrology Committee
  • Mr. Frank Tsai, Director, Hermes-Epitek Corporation/Vice Chairmen, SEMI Taiwan Inspection & Metrology Committee
  • Dr. Victor, Tzeng-Yow Lin, General Director, Center for Measurement Standards, Industrial Technology Research Institute/Vice Chairmen, SEMI Taiwan Inspection & Metrology Committee

Outline:  

The global semiconductor inspection equipment market size is expected to reach USD 6883.7 million by 2025, from USD 5783.5 million in 2019. However, due to the outbreak of COVID-19, the industry has been impacted by manufacturing disruption. To facilitate innovation and commercialization of semiconductor inspection and metrology technologies, measurement challenges and relevant solutions would be discussed through the Semiconductor Advanced Inspection and Metrology Forum, which provides a platform for the communication of market trends and state-of-the-art technologies.

 

 

 

Early-bird
(7/13-9/4)

Original
(9/5-9/25)

SEMI Member
(7/13-9/25)
Group Registration
(7/13-9/25)

Academia 
(EMBA Excluded)
(7/13-9/25)

NTD 3,200 NTD 4,000 NTD 3,200 Extra 10% discount
(More than 5 people)
NTD 800

*Tax Included

 
 
Organizer:
 
     

 

Sponsored by:

 

 

 

 

 

 

 

 

   

 

 
 
* Forum agenda is subject to change
 
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 

 

 

 

       
View Full Agenda
Special Features Room 402ab, 5F, TaiNEX 1 Friday, September 25
8:30am to 4:15pm
Tuesday, September 22 9:00am

SiP Global Summit will explore the shifted landscape and potential opportunities of semiconductor advanced packaging technology under the wave of AI and 5G applications. TSMC, ASE, SPIL, Micron, PTI, Amkor、ASMPT、Camtek、imec、Lam Research、SPTS、UCLA will take you to view the Next Generation of Advanced packaging.

View Full Agenda
Special Features Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 22
8:30am to 5:40pm
SiP, SiP Global Summit Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 22
8:30am to 5:20pm

(Only those videos with speakers’permission are launched on SEMICON Taiwan 2020 Hybrid Platform)

Date:Tuesday, September 22nd, 2020
Time:08:30 - 17:20 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park

Theme: Innovative Advanced Packaging Technologies Enable Emerging Device Applications

Forum Chairs:

  • Mr. Albert Lan, Global Sr. Packaging TD, Applied Materials/Vice Chairman, SEMI Taiwan Packaging & Testing Committee 

Moderators:

  • Mr. Albert Lan, Global Sr. Packaging TD, Applied Materials/Vice Chairman, SEMI Taiwan Packaging & Testing Committee
  • Dr. Shin-Puu Jeng, Director, TSMC 

Outline: 

I. Super HPC Devices (Si-photonics / AI / Quantum Computer / HBM ....)

  - ALL of Si-photonics, Quantum Computer, and HBM memory can effectively enable 5G & AI, even other HPC or 6G devices in the future.

  • Si-photonics:  Transmission Power
  • Quantum Computer – Calculation Power
  • HBM – Storage Power

  - Try to address what’s Advanced Packaging technologies are used, and its challenges & solutions can enable the above HPC technologies, such as HD-FO, TSV or Cu hybrid bonding, and so on..  

II. Advanced Panel and Substrates (including HD FO-PLP / Fordable Display / …..)

  - Advanced Panel and Substrates with larger economic scale sizes are targeting on HD(High Density) Fan Out and future Fordable Display to compete with wafer scale format in the future.

  - Advanced packaging technologies as well as its technology challenges and solutions, such as warpage, fine width RDL, adaptive patterning (mask-less), and so on.. will be addressed here.

III. Post Moore’s Law Generation (Power IC: IGBT / GaN / SiC / ….)

  - Recent autonomous car or HSR train need high device power dissipation requirements make power IC very popular, such as IGBT, GaN, SiC, and so on.

  - Advanced packaging technologies, such as Taiko wafer handling, PVD or evaporator for BSM(Back-Side Metallization) will be addressed here.

 

 
 
 

Early-bird
(7/13-9/4)

Original
(9/5-9/25)

SEMI Member
(7/13-9/25)
Group Registration
(7/13-9/25)

Academia
(EMBA Excluded)
(7/13-9/25)

NTD5,040 NTD6,300 NTD5,040 Extra 10% discount
(More than 5 people)
NTD800

*Tax Included

Sponsored by:

 

   

 

  * Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

 
 

 

 

View Full Agenda
Special Features Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 24
8:30am to 4:55pm
SiP, SiP Global Summit Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 24
8:30am to 5:30pm

(Only those videos with speakers’permission are launched on SEMICON Taiwan 2020 Hybrid platform)

Date:Thursday, September 24th, 2020
Time:08:30 - 17:30 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park

Theme: Advanced 3D System Integration for Moore’s Law 2.0 & Beyond

Forum Chair:

Moderator:

Outline: 

The continuous pursuit of higher compute power with insatiable data bandwidth to meet relentless system demands from cloud computing, datacenters, enterprise servers, supercomputers, network system and edge, has urged new system integration solutions with larger footprint, denser 3D interconnect, close proximity 3D inter chip integration and new memory system. These system integration trends can effectively improve compute,data bandwidth, latency and power efficiency, which are buzzwords in system performances when benchmarking the merits of advanced system integration solutions. 

To continuously sustain the economics of scale in advanced node technology adoption, semiconductor in dustry has widely advocated the fusion of design technology co-optimization (DTCO) in IC scaling and system technology co-optimization (STCO) in system scaling. The SoC disintegration and chiplets integration through innovative heterogeneous integration technology (HIT) become important to sustain the Moore's Law by the fusion of DTCO and STCO, and advocate a path forward to a new semiconductor era. The pace of advanced chiplets integration technology accelerates not only in backend 2D/3D packaging but also in front end process of 3D chip on wafer and wafer on wafer stacking (aka SoIC). In recent years, wafer scale system integration emerges in a unique front to break through the limitation of compute power and data bandwidth offered by current mainstream packages.

In this forum, speakers from renowned academia, research institute, Design House, EDA tool, foundry, and manufacturing/materials suppliers are sharing their insights and visions. Audience would benefit from this forum to have an in depth understanding of following subjects

  • AI/5G network and HPC heterogeneous integration technology trends
  • Moore's Law 2.0 unleashed by 3D high density HIT
  • New semiconductor era advocated by innovative HIT in package form and wafer form
  • System integration challenges: 3D stacking, Large Substrate Thermal

 

 

Early-bird
(7/13-9/4)

Original
(9/5-9/25)

SEMI Member
(
7/13-9/25)
Group Registration
(
7/13-9/25)

Academia
(EMBA Excluded)
(7/13-9/25)

NTD 5,040 NTD 6,300 NTD 5,040 Extra 10% discount
(More than 5 people)
NTD 800

*Tax Included

 
 
Sponsored by:
               

 

 

 
 
* Forum agenda is subject to change

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
 
       

 

 

View Full Agenda
Special Features Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 25
8:30am to 5:00pm
SiP, SiP Global Summit Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 25
8:30am to 4:40pm

 

(Only those videos with speakers’permission are launched on SEMICON Taiwan 2020 Hybrid platform)

Date:Friday, September 25th, 2020
Time:08:30 - 16:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳

Theme: SiP Technology Evolution from Traditional to Extremely Integrated Package

Forum Chair:

Moderator:

Outline: 

Evolution of SiP

* Traditional type: PMIC module, AiP

* Emerging type (OSAT+EMS): MEMS, AiP, EMI module, DS module

* Emerging type (OSAT+Foundry): 2.5D, 3D, F/O, Silicon Photonics

Integrated Solution key factors: Design (IC design house), Simulation (EDA tool supplier), Assembly (device maker, OSATs), Testing, Qualification,  Equipment/Materials

 
Early-bird
(7/13-9/4)
Original
(9/5-9/25)
SEMI Member
(7/13-9/25)
Group Registration
(7/13-9/25)

Academia
(EMBA Excluded)
(7/13-9/25)

NTD 5,040 NTD 6,300 NTD 5,040 Extra 10% discount
(More than 5 people)
NTD 800

*Tax Included

 
Sponsored by:
 

 

 
* Forum agenda is subject to change

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

 

       

 

 

View Full Agenda
Special Features Room 401, 4F, TaiNEX 1 Wednesday, September 23
1:30pm to 4:50pm
SMART Manufacturing Room 401, 4F, TaiNEX 1 Wednesday, September 23
8:50am to 11:30am

(Only those videos with speakers’permission are launched on SEMICON Taiwan 2020 Hybrid platform)

Date:Wednesday, September 23rd, 2020
Time:08:50 - 11:30 (08:50-09:20 for registration)
Venue:Room 401, 4F, TaiNEX 1 

Theme: How Companies Win with Smart Manufacturing

Forum Chair:

  • Mr. James Lin , Deputy Division Director, UMC/ Co-Chairman, SEMI Taiwan Smart Manufacturing Committee
  • Dr. Scott Yu , Department Manager, TSMC/ Co-Chairman, SEMI Taiwan Smart Manufacturing Committee
  • Dr. Cheney Chiu , CIM Deputy Director, ASE Group/ Co-Chairman, SEMI Taiwan Smart Manufacturing Committee

Moderators:

  • Mr. James Lin, Deputy Division Director, UMC/ Co-Chairman of SEMI Taiwan Smart Manufacturing Committee

Outline: 

Smart Manufacturing has been the buzz word and industrial movement around the manufacturers. AI and 5G as the new powers, enabling smart manufacturing and possible applications to benefit companies' daily operations, from production flexibility to operation efficiency, from energy-saving to cost reduction.

With the full automation and data-driven manufacturing fabs, IC and high-tech industry manufacturers got more chance to leverage the benefits from smart manufacturing, to makes continuous progress in technology innovation which benefits the world and human life, accompanied with the opportunity, they also face multiple critical issues from the road to digital transformation, like cybersecurity threats, data storage strategy and protection and cross-functional roles’ communication gaps.

How Companies win with Smart Manufacturing would be the key topic of this year’s main theme of SMART manufacturing forum, during this forum, speakers will share about practical experiences on how companies develop smart to intelligent manufacturing under the conditions of estimable ROI and effective benefits, we will invite manufacturer to share the insights and expectations of current smart manufacturing and cybersecurity on how ecosystem can assemble together and solution providers from IoT, Edge, Cloud, AI and Cybersecurity segments to bring out valuable best practices to inspire the audiences.

 

 
Early-bird
(7/13-9/4)
Original
(9/5-9/25)
SEMI Member
(7/13-9/25)
Group Registration
(7/13-9/25)

Academia
(EMBA Excluded)
(7/13-9/25)

NTD 2,000 NTD 2,500 NTD 2,000 Extra 10% discount
(More than 5 people)
NTD 800

*Tax Included

 
 
Sponsored by:
   

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
     
       
       

 

 

View Full Agenda
Special Features B Room, The Banquet Hall, 3F, TaiNEX 1 Wednesday, September 23
12:00pm to 1:30pm
Special Features Booth #J3258, SMART Manufacturing Journey, 1F, TaiNEX 1 Wednesday, September 23
10:30am to 4:30pm
Special Features Booth #J3258, SMART Manufacturing Journey, 1F, TaiNEX 1 Thursday, September 24
10:30am to 4:30pm
Special Features Booth #J3258, SMART Manufacturing Journey, 1F, TaiNEX 1 Friday, September 25
10:30am to 2:30pm
Special Features Room 504bc, 5F, TaiNEX 1 Wednesday, September 23
1:30pm to 5:05pm
SMART MedTech Room 504bc, 5F, TaiNEX 1  Wednesday, September 23
1:30pm to 4:35pm

Date :Wednesday, September 23rd , 2020
Time :13:30 – 16:35 (13:30-14:00 for registration)
Venue :Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme : Post COVID-19 Era, Shaping The Next Generation Health Care

With the trend of digital transformation and infinite power of data offers more effective and personalized treatment for patients. The global medical technology industry continues to grow, according to 2019 EY MedTech report has founded that revenues increased by 7% to US$407.2b in 2018 to 2019. Most worthy of mention is that bioinformatics and biosensors have grown steadily over the last decade and accelerate the development of innovative MedTech products.

This year, due to COVID-19 spreads out seriously, every country pays attention on how to tackle with this virus. Governments and hospitals are using advanced health care solution including robotics, telemedicine, mobile health applications, sensor technology, data analytics and AI to prevent people from infection. Apparently, in order to facilitate MedTech to be more evolved and successful, MedTech companies need to have strong alignment with microelectronics to develop a business model and create value in the future.

In Smart MedTech Forum, we are not only discuss about the details of collaboration between microelectronics and MedTech industry, but also share the development of semiconductor industry involved in MedTech through investing more resource to realize Smart MedTech in the future.

 

 

Early-Bird
(07/13-09/04)
Original
(09/05-09/25)
Group-Early-Bird
(more than 5 ppl)
(07/13-09/04)
Group-Original
(more than 5 ppl)
(09/05-09/25)
Student
(EMBA Excluded)
(07/13-09/25)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member -
Free Free Free Free Free Free Free Free Free

*Tax Included

Advisor : 

Organizer : 
 


 

Co-organizer : 

Cooperation Media :
 

    

* Forum agenda is subject to change    

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Wednesday, September 23
8:30am to 11:50am
Room 504bc, 5F, TaiNEX 1 Wednesday, September 23
8:30am to 12:20pm

Date : Wednseday, September 23rd , 2020
Time :  08:30 – 12:20 (8:30-9:00 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme : Innovations Drive Smart Mobility Development

Disrupted by technology and new market entrants, smart mobility industry is in fluctuation. Technological advances such as interactive safety systems, vehicle connectivity, and self-driving cars change the game. 

According with Reports & Data, the market of connected cars will reach USD 197.12 billion by 2026. The widespread application of IoT in smart mobility fosters the vehicle connectivity and enhances driver experience. 

To facilitate the development of smart mobility, cross integration between industries breaks the traditional supply chain. That is, a brand-new value chain has created network to involve more industries such as service providers and startup companies. With this trend, the innovative thinking and novel business model speed up the application of prospective technology in smart mobility.

This time, Smart Mobility Forum 2020 covers all the important topics including AI, 5G, sensing technology, communication, advanced autonomous driving technology etc., goes deeper to the ecosystem of emerging tech roadmap and the optimal business models of mobility revolution.

 

Early-Bird
(07/13-09/04)
Original
(09/05-09/25)
Group-Early-Bird
(more than 5 ppl)
(07/13-09/04)
Group-Original
(more than 5 ppl)
(09/05-09/25)
Student
(EMBA Excluded)
(07/13-09/25)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member -
NTD1,600 NTD2,000 NTD2,200 NTD2,750 NTD1,440 NTD1,800 NTD1,800 NTD2,250 NTD800

*Tax Included

Advisor :
                         
     
     
Organizer :    

 

 

                       

Co-organizer : 

  

   
     
Sponsored by :     
        
 
* Forum agenda is subject to change
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
View Full Agenda
Special Features Room 401, 4F, TaiNEX 1 Thursday, September 24
8:30am to 4:50pm
Materials Room 401, 4F, TaiNEX 1 Thursday, September 24
8:20am to 4:40pm

Date:Thursday, September 24th, 2020
Time:08:20 - 16:40 (08:20-08:40 for registration)
Venue:Room 401, 4F, TaiNEX 1

Theme: Materials Leading the Smart Future of Semiconductor - from Localization to Globalization

Chair:

  • Mr. Min-Te Chen, Director, Taiwan Semiconductor Manufacturing Company Limited/ Chairman, SEMI Taiwan Materials Committee

Vice Chairs:

  • Dr. Joe Wu, Deputy Director, Taiwan Semiconductor Manufacturing Company Limited/ Vice Chairman, SEMI Taiwan Materials Committee 
  • Dr. Jeffrey Yang, Senior Department Manager, Advanced Semiconductor Engineering Inc. (ASE Group)/ Vice Chairman, SEMI Taiwan Materials Committee
  • Mr. Brian Chen, Vice President, Wah Lee Industrial Corp. / Vice Chairman, SEMI Taiwan Materials Committee 

Moderator: 

  • Morning Session: Ms. Victoria Chang, Account Manager, Precision Glass Solutions, Corning Incorporated 
  • Afternoon Session: Mr. Lewis Huang,  Vice President, Senju Electronic (Taiwan) Co., Ltd. 

 

 
Early-bird
(7/13-9/4)
Original
(9/5-9/25)
SEMI Member
(7/13-9/25)
Group Registration
(7/13-9/25)

Academia
(EMBA Excluded)
(8/31-9/25)

NTD 2,500 NTD 3,125 NTD 2,500

Extra 10% discount
(More than 5 people)

NTD 800

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 

 

 

 

 

 

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
  

 
       

 

 

View Full Agenda
Sustainable Manufacturing and Circular Economy Forum Room 500, 5F, TaiNEX 1 Wednesday, September 23
12:40pm to 5:00pm

Date     : Wednseday, September 23rd , 2020
Time    : 12:40 – 17:00 (12:40-13:10 for registration)
Venue  : Room 500, 5F, TaiNEX 1 (Taipei Nangang Exhibition Center, Hall 1)
Theme : Technological Innovations and Sustainable Developmen

Forum Chairs:

Dr. Shuh-Woei Yu, Chairman, SAHTECH, SEMI Taiwan Sustainable Manufacturing Committee

Outline : 

In conjunction with SEMICON Taiwan 2020, the Sustainable Manufacturing Committee of SEMI Taiwan is organizing an event to provide insights on the latest products and technologies, regulations, technical standards, business continuity plan (BCP), business continuity management (BCM), energy conservation, circular economy and cyber security.

The Sustainable and Circular economy Forum will showcase the expertise and capabilities of companies and speakers from around the word by addressing a wide variety of energy conservation and risk management issues for high tech sustainable manufacturing. The topics include environmental protection, BCP/BCM, energy conservation, circular economy, occupational health and safety, Lessons Learned from COVID-19 ,information and operation security which affect sustainable manufacturing.

You may learn

• Innovation & Information Sharing among industry supply chain

• How supply chains provide solutions to support electronics manufactures under connectedness, collaboration and innovation?

• Innovation of waste resources management & technology

• Circular economy principles & competitiveness

• Resources consumption management

• Innovation of BCP (Business continuity plan) & BCM (Business continuity management)

• New circular business model or action for the future

• EHS challenges & Risk Management

• Learning from Case study

 

 

Early-bird
(7/13-9/4)
Original
(9/5-9/25)
SEMI Member
(7/13-9/25)
Group Registration
(7/13-9/25)

Academia
(EMBA Excluded)
(7/13-9/25)

NTD 2,000 NTD 2,500 NTD 2,000 Extra 10% discount
(More than 5 people)
NTD 800

*Tax Included

 

 

Sponsored by:

 
     

 

    * Forum agenda is subject to change    

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

 
View Full Agenda
Special Features Room 500, 5F, TaiNEX 1 Wednesday, September 23
12:40pm to 5:00pm
Mr. Terry Tsao
Global Chief Marketing Officer and President of SEMI Taiwan
SEMI
Mr. Raymond Greene
Deputy Director
AIT
Mr. Jang-Hwa Leu
The Director General
Industrial Development Bureau, Ministry of Economic Affairs
Ms. Crystal Hsu
Director Corporate Affairs
LINE Taiwan
Mr. Weber Chung
Senior Vice President of Human Resources and Administration General Division
104 Corporation
Dr. Cheng-Hung Cho
President
Institute for Information Industry
Dr. Cheng-Wen Wu
Vice President
National Cheng Kung University
Mr. Stephen Su
Vice President and General Director, ISTI
Industrial Technology Research Institute
Ms. Milan Chang
Talent Acquisition Director
Micron Technology
K3076, 1F, TaiNEX 1  Wednesday, September 23
1:30pm to 4:00pm

Date:Wednesday, September 23th , 2020
Time:13:30 – 16:00
Venue:K3076,1F,TaiNEX 1 

13:30-13:35 Welcome Remarks:

  • Mr. Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI

13:35-13:55 Opening Remarks: 

  • Mr. Raymond Greene, Deputy Director, AIT 
  • Dr. Zse-hong Tsai, Executive Secretary, Office of Science & Technology, Executive Yuan
  • Mr. Cheng-Hung Cho, President, Institute for Information Industry

13:55-14:00 Group Photo ​

14:00-14:20 Keynote Speech-"Next Generation Talent":

  • Ms. Crystal Hsu, Director Corporate Affairs, LINE Taiwan

14:20-14:40 Keynote Speech:

  • Mr. Weber Chung, Senior Vice President of Human Resources and Administration General Division, 104 Corporation

14:40-16:00 Panel Discussion: the Prospect for Taiwan’s High-tech Talent in the Digital Age 

Moderator:

  • Ms. Liying Wang, Legal Master, AppWorks

Panelists:

  • Mr. Jang-Hwa Leu, Director General, MOEA IDB 
  • Ms. Milan Chang, Talent Acquisition Director, Micron Technology
  • Mr. Stephen Su, VP, ITRI
  • Dr. Cheng-Wen Wu, Vice President, NCKU

*Forum is conducted in Chinese

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

View Full Agenda
Dr. J. Andrew Yeh
Deputy Executive Secetary
Office of Science and Technology, Executive Yuan
Jason Chin
Senior Vice President of Executive Recruting Consultancy Division
104 Corporation
Mr. Alvin Lee
Regional Director
Brewer Science Inc.
Mr. Roger Chang
Executive Vice President
Tokyo Electron Taiwan
Dr. Meng Fan Chang
Director,Corporate Research
TSMC
K3076, 1F, TaiNEX 1  Friday, September 25
1:30pm to 3:00pm

Date:Friday, September 25th , 2020
Time:13:30 – 15:00
Venue:K3076,1F,TaiNEX 1 
Theme: How to improve competitiveness in workforce development ?

13:00-13:30 Registration​

13:30-13:40 Opening Remarks

  • Dr. J. Andrew Yeh, Deputy Executive Secretary, Office of Science and Technology, Executive Yuan

13:40-15:00 Panel Discussions: How to improve competitiveness in workforce development ?​

Moderator:

  • Mr. Jason Chin, Senior Vice President of Executive Recruting Consultancy Division, 104 Corporation

Panelists:

  • Mr. Roger Chang, Executive Vice President, Tokyo Electron Taiwan
  • Dr. Meng Fan Chang, Director, TSMC
  • Mr. Alvin Lee, Sr. Director, Brewer Science

Outline:

How do you prepare for a 21st century workforce? How to improve competitiveness in workforce development? SEMI Talent Forum will focus on developing what we can do to be ready in the career and how to attract and retain the best talent in the industry to lead the future!

* Forum is conducted in Chinese

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

View Full Agenda
Tuesday, September 17 9:00am

 

Advanced Materials Technology High-Tech Facility Innovative Technology & Product 

 

 Sept 23, 2020

TechXPOT 1F #K2786

Time Company Topic Language Slides
11:40 - 12:00 Corning The Benefits of Using Glass Carriers for Wafer Thinning English Download
12:00 - 12:20 Shenmao Technology Inc. New-Generation, High Reliability Lead-Free Solder Alloy Mandarin Download
13:40 - 14:00 Alliance Material Co., Ltd. AMC Warpage Solution English Download
14:00 - 14:20 United Silicon Innovation Corp. Non-Prime Silicon Wafer Value Chain and Challenges Mandarin Download
14:20 - 14:40 Bestac Advanced Material Co., Ltd CMP Polishing Soft Pad Introduction-Bestac Mandarin Download
14:40 - 15:00 TAIWAN OHARA OPTICAL Co., LTD A Glass manufacturing company, OHARA’s Business&Technology for Next Generation Semiconductor Process Mandarin Download
15:00 - 15:20 Heraeus New! AgCoat Prime – The Perfect Substitute to Gold Bonding Wire in Memory and Smart Card Applications Mandarin Download
15:20 - 15:40 LEDARTS OPTO CORP. The Advanced Surface Treatment Technology for Critical Components Mandarin Download
15:40 - 16:00 5N Plus Inc Ultra-Fine Metal Powders for Emerging Mini-LED and Micro-LED Display Technologies Mandarin Download
16:00 - 16:20 En-Liang Enterprise Co.,Ltd Localized production of anti-radiation insulating materials Mandarin Download

 

TechXPOT 4F #N0786

 
Time Company Topic Language Slides
10:40 - 11:00 New Fast Technology Co., Ltd. Third-party Testing Demand and Tendency for High-end Manufacturing Process of Semiconductor Mandarin Download
11:00 - 11:20 Taiwan CKD Corporation CKD Air valve and Manual valve introduction for semiconductor industry. Mandarin -
11:20 - 11:40 Wholetech System Hitech Limited Reduction of Process Exhaust Dust Mandarin Download
11:40 - 12:00 Jusun Instruments Co., Ltd. The Latest Innovation Analysis Technology Introduction for AMC & Exhaust Gases in HI-Tech Facility Mandarin Download
13:00 - 13:20 SEMI Taiwan High-Tech Facility Committee MEC with robotics ecosystem collaboration services Mandarin Download
13:20 - 13:40 Techgo Industrial Co., Ltd. Design and Development of Optimized Water Distribution System for Cooling Tower Mandarin Download
13:40 - 14:00 Chyi Lee Industry Co., Ltd. The Future Approach & Integration Service of FFUs Mandarin Download
14:00 - 14:20 Rotarex Taiwan Rotarex: Guardian of Gas Safety and Equipment - Valves, Connectors, and Gaskets Mandarin Download
14:40 - 15:00 GreenFILTEC TAIWAN LTD. The development and the future of chemical filter's circular economy. Mandarin Download
15:00 - 15:20 Trusval Technology Co. Ltd. The trend of green manufacturing and corresponding solutions Mandarin Download
15:20 - 15:40 Ye Siang Enterprise Co. Ltd The Protector of 5G & AI Era - The Innovative Solution of AMC Control with Circular Economy  Mandarin -
15:40 - 16:00 Lumax International Corp., Ltd. Facility Wireless Vibration Machine Health Monitoring Mandarin Download

 

 

 

 Sept 24, 2020

TechXPOT 1F #K2786

Time Company Topic Language Slides
13:30 - 14:00 LEI&SO Co., Ltd. Direct Pose Feedback Controlled Six-Axis Robot Mandarin Download
14:00 - 14:30 AEM Holdings Ltd. Next Generation System Level Test (SLT) English -
14:30 - 15:00- Manz Taiwan Ltd. Manz Novel Plating Solutions for FOPLP RDL formation Mandarin -

 

TechXPOT 4F #N0786

Time Company Topic Language Slides
11:00 - 11:30 3S Silicon Tech., Inc. Breakthrough in Semiconductor Packaging Process - Formic Acid for Flux Free Vacuum Reflow Process Mandarin Download
11:30 - 12:00 EVG-JOINTECH Maskless Digital Lithography MLE™ Enabling Heterogeneous & Chiplet Integration Mandarin -
13:30 - 15:00 Taiwan Instrument Research Institute, National Applied Research Laboratories Seminar of NARLabs' Advanced Semiconductor Equipment & Process Technology Mandarin Download

 

 

 

 Sept 25, 2020

TechXPOT 1F #K2786

Time Company Topic Language Slides
10:20 - 10:40 Genesink Taiwan The Cutting-Edge NANO Materials From GenesInk Mandarin -
10:40 - 11:00 NAGASE (TAIWAN) CO., LTD. Nagase Knowledge Creation SaaS(Software as a Service) for Semiconductor Industry Mandarin Download
11:00 - 11:20 NIHON SUPERIOR (Taiwan) Co., LTD NIHON SUPERIOR SOLDER MATERIALS TOTAL SOLUTION Mandarin Download
11:20 - 11:40 H.C.Starck, Inc. H.C. Starck Solutions - Continued  Excellence in Refractory Metal Target Manufacturing Mandarin Download
11:40 - 12:00 Solar Plus Company Heat resistance of UV curable dicing tape Mandarin Download

 

TechXPOT 4F #N0786

Time Company Topic Language Slides
10:20 - 10:40 CDS Condition Monitoring Service Co. Semiconductor equipment factory equipment monitoring system Mandarin Download
10:40 - 11:00 Air Tech System Co., Ltd. Thermal clean chamber / Design and application of the graphic control software Programmi Mandarin Download
11:00 - 11:20 ECI Technology Inc. Chemical quality control in advanced generation semiconductor industry Mandarin -
11:40 - 12:00 Precision Machinery Research & Development Center Realize safety and smart manufacture of the future. Mandarin Download
12:00 - 12:30 SEMI Taiwan High-Tech Facility Committee An innovative solution for the micro-contamination of wafer automatic handling transportation system. Mandarin Download

 

 

SEMICON Taiwan 2020 Slides Download Period: 11/30!

 

View Full Agenda
Special Features Booth #K3276, TechXPOT, 1F, TaiNEX 1 Wednesday, September 23
12:40pm to 4:00pm
Special Features Booth #K3276, TechXPOT, 1F, TaiNEX 1 Friday, September 25
10:20am to 2:10pm
Special Features Booth #K3276, TechXPOT, 1F, TaiNEX 1 Thursday, September 24
1:00pm to 4:00pm
Special Features Booth #L1316, TechXPOT, 4F, TaiNEX 1 Wednesday, September 23
10:40am to 4:20pm
Special Features Booth #L1316, TechXPOT, 4F, TaiNEX 1 Thursday, September 24
10:30am to 4:30pm
Special Features Booth #L1316, TechXPOT, 4F, TaiNEX 1 Friday, September 25
10:20am to 12:00pm
Special Features Booth #K2041a, 1F, TaiNEX 1 Friday, September 25
12:30pm to 1:30pm
Thursday, September 19
3:40pm to 4:10pm
Thursday, September 19
4:35pm to 4:50pm
Friday, September 20
2:25pm to 2:50pm
Special Features Room Happiness, 3F, TaiNEX 1 Wednesday, September 23
12:00pm to 1:20pm
Welcome Remarks by SEMI Executive:
Wednesday, September 18
8:55am to 9:00am
Special Features Booth #J3246, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 25
10:00am to 11:30am
Dr. Tri-Rung Yew
Distinguished Professor,Department of Materials Science and Engineering 
National Tsing Hua University
Ms. Elisa Chiu
Founder & CEO
Anchor Taiwan
Ms. Vicky Hsu
Senior Director
Applied Materials Taiwan
Ms. Mavis Ho
Head of Strategic Partnerships, Greater China & SEA
imec
Ms. Sally Chiu
Site Director of PM ISC Hsinchu
Merck Performance Materials Ltd.
Ms. Jessie Liu
Director, North Asia HR Business Partner
Micron Technology Taiwan
K3076, 1F, TaiNEX 1  Friday, September 25
10:20am to 12:00pm

Date:Friday, September 25th , 2020
Time:10:20 – 12:00
Venue:K3076,1F,TaiNEX 1 
 

10:20-10:30 Welcome Remarks:

Dr. Tri-Rung Yew, Distinguished Professor, Department of Materials Science and Engineering, National Tsing Hua University 

10:230-11:30 Panel Discussion:

Moderator:

Ms. Elisa Chiu , Founder & CEO, Anchor Taiwan

Panelists: 

Ms. Vicky Hsu, Senior Director, Applied Materials Taiwan

Ms. Mavis Ho, Head of Strategic Partnership, Greater China & SEA, imec

Ms. Sally Chiu, Site Director, HsinChu site, Merck Performance Materials Ltd.

Ms. Jessie Liu, Director, North Asia, Human Resources Business Partner, Micron

11:30-12:00 Q&A​

 

Outline:

Our industry’s future success is dependent on innovation, diversity and inclusion of the best ideas in the world. Panelists from various categories comprising suppliers and customers will discuss key challenges they encountered, success stories, and ideas for how each company can increase ownership diversity across the semiconductor industry. Join us to understand more about “Empowering Women in the Future” at Women-in-Tech Forum!

* Forum is conducted in Chinese

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

 

View Full Agenda

Contact
SEMI Taiwan
Ms. Lily Lee
TEL: 886.3.560.1777 EXT. 509
Email: [email protected]

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