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SiP Global Summit 2020 – Heterogeneous Integration NOW & FUTURE – Day 1 [Physical & On-demand]

Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 22
8:30am to 5:20pm

(Only those videos with speakers’permission are launched on SEMICON Taiwan 2020 Hybrid Platform)

Date:Tuesday, September 22nd, 2020
Time:08:30 - 17:20 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park

Theme: Innovative Advanced Packaging Technologies Enable Emerging Device Applications

Forum Chairs:

  • Mr. Albert Lan, Global Sr. Packaging TD, Applied Materials/Vice Chairman, SEMI Taiwan Packaging & Testing Committee 

Moderators:

Outline: 

I. Super HPC Devices (Si-photonics / AI / Quantum Computer / HBM ....)

  - ALL of Si-photonics, Quantum Computer, and HBM memory can effectively enable 5G & AI, even other HPC or 6G devices in the future.

  • Si-photonics:  Transmission Power
  • Quantum Computer – Calculation Power
  • HBM – Storage Power

  - Try to address what’s Advanced Packaging technologies are used, and its challenges & solutions can enable the above HPC technologies, such as HD-FO, TSV or Cu hybrid bonding, and so on..  

II. Advanced Panel and Substrates (including HD FO-PLP / Fordable Display / …..)

  - Advanced Panel and Substrates with larger economic scale sizes are targeting on HD(High Density) Fan Out and future Fordable Display to compete with wafer scale format in the future.

  - Advanced packaging technologies as well as its technology challenges and solutions, such as warpage, fine width RDL, adaptive patterning (mask-less), and so on.. will be addressed here.

III. Post Moore’s Law Generation (Power IC: IGBT / GaN / SiC / ….)

  - Recent autonomous car or HSR train need high device power dissipation requirements make power IC very popular, such as IGBT, GaN, SiC, and so on.

  - Advanced packaging technologies, such as Taiko wafer handling, PVD or evaporator for BSM(Back-Side Metallization) will be addressed here.

 

 
 
 

Early-bird
(7/13-9/4)

Original
(9/5-9/25)

SEMI Member
(7/13-9/25)
Group Registration
(7/13-9/25)

Academia
(EMBA Excluded)
(7/13-9/25)

NTD5,040 NTD6,300 NTD5,040 Extra 10% discount
(More than 5 people)
NTD800

*Tax Included

Sponsored by:

 

   

 

  * Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

 
 

 

 

Do you want to attend this session? REGISTER NOW!

Mr. Albert Lan
Global Sr. Packaging TD
Applied Materials Taiwan
Dr. Akshay Singh
Vice President of Advanced Packaging Technology Development
Micron Technology
Mr. Ray Yang
Consulting & BD Director
Industrial Technology Research Institute - Industry, Science and Technology International Strategy Center
Mr. Chris Jones
Senior Director, PVD & ECD Product Management
SPTS Technologies Ltd
Mr. Albert Lan
Global Sr. Packaging TD
Applied Materials Taiwan
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