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>> 2019年 資訊持續更新中!

Special Features 福軒廳 / 南港展覽館一館三樓 Tuesday, September 22
12:00pm to 1:30pm
Special Features 504bc 會議室/ 南港展覽館一館五樓 Tuesday, September 22
8:30am to 4:15pm
馥儷廳雅悅會館/ 中信企業總部A棟三樓 Tuesday, September 22
8:30am to 5:00pm

2020內容持續更新中!

Date:Tuesday, September 22nd, 2020
Time:08:30 - 17:00 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳
Theme: Innovative Advanced Packaging Technologies Enable Emerging Device Applications

Forum Chairs:

  • Mr. Albert Lan, Global Sr. Packaging TD, Applied Materials/Vice Chairman, SEMI Taiwan Packaging & Testing Committee 

Moderators:

Outline: 

I. Super HPC Devices (Si-photonics / AI / Quantum Computer / HBM ....)

  - ALL of Si-photonics, Quantum Computer, and HBM memory can effectively enable 5G & AI, even other HPC or 6G devices in the future.

  • Si-photonics:  Transmission Power
  • Quantum Computer – Calculation Power
  • HBM – Storage Power

  - Try to address what’s Advanced Packaging technologies are used, and its challenges & solutions can enable the above HPC technologies, such as HD-FO, TSV or Cu hybrid bonding, and so on..  

II. Advanced Panel and Substrates (including HD FO-PLP / Fordable Display / …..)

  - Advanced Panel and Substrates with larger economic scale sizes are targeting on HD(High Density) Fan Out and future Fordable Display to compete with wafer scale format in the future.

  - Advanced packaging technologies as well as its technology challenges and solutions, such as warpage, fine width RDL, adaptive patterning (mask-less), and so on.. will be addressed here.

III. Post Moore’s Law Generation (Power IC: IGBT / GaN / SiC / ….)

  - Recent autonomous car or HSR train need high device power dissipation requirements make power IC very popular, such as IGBT, GaN, SiC, and so on.

  - Advanced packaging technologies, such as Taiko wafer handling, PVD or evaporator for BSM(Back-Side Metallization) will be addressed here.

 

 

 
早鳥價
(7/13-8/31)
原價
(9/1-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)

學生價 (不含EMBA)
(7/13-9/25)

NTD5,040 NTD6,300 NTD5,040 5人以上再享9折 NTD800

*Tax Included

 
 
Sponsored by:
        
     

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
       
     
     

 

 

View Full Agenda
SiP Global Summit 馥儷廳雅悅會館/ 中信企業總部A棟三樓 Tuesday, September 22
8:30am to 5:20pm

(僅將取得講師授權的錄影檔上傳至SEMICON Taiwan 2020 Hybrid platform)

Date:Tuesday, September 22nd, 2020
Time:08:30 - 17:20 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳

Theme: Innovative Advanced Packaging Technologies Enable Emerging Device Applications

Forum Chairs:

  • Mr. Albert Lan, Global Sr. Packaging TD, Applied Materials/Vice Chairman, SEMI Taiwan Packaging & Testing Committee 

Moderators:

Outline: 

I. Super HPC Devices (Si-photonics / AI / Quantum Computer / HBM ....)

  - ALL of Si-photonics, Quantum Computer, and HBM memory can effectively enable 5G & AI, even other HPC or 6G devices in the future.

  • Si-photonics:  Transmission Power
  • Quantum Computer – Calculation Power
  • HBM – Storage Power

  - Try to address what’s Advanced Packaging technologies are used, and its challenges & solutions can enable the above HPC technologies, such as HD-FO, TSV or Cu hybrid bonding, and so on..  

II. Advanced Panel and Substrates (including HD FO-PLP / Fordable Display / …..)

  - Advanced Panel and Substrates with larger economic scale sizes are targeting on HD(High Density) Fan Out and future Fordable Display to compete with wafer scale format in the future.

  - Advanced packaging technologies as well as its technology challenges and solutions, such as warpage, fine width RDL, adaptive patterning (mask-less), and so on.. will be addressed here.

III. Post Moore’s Law Generation (Power IC: IGBT / GaN / SiC / ….)

  - Recent autonomous car or HSR train need high device power dissipation requirements make power IC very popular, such as IGBT, GaN, SiC, and so on.

  - Advanced packaging technologies, such as Taiko wafer handling, PVD or evaporator for BSM(Back-Side Metallization) will be addressed here.

 

 

 
早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)

學生價 (不含EMBA)
(7/13-9/25)

NTD5,040 NTD6,300 NTD5,040 5人以上再享9折 NTD800

*Tax Included

 
 
Sponsored by:
   

   

 

* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
 
 

 

 

View Full Agenda
SiP Global Summit 馥儷廳雅悅會館 / 中信企業總部A棟三樓 Friday, September 25
8:30am to 4:40pm

(僅將取得講師授權的錄影檔上傳至SEMICON Taiwan 2020 Hybrid Platform)

Date:Friday, September 25th, 2020
Time:08:30 - 16:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳

Theme: SiP Technology Evolution from Traditional to Extremely Integrated Package

Forum Chair:

  • Dr. Yu-Po Wang 王愉博, 資深處長, 矽品精密工業股份有限公司

Moderator:

  • Dr. Yu-Po Wang 王愉博, 資深處長, 矽品精密工業股份有限公司

Outline: 

Evolution of SiP

* Traditional type: PMIC module, AiP

* Emerging type (OSAT+EMS): MEMS, AiP, EMI module, DS module

* Emerging type (OSAT+Foundry): 2.5D, 3D, F/O, Silicon Photonics

Integrated Solution key factors: Design (IC design house), Simulation (EDA tool supplier), Assembly (device maker, OSATs), Testing, Qualification,  Equipment/Materials

 

 
早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)
學生價 (不含EMBA)
(7/13-9/25)
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折 NTD 800

*Tax Included

 
 

Sponsored by:

 

 

 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

   

 

       
View Full Agenda
SiP Global Summit 馥儷廳雅悅會館/ 中信企業總部A棟三樓 Thursday, September 24
8:30am to 5:30pm

(僅將取得講師授權的錄影檔上傳至SEMICON Taiwan 2020 Hybrid Platform)

Date:Thursday, September 24th, 2020
Time:08:30 - 17:30 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park / 中信企業總部A棟三樓雅悅會館馥儷廳

Theme: Advanced 3D System Integration for Moore’s Law 2.0 & Beyond

Forum Chair:

Moderator:

  • 上午場: Dr. Kuo-Chung Yee 余國寵, 處長, 台灣積體電路製造股份有限公司
  • 下午場: Dr. Chih-Hang Tung 董志航, 副處長, 台灣積體電路製造股份有限公司

Outline: 

The continuous pursuit of higher compute power with insatiable data bandwidth to meet relentless system demands from cloud computing, datacenters, enterprise servers, supercomputers, network system and edge, has urged new system integration solutions with larger footprint, denser 3D interconnect, close proximity 3D inter chip integration and new memory system. These system integration trends can effectively improve compute,data bandwidth, latency and power efficiency, which are buzzwords in system performances when benchmarking the merits of advanced system integration solutions. 

To continuously sustain the economics of scale in advanced node technology adoption, semiconductor in dustry has widely advocated the fusion of design technology co-optimization (DTCO) in IC scaling and system technology co-optimization (STCO) in system scaling. The SoC disintegration and chiplets integration through innovative heterogeneous integration technology (HIT) become important to sustain the Moore's Law by the fusion of DTCO and STCO, and advocate a path forward to a new semiconductor era. The pace of advanced chiplets integration technology accelerates not only in backend 2D/3D packaging but also in front end process of 3D chip on wafer and wafer on wafer stacking (aka SoIC). In recent years, wafer scale system integration emerges in a unique front to break through the limitation of compute power and data bandwidth offered by current mainstream packages.

In this forum, speakers from renowned academia, research institute, Design House, EDA tool, foundry, and manufacturing/materials suppliers are sharing their insights and visions. Audience would benefit from this forum to have an in depth understanding of following subjects

  • AI/5G network and HPC heterogeneous integration technology trends
  • Moore's Law 2.0 unleashed by 3D high density HIT
  • New semiconductor era advocated by innovative HIT in package form and wafer form
  • System integration challenges: 3D stacking, Large Substrate Thermal

 

 
 
 
 
早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)
學生價 (不含EMBA)
(7/13-9/25)
NTD 5,040 NTD 6,300 NTD 5,040 5人以上再享9折 NTD 800

*Tax Included

 
 

Sponsored by:

 
 

 

 

 

 

   

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
   
       

 

 

View Full Agenda
Special Features 501會議室 / 南港展覽館一館五樓 Thursday, September 24
9:00am to 12:10pm
Special Features 凱悅廳/ 台北君悅大飯店三樓 Wednesday, September 23
6:00pm to 9:00pm

科技菁英領袖晚宴跨界全球凝聚產業 年度最具前瞻視野的科技盛宴

SEMICON Taiwan 最具指標性的高階聯誼活動,每年邀請超過600位來自全球半導體業界之卓越企業家、高階經理人及關鍵決策者。

一同齊聚交流,促成跨國、跨領域的合作契機,成功幫助企業品牌行銷與形象提升。

提供一個交流聯誼平台,更希望藉由與會之產業領導者的力量,一起為產業永續發展而努力。

日期:2019年9月18日星期三
時間:18:00-21:00
地點:台北君悅大飯店 三樓宴會廳

*本活動採邀請制

 

 

主辦單位:        
協辦單位:          
白金級贊助:
       
金級贊助:        
銀級贊助:        

 

View Full Agenda
Special Features 雅悅會館馥儷廳/中信企業總部A棟三樓 Tuesday, September 22
8:30am to 5:40pm
Special Features 雅悅會館馥儷廳/中信企業總部A棟三樓 Friday, September 25
8:30am to 5:00pm
Special Features 雅悅會館馥儷廳/ 中信企業總部A棟三樓 Thursday, September 24
8:30am to 4:55pm
Wednesday, September 18
2:45pm to 3:00pm

Abstract:

  • The future world will be reshaped by a few disruptive technologies including AI, 5G, autonomous driving, edge computing, etc. All need to be fueled by semiconductor devices. Taiwan is at a pivotal position in this transformation as we are world’s No.1 in foundry, No.1 in package and No.2 in IC design. Moore’s law is slowing down; however, the needs for higher performance and better energy efficient devices never subside. To overcome the challenges, (IC) design and (process) technology co-optimization has been well adopted. In the near future the co-optimization needs to be extended to package and system. It is not surprising that wafer foundry is stepping into package and system houses are designing their own chips. With the ubiquitous AI, IoT, and Big data, software is essential for device and system solutions. Since devices become smarter, the memory needs become critical. Integration of logic and memory in the package, chip, or even in process becomes a hot topic. Semiconductor devices are needed in all aspects from daily life to military operation. Semiconductor technology is used to measure a nation’s strength. With disputes between US/China, Japan/Korea, the world is aware that semiconductor is not only reflecting a country’s strength but also reaching the status of national security. The semiconductor supply chain is deglobalizing and divided into two major camps, US and China. Taiwan has been playing an important role in semiconductor supply chain. We should continue to invest semiconductor industry, encourage R&D, encourage collaboration between upstream and downstream, and be a neutral and friendly high-tech supplier in foundry, IC design, equipment, and raw materials. It is also important to have OEM/ODM system houses in Taiwan. The system houses will anchor the upstream semiconductor industry. Taiwan has done it in PC era. We could learn from that success story and repeat that success.

View Full Agenda
Wednesday, September 18
3:30pm to 3:45pm

Abstract:

Last 60 years integrated circuits technology was developed with exponentially progress results in a tremendous information industry. This trend was due to the past consecutive 30 generations of solid state devices shrinkage with the marvelous silicon processing technology scaling, according to the conjectures of an economical empirical Moore’s Law. Now the Moore’s Law will soon be ended with its traditional scaling form by one nanometer node, but IC industry may still struggling continue in some kinds of quasi- or virtual- Moore’s Law by 3D stacking or other variations to improve the ITC system’s functionality and cost performance ratio. However, the next real explosive scaling is now revealed by a disruptive and revolutionary technology – quantum computing, appearing on the horizon. Quantum physics was discovered hundred years ago, there is still so much treasure to be explored, the new exponentially scaling law will naturally be realized in a relay race with the past 60 years classical Moore’s Law. My vision to this quantum computing is that this technology will clearly bring up even much more explosive progress for future ITC industries than the classical Moore’s Law, and will realize all kinds of our imaginations in AI capabilities, thus naturally enable revolutions in human life in the coming next 60 years. A multi-trillions-dollars industry is waiting for us to create.

View Full Agenda
Friday, July 26 11:30am
Wednesday, September 18
2:15pm to 2:30pm

Abstract:

  • The presentation tries to tackle 3 questions. First, AI is changing the global technology landscape for sure. What then are the AI strategies responding to it, on the international as well as the national level? AI is transforming each industry sector, how do business leaders cope with it, and what are the major challenges and opportunities? Finally, on the knowledge level, how do we re-think, re-train, and re-invent ourselves through a life long learning journey?

View Full Agenda
Special Features 507 會議室/ 南港展覽館一館五樓 Thursday, September 24
1:30pm to 4:30pm
Wednesday, September 18
2:30pm to 2:45pm

Abstract:

Transistors and ICs have significantly enhanced technologies for mankind to improve living conditions, enrich life experiences and revolutionize civilization. Over the past 60 years, the IC industry has grown due to continual inventions on semiconductor materials, devices, circuits, CPU/DRAM/Flash/SOC chips. These developments have validated Moore’s Law and are currently enabling more versatile Heterogeneous Integrated (HI) Silicon-centric Systems & Applications (HISA)! Industry revenues reached US$480B in 2018 and will grow to over $1T by 2035.

A perspective on the next 30 years reveals that a synergistic growth relationship of IC x HI x PI (I3 Force) is shaping a big wave of new product directions for the semiconductor industry. This wave will power another exponential economic boom, bigger than that generated by Moore’s Law.

PI (Pervasive Intelligences) is surging to stimulate humanity’s ambitions beyond AI due to powerful nanometer-level HISA. The I3 Force enhancements impact many areas: (1) Human Brain Intelligences (HBI), (2) Artificial and Machine Intelligences(AI), (3) Cell Intelligences (CI), (4) Aging Intelligences (AGI), and (5) Environment Intelligences (EI).

As for what may happen beyond the next 30 to 60 years, what will be totally new disruptive technologies surpassing ICs is unpredictable to me. But I am reasonably confident that such technologies will not be using only electron-hole like most of today’s ICs, and my best bet at the moment is on photon-electron synergy, pervasive use of spin-force, and some usage of cell-based or DNA-based technologies with semiconductor/IC technologies.

As for the question on if and how Taiwan can continuously push today’s leading position in semiconductors? A worthy example to study is why Japan is not so strong now as ten or twenty years ago. Significant national efforts to change and upgrade Taiwan’s competitiveness in ICs are definitely required.

View Full Agenda
Mr. George Zafiropoulos
Vice President
National Instruments Corp.
Friday, September 25
3:05pm to 3:30pm

Abstact:

Semiconductor companies face many challenges from the continuous need to drive technology to the unrelenting time to market and quality pressures.  By delivering solutions from design to characterization and production test, National Instruments has a unique opportunity to see many of these challenges across the whole flow. 
 
Reusable test IP helps accelerate the time to market and reduce errors. Defining and building a common, connected flow enabling re-use of mixed-signal, RF testbenches and stimulus from pre-silicon design verification to post-silicon validation and production test could better integrate flows for analog/mixed-signal and RF ICs and modules from design to test. Such a framework could furtherly benefit characterization to production workflow by reducing variability and correlation time.
 
In this session we will share our partnership with some global leading semiconductor companies in improving semiconductor data management and analysis tools and building linkages between pre-silicon design verification tools to optimize over all flow from product concept to production.

View Full Agenda
505abc 會議室/ 南港展覽館一館五樓 Wednesday, September 23
1:30pm to 4:20pm

2020內容持續更新中!
Date:Wednesday, September 23rd, 2020
Time:13:30 - 16:20 (08:30-13:30 for registration)
Venue:Room 505abc, 5F, TaiNEX 1 / 台北南港展覽館一館 5樓 505abc會議室

To know more about ITC-Asia 2020, please visit our website!

Click here for ITC-Asia 2020 registration!

 

 

*Tax included

 

 

Co-organized by:
 
 
 
Sponsored by:
Daimond
 
 
       
         
 
Platinum
 
 
 
 
Gold
 
 
     
 
 
Advanced Testing Forum sponsor
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
         
       
       

 

 

View Full Agenda
505abc會議室/ 南港展覽館一館五樓 Friday, September 25
8:50am to 4:20pm

2020內容持續更新中!

Date:Thursday, September. 25th, 2020
Time:08:50 - 16:20 (08:20-08:50 for registration)
Venue:Room 505abc, 5F, TaiNEX 1/ 南港展覽館一館5樓 505abc會議室

To know more about ITC-Asia, please visit our website!

Click here for ITC-Asia 2020 registration!

 

 

 

 

*Tax included

 

Co-organized by:
 

 

 
Sponsored by:

Daimond

 

       
         
 
 
Platinum
 
 

 

 
Gold
 
 
     
         

 

Advanced Testing Forum Sponsor
 
* Forum agenda is subject to change
 
 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。

主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 
 
         
         
         

 

View Full Agenda
505abc 會議室/ 南港展覽館一館五樓 Thursday, September 24
8:50am to 4:20pm

2020內容持續更新中!

Date:Thursday, September. 24th, 2020
Time:08:50 - 16:20 (08:20-08:50 for registration)
Venue:Room 505abc, 5F, TaiNEX 1/ 南港展覽館一館5樓 505abc會議室

To know more about ITC-Asia, please visit our website!

Click here for ITC-Asia 2020 registration!

 

 

*Tax included

 

Co-organized by:
 
 
Sponsored by:

Daimond

 
 
       
 
 
Platinum
 
 
 
 
 
Gold
 
 
     
         
 
Advanced Testing Forum
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
         
         
         

 

 

View Full Agenda
Special Features 505abc 會議室/ 南港展覽館一館五樓 Wednesday, September 23
1:30pm to 4:50pm
Special Features 505abc 會議室/ 南港展覽館一館五樓 Thursday, September 24
9:00am to 5:00pm
Special Features 505abc 會議室/ 南港展覽館一館五樓 Friday, September 25
9:00am to 5:00pm
Thursday, September 19
9:00am to 9:30am
SMART Transportation Wednesday, September 18
10:00am to 10:30am
明日領袖論壇 Friday, September 20
1:30pm to 1:40pm
Thursday, September 19
1:20pm to 1:30pm
Thursday, September 19
4:30pm to 5:00pm
Friday, September 20
2:20pm to 3:20pm
Friday, September 20
2:20pm to 3:20pm

-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Panelist: 
1.Ms. Grace Wang, Taiwan Sales General Manager, Intel  
2.Ms. Poling Liu , HR Director , ASML  
3.Mr. Roger Chang, Vice President, Tokyo Electornic Ltd. 
4. (Inviting) TSMC 

Moderator: 
Mr. Benson Cheng, COO, Deloitte Management Consultant 

View Full Agenda
Friday, September 20
8:30am to 9:00am
RISC-V Taipei Day 台北南港展覽館一館 五樓 504a會議室 Friday, September 25
1:00pm to 5:00pm

 

日期 : 2020年9月25日 星期五
時間 : 13:00 - 17:00
地點 : 台北南港展覽館一館 五樓 504bc會議室
論壇主題 : RISC-V / Edge AI

 

        人工智慧(AI)邊緣晶片已進入高速成長階段,高運算量的新AI驅動應用程式已不斷增加,這將推動邊緣AI晶片組架構的創新。AI需要較大的算力來進行大量的數據資料分析,但是其執行的效能則取決於所針對的資料型態與演算法的優化程度,而RISC-V的彈性與靈活性剛好可以滿足AI的設計需求,目前已有越來越多的晶片應用商,轉而尋求RISC-V的解決方案。除了高性能運算之外,終端裝置也開始有越來越多的AI需求,如「邊緣智慧」等於是物聯網設備的強化版,無疑增強了RISC-V的市場動能。針對這波RISC-V商機,市調機構Semico樂觀預測,2025年全球市場將有超過624億顆採用RISC-V的處理器核心, Tractica也預估,RISC-V全球市場營收至2025年將高達11億美元,其中包括採用RISC-V架構之IP、軟體和開發工具之營收,而亞太地區獲利將佔據半數以上。這波RISC-V設計新革命即將引領Edge AI嵌入式設計應用的創新!

 

主辦單位 : 

                

 

協辦單位 : 
 

     

 

贊助夥伴 : 

                    

 

 

 

 

* Forum agenda is subject to change
 
 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

 

View Full Agenda
Special Features 攤位號#M1148, 未來舞台區/ 南港展覽館一館四樓 Wednesday, September 23
8:20am to 9:30am
Dr. Mark Liu 劉德音
董事長
台灣積體電路股份有限公司
Wednesday, September 18
2:00pm to 2:15pm

Abstract:

We will witness the most rapid development of information technology that is even faster than what we saw in the past six decades. Semiconductor technology is the foundation of 5G, AI, and the high performance computing that is necessary to process the data. The impending arrival of 5G means there will be enormous amounts of data generated by human-to-machine and machine-to-machine interactions. These data will in turn fuel advances in AI, which feeds upon vast amounts of data. Advances in AI and 5G will not only improve design and manufacturing productivity of the semiconductor industry, but their rapid adoption will also benefit other industries.

Semiconductor technology is no longer simply an economic driver, but has risen to carry geopolitical importance. Taiwan must take the lead in creating differentiation in a global competitive market; Taiwan must also strengthen the supply chain of semiconductor technology locally in Taiwan and anchor ourselves solidly in the global supply chain. This means drawing upon our established strengths in materials, device technologies, manufacturing, design, and packaging, and capitalizing on AI and 5G to push forward semiconductor technologies.

The global nature of the semiconductor industry means Taiwan can stay ahead only by ensuring we are at the absolute leading edge of research and development. This requires innovations. Innovations come from people. We must build strengths in our higher education system and nurture our next-generation of scientists and engineers. Attracting global talent to the universities of Taiwan and the industrial R&D laboratories is vital and must be a cooperation among government, public, and private enterprises.

View Full Agenda
Wednesday, September 23
3:20pm to 3:45pm
Mr. Ian Smythe
終端產品事業部 市場行銷副總裁
Arm
Thursday, September 19
11:00am to 11:30am

Abstract of Presentation:

View Full Agenda
Dr. Frank C. Huang 黃崇仁
董事長
力晶積成電子製造股份有限公司
Wednesday, September 18
3:00pm to 3:15pm

Abstract:

1. The progress of communication:Telephone => Mobile phone (GSM、2G) => Smart Phone / Mobile device / Cloud (3G、4G) => IoT / AI (5G)

2. Processing speed and energy consumption (heat) are the limit of AI & 5G application.

3. A new architecture evolutes from Von Neumann Architecture.

4. Single chip computer in 5G & AI application.

5. A prospect of neuron computing.

View Full Agenda
Thursday, September 19
3:40pm to 4:10pm
Thursday, September 24
3:05pm to 3:30pm
Thursday, September 19
4:35pm to 4:50pm
Dr. Eric Kuah
Vice President of Technology
先進太平洋股份有限公司
Thursday, September 19
10:40am to 11:10am

Abstract:

To form die bottom bonding and/or die top bonding for high power application the current state of art is to use different types of sintering material in particular silver dominated metal. We will discuss about newly developed sintering material and pressure sintering processes. In addition, we will discuss on the mechanism behind pressure sintering and the characterization of such sintered bond. The reliability of the sintered bond and bond quality are expound. A variant of results will be compare across different type of materials, which could provide insights to package designers for high-performance power electronics.

View Full Agenda
Thursday, September 19
11:10am to 11:40am
Friday, September 20
2:25pm to 2:50pm
Dr. Tien Wu 吳田玉
總經理暨執行長
日月光半導體製造股份有限公司
Wednesday, September 18
3:15pm to 3:30pm

Abstract:

How would the semiconductor ecosystem evolve in an era where scale and innovation are pushing the boundaries of the industry? What does the future hold for the semiconductor industry in general, and the packaging and test players in particular?

Dr Tien Wu attempts to put things in perspective as he discusses the industry trends and the challenges amidst an uncertain global economic environment. He will also take a deeper look at the forces that will drive innovation and new technology. The next generation of smart computing, 5G, AI and IoT will require heterogeneous integration more than ever, and is where IC packaging and test will increasingly play a leading role.

View Full Agenda
Wednesday, September 18
3:45pm to 4:00pm
曹世綸
全球行銷長暨台灣區總裁
SEMI國際半導體產業協會
谷立言
副處長
美國在台協會
卓政宏
執行長
財團法人資訊工業促進會
許惠嵐
公共事務部資深總監
台灣連線股份有限公司
鍾文雄
資深副總經理
一零四資訊科技
吳誠文
副校長
國立成功大學
呂正華
局長
經濟部工業局
蘇孟宗
產業科技國際策略發展所所長
工業技術研究院
張嵋嵐
人才招募處長
美光科技
K3076, 1F, TaiNEX 1 Wednesday, September 23
1:30pm to 4:00pm

Date:Wednesday, September 23th , 2020
Time:13:30 – 16:00
Venue:台北南港展覽館一館一樓K3076/ K3076,1F,TaiNEX 1 

13:30-13:35 Welcome Remarks:

  • SEMI國際半導體產業協會 全球行銷長暨台灣區總裁 曹世綸/ Mr. Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI

13:35-13:55 Opening Remarks: 

  • 美國在台協會 谷立言 副處長/ Mr. Raymond Greene, Deputy Director, AIT 
  • 行政院科技會報 蔡志宏 執行秘書/ Dr. Zse-hong Tsai, Executive Secretary, Office of Science & Technology, Executive Yuan
  • 財團法人資訊工業策進會 卓政宏 執行長/ Mr.Cheng-Hung Cho, President, Institute for Information Industry

13:55-14:00 Group Photo ​

14:00-14:20 Keynote Speech-"Next Generation Talent"

  • 台灣連線股份有限公司公共事務部 許惠嵐 資深總監/ Ms. Crystal Hsu, Director Corporate Affairs, LINE Taiwan

14:20-14:40 Keynote Speech:

  • 一零四資訊科技股份有限公司 鍾文雄 副總經理暨人資長/ Mr. Weber Chung, Senior Vice President of Human Resources and Administration General Division, 104 Corporation

14:40-16:00 Panel Discussion: the Prospect for Taiwan’s High-tech Talent in the Digital Age 

Moderator:

  • 之初創投 王琍瑩 法務輔導長/ Ms. Liying Wang, Legal Master, AppWorks

Panelists:

  • 經濟部工業局 呂正華 局長/ Mr. Jang-Hwa Leu, Director General, MOEA IDB 
  • 美光科技 人才招募處 張嵋嵐 處長/ Ms. Milan Chang, Talent Acquisition Director, Micron Technology
  • 財團法人工業技術研究院 產業科技國際策略發展所 蘇孟宗 所長/ Mr. Stephen Su, Vice President, ITRI
  • 國立成功大學 吳誠文 副校長/ Dr. Cheng-Wen Wu, Vice President, NCKU

 

 *本場論壇為免費論壇

 *本場論壇全程使用中文進行

 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。

主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

 

View Full Agenda
Special Features 500 會議室/ 南港展覽館一館五樓 Thursday, September 24
9:00am to 12:10pm
Advanced Testing Forum 505a會議室/ 南港展覽館一館五樓 Friday, September 25
8:20am to 4:30pm

2020內容持續更新中!

Date:Friday, September 25th, 2020
Time:08:50 - 16:30 (08:20-08:50 for registration)
Venue:Room505a, 5F, TaiNEX 1/ 南港展覽館一館5樓 505a會議室 

Forum Chairs:

  • Dr. Cheng-Wen Wu 吳誠文, 副校長, 國立成功大學;協理兼南分院執行長, 工研院 / 共同主席, SEMI Taiwan測試委員會
  • Mr. CJ Hsieh 謝承儒, 總經理, 英特爾創新科技/ 共同主席, SEMI Taiwan測試委員會

Forum Vice Chair:

  • Ms. Wendy Chen 陳文如, 協理, 京元電子/ 副主席, SEMI Taiwan測試委員會

Moderators: 

  • Mr. Roger Hwang 黃俊傑, 資深處長, 日月光半導體製造股份有限公司

  • Dr. Ching Cheng Tien 田慶誠, 技術長, 矽格股份有限公司

Theme: Next generation test architectures and systems for AIoT and 5G
Outline: 

  • Taiwan became the spot light of Semiconductor Manufacturing supply chains center.  The most advanced innovative process of Semiconductor and  creative IC design structure be realized and succeeded mass production fulfill the blooming applications in new generation communication, intelligent transportation , advance medical technologies and smart manufacture.  However , the challenges are coming along with how to ensure the manufacturing procedure could have high  production yield .  Therefore the advance test technologies are getting important and also can’t stick in the traditional testing concepts. As we know, the high percentage of test systems were composed of semiconductor IC. This traditional concepts of test system will induce a lot of problems which come from using old generation of technologies to verified novel IC with new generation of technologies.  The breakthrough test architecture and methods should be take into account with brainstorming . 
  • In this 2nd Advance Test Forum , the main theme was steamed from this concept as “The Next Generation Test Architecture and System for AIOT and 5G “ and invited specialists from the leading edge of Semiconductor supply chains to share their viewpoints. At the same time, lots of  academic researcher and professor also will participate this event together through the corporation with IEEE International Test Conference Asia which will be hold at Taiwan this year. The 2nd Advance Test Forum will be positioned as Corporate Session of IEEE International Test Conference Asia and arranged at the best part of finale to show up the best industrial practices for enriching this great event.

 

 

早鳥價
(7/13-8/31)
原價
(9/1-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)

學生價 (不含EMBA)
(7/13-9/25)

NTD2,500 NTD3,150

NTD2,500

5人以上享NT$2180

NTD800

*Tax included

 
Sponsored by:
         

 

 
 
* Forum agenda is subject to change
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

 
 

 

View Full Agenda

 

 

 

Advanced Materials Technology High-Tech Facility Innovative Technology & Product 

 

2020年9月23日 (星期三)

TechXPOT 1F #K2786

時間 公司 主題 發表語言
11:40 - 12:00 美國康寧 The Benefits of Using Glass Carriers for Wafer Thinning 英文
12:00 - 12:20 昇貿科技股份有限公司 新世代高可靠度無鉛銲錫合金 中文
13:40 - 14:00 山太士股份有限公司 山太士晶圓翹曲解決方案 英文
14:00 - 14:20 華矽創新股份有限公司 Non-Prime Silicon Wafer Value Chain and Challenges 中文
14:20 - 14:40 貝達先進材料股份有限公司 化學研磨抛光墊產品介紹-貝達先進 中文
14:40 - 15:00 台灣小原光學股份有限公司 玻璃原材料製造商”OHARA”的事業領域與技術 ~邁向下一世代半導體製造紀元~ 中文
15:00 - 15:20 賀利氏 新!AgCoat Prime – 可取代昂貴的金線用於記憶體及智慧卡封裝 中文
15:20 - 15:40 立達特股份有限公司 翔名之關鍵零組件-前瞻表面處理技術 中文
15:40 - 16:00 5N Plus Inc Ultra-Fine Metal Powders for Emerging Mini-LED and Micro-LED Display Technologies 中文
16:00 - 16:20 恩良企業股份有限公司 抗輻射絕緣材料在地化生產 中文

 

TechXPOT 4F #N0786

時間 公司 主題 發表語言
10:40 - 11:00 金兆益科技股份有限公司 半導體高階製程第三方檢核測試之需求與趨勢 中文
11:00 - 11:20 台灣喜開理股份有限公司 CKD半導體廠務化學藥品系統控制用流體閥介紹 中文
11:20 - 11:40 漢科系統科技股份有限公司 製程尾氣微塵減排 中文
11:40 - 12:00 志尚儀器股份有限公司 高科技廠房微汙染與排放管道氣體最新分析技術應用介紹 中文
13:00 - 13:20 SEMI Taiwan 高科技廠房設施委員會 多服務邊際運算與機器人生態系協作服務 中文
13:20 - 13:40 太丞股份有限公司 最佳化冷卻水塔佈水系統之設計與開發 中文
13:40 - 14:00 奇立實業(股)公司 FFU產品未來發展方向及整合服務 中文
14:00 - 14:20 台灣羅達萊克斯有限公司 Rotarex: 氣體安全及設備的守護者 — 閥門、接頭及墊片 中文
14:40 - 15:00 濾能股份有限公司 化學濾網的循環經濟之路與未來展望 中文
15:00 - 15:20 信紘科技股份有限公司 半導體綠色製程趨勢及相應解決方案 中文
15:20 - 15:40 鈺祥企業股份有限公司 5G與AI時代的後盾-AMC控制之循環經濟創新解決方案 中文
15:40 - 16:00 巨路國際股份有限公司 廠務轉動機械無線振動健康狀態監視 中文

 

 

 

2020年9月24日 (星期四)

TechXPOT 1F #K2786

時間 公司 主題 發表語言
13:30 - 14:00 微正股份有限公司 一款高精度量測設備-“六維運動量測 (MMD)” 中文
14:00 - 14:30 AEM Holdings Ltd. Next Generation System Level Test (SLT) 英文
14:30 - 15:00 亞智科技股份有限公司 Manz Novel Plating Solutions for FOPLP RDL formation 中文

 

TechXPOT 4F #N0786

時間 公司 主題 發表語言
11:00 - 11:30 廣化科技股份有限公司 半導體封裝製程的躍進 - 甲酸應用於無活性助焊劑真空焊接製程的問題及突破 中文
11:30 - 12:00 億合科技股份有限公司 Maskless Digital Lithography MLE™ Enabling Heterogeneous & Chiplet Integration 中文
13:30 - 15:00 國家實驗研究院台灣儀器科技研究中心 「國研院先進半導體設備與製程技術」在地化成果發表會 中文

 

 

2020年9月25日 (星期五)

TechXPOT 1F #K2786

時間 公司 主題 發表語言
10:20 - 10:40 Genesink Taiwan GenesInk的先進奈米材料 中文
10:40 - 11:00 台灣長瀨股份有限公司 Nagase Knowledge Creation SaaS(Software as a Service) for Semiconductor Industry 中文
11:00 - 11:20 台灣斯倍利亞股份有限公司 NIHON SUPERIOR SOLDER MATERIALS TOTAL SOLUTION 中文
11:20 - 11:40 德商世泰科 H.C. Starck Solutions - Continued  Excellence in Refractory Metal Target Manufacturing 中文
11:40 - 12:00 好加企業有限公司 耐熱UV解黏切割膠帶 中文

 

TechXPOT 4F #N0786

時間 公司 主題 發表語言
10:20 - 10:40 中軸科技服務股份有限公司 半導體設備廠務設備監控系統 中文
10:40 - 11:00 富泰空調科技股份有限公司 Thermal clean chamber / Design and application of the graphic control software Programmi 中文
11:00 - 11:20 ECI Technology Inc. Chemical quality control in advanced generation semiconductor industry 中文
11:40 - 12:00 財團法人精密機械研究發展中心 實現新型態安全智慧工廠 中文
12:00 - 12:30 SEMI Taiwan 高科技廠房設施委員會 晶圓載具之微污染控制的創新解決方案 中文

 

SEMICON Taiwan 2020 內容持續更新中!

View Full Agenda
Special Features 攤位號#K3276, TechXPOT / 南港展覽館一館一樓 Wednesday, September 23
12:40pm to 4:00pm
Special Features 攤位號#K3276, TechXPOT / 南港展覽館一館一樓 Friday, September 25
10:20am to 2:10pm
Special Features 攤位號#K3276, TechXPOT / 南港展覽館一館一樓 Thursday, September 24
1:00pm to 4:00pm
Special Features 攤位號#L1316, TechXPOT / 南港展覽館一館四樓 Wednesday, September 23
10:40am to 4:20pm
Special Features 攤位號#L1316, TechXPOT / 南港展覽館一館四樓 Thursday, September 24
10:30am to 4:30pm
Special Features 攤位號#L1316, TechXPOT / 南港展覽館一館四樓 Friday, September 25
10:20am to 12:00pm
Special Features 雅悅會館馥儷廳/ 中信企業總部A棟三樓 Thursday, September 24
8:50am to 4:15pm
Power Electronics and Optoelectronics Semiconductor Technology Forum 雅悅會館寶儷廳, 中信企業總部A棟三樓 Thursday, September 24
8:20am to 4:50pm

2020內容持續更新中!

Date:Thursday, September 24th, 2020
Time:08:20 - 16:50 (08:20-08:50 for registration)
Venue:Luxury Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park / 雅悅會館寶儷廳, 中信企業總部A棟三樓

Theme: Compound Semiconductor’s Killer Applications, Challenges and Opportunities

Chair:

  • Mr. Brian Lee 李宗鴻, 策略長, 穩懋半導體股份有限公司/ 主席, SEMI Taiwan 功率暨化合物半導體委員會

Vice Chairs:

  • Dr. Yi-Cheng Cheng 程一誠, 材料暨光電研究所所長, 國家中山科學研究院/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會
  • Mr. Andy Chuang 莊淵棋, 總經理, 漢磊科技股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會
  • Dr. Barry Jia-Fu Lin 林嘉孚, 技術長, 聯穎光電股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會

​Moderator:

  • 上午場:Mr. Andy Chuang 莊淵棋, 總經理, 漢磊科技股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會
  • 下午場:Dr. Barry Jia-Fu Lin 林嘉孚, 技術長, 聯穎光電股份有限公司/ 副主席, SEMI Taiwan 功率暨化合物半導體委員會

Outline: 

  In the past decade, compound semiconductor came out from the big shadow of silicon and now it has taken the center stage of several killer applications which will impact our daily life in the future. Among them, TRx for 5G communication, Lidar for automotive, 3D sensing for industrial machine and security, and WGB (wide band gap) FET for efficient power conversions are the key focus areas.

  In this session, we will take you to understand the technical challenges faced today and to foresee the killer applications. Meanwhile, our view points of solutions will be provided in terms of device & circuit designs, tool developments, packaging techniques and system integrations. World leaders in this industry will give you deep & insightful discussions. Definitely, the session will not be concluded without an in-depth market trend presentation by a leading consulting firm.

 
 
 
 
 
早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)

學生價
(7/13-9/25)

NTD 3,200 NTD 4,000 NTD 3,200 5人以上再享9折 NTD 800

*Tax Included

 
 
Organizer:
     
   

 

Co-organizer:
          
           

 

 

Sponsored by:

                                               

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

 

 

 

 

       
View Full Agenda
Special Features 雅悅會館翡儷廳/ 中信企業總部A棟三樓 Thursday, September 24
12:00pm to 1:30pm
Wednesday, September 23 10:00am

下世代半導體材料新星 引爆市場新商機!

揭秘多元終端應用面紗 全在化合物半導體創新應用館

5G議題在2020年持續發酵,全球5G應用市場預估2030年成長至7500億美元,不僅全球 電信服務商皆積極佈署5G基站,5G手機出貨量較去年成長近10倍,更多創新應用裝置與服務 也接連推陳出新。除此之外,今年整體汽車銷售雖受疫情影響而下滑,電動車與智慧輔助駕駛的 發展在長遠來看仍呈樂觀成長態勢,分別將於2025年上探7%及12%的市佔率。在高功率時 代下,包括5G通訊射頻模組、3D感測 VSECL 泛光源、自動駕駛的毫米波雷達、電動車功率 電子元件等終端應用皆需要仰賴化合物半導體高功率、低耗損的特性。因此,在多元終端應用市 場強勁成長帶動下,化合物半導體材料及關鍵零組件需求進而受惠,根據SEMI的預測,全球功 率暨化合物半導體元件之晶圓廠設備支出將在2021 年更將大幅躍升 59%,創下 69 億美元的新 紀錄。 在終端應用需求成長之際,化合物半導體產業發展仍面臨上中下游產業鏈整合不足的挑戰。 SEMICON Taiwan 2020 國際半導體展規劃一系列化合物半導體主題展區、論壇及商業聯誼活 動,廣邀設備材料、設計製造、及應用服務領導廠商,打造跨產業鏈、跨領域交流平台,期望透 過對話與交流,創造更多合作與商機,並強化資源整合發揮綜效,加速推進技術及應用創新速度。 

 

專家開講 

2020年9月23日 (三)

時間 主題 公司名 發表語言
10:40 - 11:20 歡迎致詞    
11:00 - 11:20 Fire Up GaN-Based Semiconductor by Optimizing The Substrate 合晶科技股份有限公司  中文
11:20 - 11:40 Opportunities and Challenges in High-Volume Production of Wide-Bandgap Power Technologies 應用材料公司 中文
11:40 - 12:00 TRANSFORMING THE WORLD: High Power, Small, Efficient Chargers with GaN GaN Systems Inc. 英文
13:40 - 14:00 Advanced Telecom Power in 5G Era 台達電子工業股份有限公司 中文
14:00 - 14:20 遠傳5G 產業新契機 - 5G專網與應用探討 遠傳電信股份有限公司 中文
14:20 - 14:40 高頻高功率半導體元件模組化技術發展趨勢 工業技術研究院 中文
14:40 - 15:00 漢威簡介及GaN HEMT元件製程介紹 漢威光電股份有限公司 中文
15:00 - 15:20 遠傳5G極速飆網 - friDay 影音/VR體驗 遠傳電信股份有限公司 中文

 

2020年9月24日 (四)

時間 主題 公司名 發表語言
11:00 - 11:20 MOCVD Technology Enabling GaN on Si Power/RF Application 愛思強股份有限公司 中文
11:20 - 11:40 化合物半導體元件在5G與次世代功率元件之發展契機 聯華電子股份有限公司 英文
11:40 - 12:00 遠傳5G極速飆網 - friDay 影音/VR體驗 遠傳電信股份有限公司 中文
14:00 - 14:20 Realize Compound Semiconductor Potential!  晶成半導體股份有限公司 中文
14:20 - 14:40 高頻高功率半導體元件模組化技術發展趨勢 工業技術研究院 中文

 

2020年9月25日 (五)

時間 主題 公司名 發表語言
11:20 - 11:40 Opportunities and Challenges in High-Volume Production of Wide-Bandgap Power Technologies 應用材料公司 中文
11:40 - 12:00 遠傳5G極速飆網 - friDay 影音/VR體驗 遠傳電信股份有限公司  
14:30 - 15:00 晶喜獎不完    

 

2020年資訊陸續更新中!

 

贊助單位

                           
 
         

                                 

View Full Agenda
Special Features 攤位號#I2700, 化合物半導體創新應用館/ 南港展覽館一館一樓 Wednesday, September 23
10:50am to 3:40pm
Special Features 攤位號#I2700, 化合物半導體創新應用館/ 南港展覽館一館一樓 Thursday, September 24
11:00am to 2:40pm
Special Features 攤位號#I2700, 化合物半導體創新應用館/ 南港展覽館一館一樓 Friday, September 25
11:00am to 12:00pm
Semiconductor Advanced Inspection and Metrology Forum 402ab 會議室/ 南港展覽館一館四樓 Friday, September 25
8:30am to 4:30pm

 

Date:Friday, September 25th, 2020
Time:08:30 - 16:30 (08:30-09:00 for registration)
Venue:Room 402ab, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 402ab會議室

Theme:  Innovation and Commercialization of Semiconductor Inspection and Metrology Technologies

Forum Chairs and Vice Chairs:

  • Mr. Leo Huang 黃欽明, 董事長兼總經理, 致茂電子股份有限公司/主席, SEMI Taiwan檢測與計量委員會
  • Dr. Fong-Zhi Chen 陳峰志, 副主任, 國家實驗研究院台灣儀器科技研究中心/副主席, SEMI Taiwan檢測與計量委員會
  • Mr. Frank Tsai 蔡文豪, 處長, 漢民科技股份有限公司/副主席, SEMI Taiwan檢測與計量委員會
  • Dr. Victor, Tzeng-Yow Lin 林增耀, 執行長, 工業技術研究院量測技術發展中心/副主席, SEMI Taiwan檢測與計量委員會

Outline:  

The global semiconductor inspection equipment market size is expected to reach USD 6883.7 million by 2025, from USD 5783.5 million in 2019. However, due to the outbreak of COVID-19, the industry has been impacted by manufacturing disruption. To facilitate innovation and commercialization of semiconductor inspection and metrology technologies, measurement challenges and relevant solutions would be discussed through the Semiconductor Advanced Inspection and Metrology Forum, which provides a platform for the communication of market trends and state-of-the-art technologies.

 
 
 
 
 
早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)
學生價(不含EMBA)
(7/13-9/25)
NTD 3,200 NTD 4,000 NTD 3,200 5人以上再享9折 NTD 800

*Tax Included

 
 
Organizer:
 
     

 

Sponsored by:

 

 

 

 

 

 

 

 

   

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

 

 

       
View Full Agenda
Special Features 402ab 會議室/ 南港展覽館一館四樓 Friday, September 25
8:30am to 4:15pm
Special Features 401 會議室/ 南港展覽館一館四樓 Friday, September 25
9:00am to 3:55pm
401 會議室/ 南港展覽館一館四樓 Friday, September 25
8:30am to 4:40pm

2020內容持續更新中!

Date:Friday, September 25th, 2020
Time:08:30 - 16:40 (08:30-09:00 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室

Theme: Key Advanced Technologies Enabling 5G, AI and Beyond

Chair:

Vice Chairs:

  • Mr. G.C. Hung 洪圭鈞, 副總經理, 聯華電子股份有限公司/ 副主席, SEMI Taiwan IC委員會
  • Mr. Rutgers Chow 周雷琪, 全球業務執行副總裁, 住程科技系統有限公司/ 副主席, SEMI Taiwan IC委員會

Moderator:

Outline: 

Semiconductor Technologies are key enablers of 5G and AI and play a vital role in delivering a world of on-demand experiences and continuous connectivity. As we enter a new decade and the Information Era, semiconductor devices and their many applications continue to serve as the growth engine for the semiconductor industry. IC designers, producers and semiconductor companies need to prepare for 5G’s opportunities and harnessing the benefits of employing AI in chip design to building collaborative ecosystems and supply chains, to identifying future use cases 5G will enable.

At the upcoming SEMICON Taiwan, the IC Forum will feature exciting topics around 5G mmWave technologies, smart chip design, process technologies for 5G and beyond, materials innovation, latest on patterning with the EUV and EUV assisted materials/technologies, and so on. Scaling factors and key enabling technology challenges will be discussed and solutions to address these challenges will also be presented.

Renowned experts in the industry are invited to share their perspectives and discuss the vast commercial opportunities for the electronics industries and semiconductor supply chain in this new and exciting era.

 

 
早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)

學生價 (不含EMBA)
(7/13-9/25)

NTD 3,200 NTD 4,000 NTD 3,200 5人以上再享9折 NTD 800

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

 

 

       

 

 

View Full Agenda
Special Features 攤位號#J3246, 人才培育特展/ 南港展覽館一館一樓 Wednesday, September 23
1:30pm to 4:00pm
Mr. Jong-Chin Shen 沈榮津
部長
行政院經濟部
Wednesday, September 18
4:00pm to 5:00pm
Wednesday, September 18 9:00am

>> 2019年 資訊持續更新中!

View Full Agenda
Wednesday, September 18 5:00pm
Wednesday, September 18
1:20pm to 1:50pm
Special Features 401 會議室/ 南港展覽館一館四樓 Wednesday, September 23
1:20pm to 5:00pm
401 會議室/ 南港展覽館一館四樓 Wednesday, September 23
1:20pm to 5:00pm

 

 

感謝各界熱烈參與,大師論壇401場次已報名額滿!即刻加開現場直播室 504A 及 503 (5F),名額有限,請盡早報名!

點此立即報名

 

Date:Wednesday, September 23rd, 2020
Time:13:20 - 17:00 (13:20-13:40 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室
Theme: 5G x AI 半導體產業大未來

Outline: 
With the dynamic development of applications like mobility, connectivity and computing led by AI and 5G, semiconductor is the key of enabling all the major innovations.  Meanwhile, the severe pandemic impact, the ever-changing geopolitics, and the growing global coopetition make semiconductor and its ecosystem strategically vital.  Taiwan, at the core of this global industry, leads the way through cutting-edge technology, manufacturing capability and symbiotic collaboration with worldwide pioneering semiconductor and application leaders.  With this forum, we invite leaders from Taiwan, US and Europe to explore and envision that at this unprecedented era when risk and opportunity co-exist like never before, how semiconductor continuously leads the countless innovations like 5G & AI technologies and how 5G & AI, in return, empower semiconductor industry for its sustainable competitiveness.

 
 
早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)
學生價 (不含EMBA)
(7/13-9/25)
NTD3,000 NTD3,750 NTD3,000 5人以上再享9折 NTD800

 

 

 

 

Sponsored By: 

    
     

 

 

 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
       

 

View Full Agenda
Special Features 南港展覽館一館一樓/ 四樓 Wednesday, September 23
10:00am to 5:00pm
Special Features 南港展覽館一館一樓/ 四樓 Thursday, September 24
10:00am to 5:00pm
Special Features 南港展覽館一館一樓/ 四樓 Friday, September 25
10:00am to 4:00pm
Wednesday, September 05 10:00am
MEMS & Sensors Forum 504bc 會議室/ 南港展覽館一館五樓 Tuesday, September 22
8:30am to 4:15pm

Date : Tuesday, September 22nd , 2020
Time :  08:30 – 16:15 (8:30-8:50 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme : Healthcare/Environmental Sensors For A Better Life

2020 becomes a very challenging and tough year for all human beings since unexpected COVID-19 virus rapidly spreads worldwide and without doubts puts catastrophic effects on earth, which significantly damages the life and public health, medical systems, transportation, economics, and even our daily life pattern.

Till now, there’s no effective solution, such as medication and vaccine, to the epidemic and we might have to live with it for a long time. As a result, the sensor society and industry are expected to play an important role on this battle against the virus, and this brings “Healthcare/Environmental Sensors for a Better (Real) Life” being the main theme of 2020 SEMICON Taiwan MEMS & Sensors Forum.

In connection with this topic, the forum will invite experts from leading company  to share their perspective about system & application, advanced sensor device including environmental monitoring sensor, ultrasonic diagnostic instrument, spectrometer…etc, manufacturing & material and market trend about life science. This event would be a great platform to mingle with experts and foster cross industry collaborations.

 

 

早鳥
(07/13-09/04)
原價    
(09/05-09/25)
團體早鳥(5人以上) 
(07/13-09/04)
團體原價(5人以上)
(09/05-09/25)
學生(不含EMBA)
(07/13-09/25)
會員 非會員 會員 非會員 會員 非會員 會員 非會員 -
NTD1,800 NTD2,250 NTD2,500 NTD2,900 NTD1,620 NTD2,025 NTD2,250 NTD2,610 NTD800

*Tax Included

 

主辦單位 :
            

贊助廠商 : 
 

                         

        

 

 

     

 

合作媒體 : 
 

   

                      

     
     
     
          
     
     
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

* Forum agenda is subject to change

 

        

 

 

 
 
 
View Full Agenda
Special Features 異質整合創新技術館 專家開講舞台 Wednesday, September 23
1:30pm to 3:40pm

研討會資料陸續更新中!

View Full Agenda
Special Features 攤位號#I2013a / 南港展覽館一館一樓 Friday, September 25
12:30pm to 1:30pm
Tuesday, September 04 8:00am
Ms. Pola Chang 張雅惠
資訊科技公共事務部協理
104人力銀行
Mr. Eddie Chung 鍾鴻儒
獵才招聘處顧問
104人力銀行
Ms. Vivi Wong 翁維薇
顧客價值處協理
104人力銀行
K3076, 1F, TaiNEX 1 Wednesday, September 23
10:30am to 12:00pm

Date:Friday, September 23th , 2020
Time:10:30 – 12:00
Venue:台北南港展覽館一館一樓K3076/ K3076,1F,TaiNEX 1 

10:10-10:30 Registration

10:30-11:00 半導體搶才與職人樣貌/ Talent Recruiting and Workplace in Semiconductor Industry

  • 104資訊科技公共事務部 張雅惠協理/ Ms. Pola Chang, Director of Public Affairs Department, 104 Corporation

11:00-11:30 前進半導體產業的關鍵能力/ Key Elements to Start your Career in Semiconductor Industry

  • 104人力銀行 獵才招聘處 鍾鴻儒顧問/ Mr. Eddie Chung, Consultant of Headhunter Business Group, 104 Corporation

11:30-12:00 履歷面試最常犯的十大錯誤/ Tips for Interviews: Do’s and Don’ts

  • 104人力銀行顧客價值處 翁維薇協理/ Ms. Vivi Wong,  Director of Customer Value Management, 104 Job Bank

*本場論壇為免費論壇

 *本場論壇全程使用中文進行

 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。

主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

View Full Agenda
Special Features 攤位號#J3246, 人才培育特展/ 南港展覽館一館一樓 Friday, September 25
1:00pm to 3:00pm
Dr. J. Andrew Yeh/ 葉哲良
副執行秘書
行政院科技會報
Mr. Jason Chin/ 晉麗明
獵才招聘事業群資深副總經理
一零四資訊科技
Mr. Alvin Lee/ 李佳信
業務處處長
布魯爾科技
Mr. Roger Chang/張天豪
執行副總裁
東京威力科創股份有限公司
Dr. Meng Fan Chang/ 張孟凡
技術研究處長
台灣積體電路製造
K3076, 1F, TaiNEX 1  Friday, September 25
1:30pm to 3:00pm

Date:Friday, September 25th , 2020
Time:13:30 – 15:00
Venue:台北南港展覽館一館一樓K3076/ K3076,1F,TaiNEX 1 
Theme: How to improve competitiveness in workforce development ?

13:00-13:30 Registration​

13:30-13:40 Opening Remarks

  • 行政院科技會報 葉哲良 副執行秘書/ Dr. Andrew Yeh, Deputy Executive Secretary, Office of Science and Technology, Executive Yuan

13:40-15:00 Panel Discussions: How to improve competitiveness in workforce development ?​

Moderator:

  • 104資訊科技 獵才招聘事業群 晉麗明 資深副總經理/ Mr. Jason Chin, Senior Vice President of Headhunter Business Group, 104 Corporation

Panelists: : 

  • 東京威力科創 張天豪 執行副總裁/ Mr. Roger Chang, Executive Vice President, Tokyo Electron Taiwan
  • 台灣積體電路製造 張孟凡 處長/ Dr. Meng Fan Chang, Director, TSMC
  • 布魯爾科技 李佳信 業務處處長/ Mr. Alvin Lee, Sr. Director, Brewer Science                                                      

Outline:

本次以 How to Improve Competitiveness in Workforce Develpoment為主題,力邀重量級講師共同談論提升產業人才競爭力、建構視野的重要性以及如何應對新AI時代的到來,人才所需面臨的機會與挑戰,希望藉由經驗交流與傳承,共同在這數位變遷的時代提供寶貴的意見以及建構出無限美好的科技未來。

How do you prepare for a 21st century workforce? How to improve competitiveness in workforce development? SEMI Talent Forum will focus on developing what we can do to be ready in the career and how to attract and retain the best talent in the industry to lead the future!

*本場論壇為免費論壇 

*本場論壇全程使用中文進行

 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。

主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

View Full Agenda
504bc會議室/ 南港展覽館一館五樓 Friday, September 25
8:30am to 12:20pm

Date : Friday, September 25th , 2020
Time :  08:30 – 12:20 (8:30-8:50 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室

論壇主持人 : 

張錫嘉, 國立交通大學電子工程學系教授
何宗易, 國立清華大學資訊工程學系教授

With the internet of things (IoT) explosion on the horizon, device security is the risk to business, national infrastructure even to personal health. Chip security becomes a major issue. For example, recently discovered hardware vulnerabilities such as Meltdown and Spectre are difficult or even impossible to patch.

But in real world, chip designers and makers usually struggle with technical issues such as performance and energy efficiency. However, with the ubiquitous of security in the modern word, it should be front and center of how chips are designed. The topics of security are perhaps even more important than beating Moore’s Law since it becomes difficult in fixing problems that do arise.

On the path of realizing intelligent world, we need to think about how to build secured system at the most fundamental architectural level of the system itself. Semiconductor security is dynamic and should evolve organically to intelligently and proactively protect changing workloads and applications. Security on Chip forum will share insights about security concern in today and future design.

 

早鳥
(07/13-09/04)
原價    
(09/05-09/25)
團體早鳥(5人以上) 
(07/13-09/04)
團體原價(5人以上)
(09/05-09/25)
學生(不含EMBA)
(07/13-09/25)
會員 非會員 會員 非會員 會員 非會員 會員 非會員 -
Free Free Free Free Free Free Free Free Free

*Tax Included

主辦單位 : 

     

贊助廠商 : 

 

 

* Forum agenda is subject to change
 
 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。

主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

View Full Agenda
Special Features 504bc 會議室/ 南港展覽館一館五樓 Friday, September 25
8:30am to 12:20pm
Special Features 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 23
8:30am to 11:50am
Smart Mobility Forum 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 23
8:30am to 12:20pm

Date : Wednseday, September 23rd , 2020
Time :  08:30 – 12:20 (8:30-9:00 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme : Innovations Drive Smart Mobility Development

Disrupted by technology and new market entrants, smart mobility industry is in fluctuation. Technological advances such as interactive safety systems, vehicle connectivity, and self-driving cars change the game. 

According with Reports & Data, the market of connected cars will reach USD 197.12 billion by 2026. The widespread application of IoT in smart mobility fosters the vehicle connectivity and enhances driver experience. 

To facilitate the development of smart mobility, cross integration between industries breaks the traditional supply chain. That is, a brand-new value chain has created network to involve more industries such as service providers and startup companies. With this trend, the innovative thinking and novel business model speed up the application of prospective technology in smart mobility.

This time, Smart Mobility Forum 2020 covers all the important topics including AI, 5G, sensing technology, communication, advanced autonomous driving technology etc., goes deeper to the ecosystem of emerging tech roadmap and the optimal business models of mobility revolution.

 

早鳥
(07/13-09/04)
原價    
(09/05-09/25)
團體早鳥(5人以上) 
(07/13-09/04)
團體原價(5人以上)
(09/05-09/25)
學生(不含EMBA)
(07/13-09/25)
會員 非會員 會員 非會員 會員 非會員 會員 非會員 -
NTD1,600 NTD2,000 NTD2,200 NTD2,750 NTD1,440 NTD1,800 NTD1,800 NTD2,250 NTD800

*Tax Included

指導單位 :
 

                                
     
     
主辦單位 :    

   

                 

     

協辦單位 : 

    

   
     
贊助廠商 :    
          
     
     
     
     
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

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Special Features 宴會廳 B Room / 南港展覽館一館三樓 Wednesday, September 23
12:00pm to 1:30pm
Special Features 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 23
1:30pm to 5:05pm
SMART MedTech 504bc 會議室/ 南港展覽館一館五樓 Wednesday, September 23
1:30pm to 4:35pm

 

Date :Wednesday, September 23rd , 2020
Time :13:30 – 16:35 (13:30-14:00 for registration)
Venue :Room 504bc, 5F, TaiNEX 1 / 台北南港展覽館一館 五樓 504bc會議室
Theme : Post COVID-19 Era, Shaping The Next Generation Health Care

 

With the trend of digital transformation and infinite power of data offers more effective and personalized treatment for patients. The global medical technology industry continues to grow, according to 2019 EY MedTech report has founded that revenues increased by 7% to US$407.2b in 2018 to 2019. Most worthy of mention is that bioinformatics and biosensors have grown steadily over the last decade and accelerate the development of innovative MedTech products.

This year, due to COVID-19 spreads out seriously, every country pays attention on how to tackle with this virus. Governments and hospitals are using advanced health care solution including robotics, telemedicine, mobile health applications, sensor technology, data analytics and AI to prevent people from infection. Apparently, in order to facilitate MedTech to be more evolved and successful, MedTech companies need to have strong alignment with microelectronics to develop a business model and create value in the future.

In Smart MedTech Forum, we are not only discuss about the details of collaboration between microelectronics and MedTech industry, but also share the development of semiconductor industry involved in MedTech through investing more resource to realize Smart MedTech in the future.

 

早鳥
(07/13-09/04)
原價    
(09/05-09/25)
團體早鳥(5人以上) 
(07/13-09/04)
團體原價(5人以上)
(09/05-09/25)
學生(不含EMBA)
(07/13-09/25)
會員 非會員 會員 非會員 會員 非會員 會員 非會員 -
Free Free Free Free Free Free Free Free Free

*Tax Included

指導單位 : 

  

主辦單位 : 

協辦單位 : 

  

合作媒體 :

 

    

 

* Forum agenda is subject to change    

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

   

 

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Special Features 攤位號#K2041a / 南港展覽館一館一樓 Friday, September 25
12:30pm to 1:30pm
Wednesday, September 23
10:00am to 4:00pm

以實現終端市場需求。 終端應用產品不斷朝多功能、高效能及低功耗趨勢發展,為滿足更多高性能應用,半導體產 業朝向將多種不同功能的晶片整合於單一模組中 , 縮短元件之間的距離,達到異質整合效益。 綜觀長期,異質整合不僅被視為延續摩爾定律最佳解決方案,由於其具備提升效能、降低成本與縮小體積等優點,已成為半導體產業發展趨勢,未來將會被大量應用在終端產品中。 然而,迎接異質整合時代來臨,不單只是封裝技術的演進,全半導體產業鏈都將面臨許多劇烈的變革及創新,半導體業者紛紛摩拳擦掌,準備掌握這波新商機。

異質整合技術創新館,將完整勾勒出半導體未來 20 年產業藍圖,展出最新的 IC 設計 , 封裝 技術 , IC 載板以及應用端趨勢!

地點 : 南港展覽館1館1F (Booth #I3016)

 

展示內容

2020年資訊陸續更新中!

 

Brought to you by

 

 

 

 

異質整合系列活動

 

扇出型封裝技術研討會 Fan-out Packaging Technology Seminar

2020年9月23日 (三)

南港展覽館1館1F (Booth #I3016)

主辦單位:
合辦單位:  

立即免費報名

 

時間 主題 講師資訊
13:00-13:30

Registration

報到

 
13:30-13:40

Opening Remarks

歡迎致詞

 
13:40-14:10

Recent Progress of Chiplets Integrated Packages in Semiconductor Industry

晶片集成封裝於半導體業的最新發展

Mr. Key Chung, Senior Director, Siliconware Precision Industries Co., Ltd.
鄭子企 資深處長, 矽品精密工業股份有限公司
14:10-14:40

Laser & Plasma Applications Employed in Fan-Out Assembly Processes

扇出封裝製程的雷射與電漿整合應用

Mr. Amin Chen, E&R Engineering Corp.
陳昭明 雷射製程研發工程研究員, 鈦昇科技股份有限公司   
14:40-15:10

Opportunities and Challenges for Fan-out Panel Level Packaging

面板及扇出型封裝的市場機會和技術挑戰

Mr. Eric Cheng, New Business Development Dept. Manager, Manz Taiwan Ltd.
鄭海鵬 新事業開發部經理, 亞智科技股份有限公司
15:10-15:40

Technologies & Market Trends of Fan-Out Packaging

Mr. Favier Shoo, Technology and Market Analyst, Yole Développement
15:40-15:50

Lucky Draw

抽獎時間

 

 

專家開講 

2020年9月24日 (四)

南港展覽館1館1F (Booth #I3016)

時間 主題 公司名 發表語言
14:00 - 14:30 異質整合技術與發展 台灣人工智慧晶片聯盟 中文
14:30 - 15:00 遠傳5G 產業新契機 - 探索5G多元應用 遠傳電信股份有限公司 中文
15:00 - 15:30 LifeSense®時代興起:植基於AI-On-Chip及解決疫情困境 鈺創科技股份有限公司 英文

 

扇出型封裝聯誼小聚 (邀請制)

2020年9月25日 (五)

南港展覽館1館1F (Booth #I3016)

時間: 12:30-13:30 (12:20報到)

 

2020年資訊陸續更新中!

 

聯絡人

參展、行銷及贊助方案  Ula Huang 黃倩雯 | (03) 560-1777 EXT.108 | [email protected]

 

View Full Agenda
Special Features 攤位號#J3246, 人才培育特展/ 南港展覽館一館一樓 Friday, September 25
10:00am to 11:30am
Dr. Tri-Rung Yew 游萃蓉
榮譽教授
國立清華大學 材料與工程學系
Ms. Elisa Chiu 邱懷萱
執行長
錨定資本
Ms. Vicky Hsu 徐薇如
資深處長
台灣應用材料
Ms. Mavis Ho 何玫玲
策略長
比利時微電子研究中心
Ms. Sally Chiu 邱瑞碧
廠長
默克先進科技材料
Ms. Jessie Liu 劉素齡
處長
台灣美光
K3076, 1F, TaiNEX 1  Friday, September 25
10:20am to 12:00pm

Date:Friday, September 25th , 2020
Time:10:20 – 12:00
Venue:台北南港展覽館一館一樓K3076/ K3076,1F,TaiNEX 1 
Theme: Empowering Women for the Future 

10:20-10:30 Welcome Remarks:

國立清華大學 材料與工程學系 游翠蓉 榮譽教授/ Dr. Tri-Rung Yew, Distinguished Professor, Department of Materials Science and Engineering, National Tsing Hua University 

10:30-11:30 Panel Discussion:

Moderator:

錨定資本 邱懷萱 執行長/ Ms. Elisa Chiu , Founder & CEO, Anchor Taiwan

Panelists: 

台灣應用材料 徐薇如 資深處長/ Ms. Vicky Hsu, Senior Director, Applied Materials Taiwan

比利時微電子中心 何玫玲 策略長/ Ms. Mavis Ho, Head of Strategic Partnerships, Greater China & SEA, imec

默克先進科技材料 新竹廠 邱瑞碧 廠長/ Ms. Sally Chiu, Site Director, HsinChu site, Merck Performance Materials Ltd.

台灣美光 北亞區策略人資夥伴 劉素齡 處長/ Ms. Jessie Liu, Director, North Asia, Human Resources Business Partner, Micron

11:30-12:00 Q&A​

 

Outline:

本次研討會以「Empowering Women for the Future  」為主題。邀請重量級講師,談論女力發展趨勢、兩性平等職場環境與女性科技人才培育的重要性,希望藉由不同世代的經驗交流與傳承,一起啟發並幫助懷著科技夢的女性不斷前進,成就更多不凡女性。

Our industry’s future success is dependent on innovation, diversity and inclusion of the best ideas in the world. Panelists from various categories comprising suppliers and customers will discuss key challenges they encountered, success stories, and ideas for how each company can increase ownership diversity across the semiconductor industry. Join us to understand more about “Empowering Women in the Future” at Women-in-Tech Forum!

*本場論壇為免費論壇

*本場論壇全程使用中文進行

 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。

主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

View Full Agenda
Special Features 401 會議室/ 南港展覽館一館四樓 Thursday, September 24
8:30am to 4:50pm
Strategic Materials Conference Taiwan 401會議室/ 南港展覽館一館四樓 Thursday, September 24
8:20am to 4:40pm

2020內容持續更新中!

Date:Thursday, September 24th, 2020
Time:08:20 - 16:40 (08:20-08:40 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室

Theme: Materials Leading the Smart Future of Semiconductor - from Localization to Globalization

Chair:

  • Mr. Min-Te Chen 陳明德, 處長, 台灣積體電路製造股份有限公司/ 主席, SEMI Taiwan材料委員會

Vice Chairs:

  • Dr. Joe Wu 吳宗禧, 副處長, 台灣積體電路製造股份有限公司/ 副主席, SEMI Taiwan材料委員會
  • Dr. Jeffrey Yang 楊秉豐, 資深部經理, 日月光半導體製造股份有限公司/ 副主席, SEMI Taiwan材料委員會
  • Mr. Brian Chen 陳致遠, 副總經理, 華立企業股份有限公司/ 副主席, SEMI Taiwan材料委員會

Moderator: 

 

 
早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)
學生價 (不含EMBA)
(7/13-9/25)
NTD 2,500 NTD 3,125 NTD 2,500 5人以上再享9折 NTD 800

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

   

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 

  

  

 

 

       

 

 

View Full Agenda
Monday, September 17 8:30am

聚焦「異質整合先進封裝及智慧製造在5G及AI時代的技術突破及應用機會」、「先進封裝技術實現高密度高效能運算」、「系統級封裝異質與同質整合技術趨勢」等主題帶您了解下世代先進封裝技術

 

View Full Agenda
Mr. Isaac Liang 梁家榮
協理
藝珂人事顧問(股)公司躍科分公司
Mr. Gary Cheng 鄭輝鏞
資深經理
藝珂人事顧問(股)公司躍科分公司
Ms. Gloria Lin 林汶
處長
矽格股份有限公司
Ms. Noelle Ni 倪嫈琪
特別助理
蔚華科技
K3076, 1F, TaiNEX 1  Thursday, September 24
10:30am to 12:00pm

Date:Thursday, September 24th , 2020
Time:10:30 – 12:00
Venue:台北南港展覽館一館一樓K3076/ K3076,1F,TaiNEX 1 

10:10-10:30 Registration

10:30-11:00 趨勢分享:四代同堂的職場進行式/ Communication Between Generations in the Workplace

  • 藝珂人事顧問(股)公司躍科分公司 梁家榮 協理/ Mr. Isaac Liang, Director, Spring Professional Taiwan

11:00-12:00 Panel Discussions:引領未來-進入新世代的職場溝通/ Leading the Future- to maximize the communication between generations in semiconductor industry

Moderator:

  • 藝珂人事顧問(股)公司躍科分公司 鄭輝鏞 資深經理/ Mr. Gary Cheng, Senior Manager, Spring Professional Taiwan

Panelists:

  • 矽格股份有限公司 林汶 處長/ Ms. Gloria LIn, Director, Sigurd Microelectronic Corporation

  • 蔚華科技 倪嫈琪 特別助理/ Ms. Noelle Ni, Executive Assistant, Spirox Corporation 

*本場論壇為免費論壇 

*本場論壇全程使用中文進行

 

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。

主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

View Full Agenda
Special Features 福軒廳 / 南港展覽館一館三樓 Wednesday, September 23
12:00pm to 1:20pm
Wednesday, September 23 10:00am

由經濟部工業局新興資安產業生態系推動計畫,建構台灣資安產業的單一整合服務站SECPASS,協助資安廠商將資安產品以服務形式提供需求方進行評估與試用,以達到媒合雙方,建立長期合作導入應用之關係。今年於國際級半導體指標展會SECMICON TAIWAN,以SECPAAS主題館向國內外半導體產業供應鏈夥伴展示台灣優質資安產品與整合服務能量,並特別針對可應用於智慧製造之資安解決方案,搭配大會及主題館行銷資源,透過資安小聚、半導體資安標準推動座談等,可望策略帶動資安整合服務平台及台灣資安企業能見度。

 

2020年參展廠商


K3168    鎧睿全球科技股份有限公司
   互聯安睿資通股份有限公司
   戴夫寇爾
   捷而思股份有限公司
   精誠資訊股份有限公司
   精品科技股份有限公司
   竣盟科技股份有限公司
   全景軟體股份有限公司

 

 


贊助單位

 

View Full Agenda
Special Features 504bc 會議室/ 南港展覽館一館五樓 Thursday, September 24
8:50am to 4:50pm
504bc 會議室/ 南港展覽館一館五樓 Thursday, September 24
9:20am to 4:50pm

                    

Date:Thursday, September 24th, 2020
Time:09:20 – 16:50 (09:20-09:40 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 / 南港展覽館一館5樓 504bc會議室

  • Flexible Hybrid Electronics (FHE) are high-performance, integrated devices with curved, stretchable, bendable and variable in form factor. According to IDTechEx, it will grow from $31.7 billion to $77.3 billion in 2029 and will revolutionize the industry of electronics and gadgets by providing entirely modern and futuristic flexible, smart-looking, and transparent devices and products with enhanced performance.
     
  • Recent development on the semiconductors, displays and sensors with an extremely thin form factor and their integration on and in flexible substrate using new materials and cost-effective processing techniques, have enabled numerous futuristic applications such as smart system for sport, wellness and mHealth, wearable systems, transportation, smart cities, and IoT to achieve a smarter world.
     
  • FLEX Taiwan brings a wealth of speakers worldwide and with informative sharing on the newest technology and application.
     
  • With more possible applications that FHE can apply, it shaped our future and brings the revolution in many ways. Come to FLEX Taiwan 2020 to image the FLEXBILE future.

 

早鳥
(07/13-09/04)
原價    
(09/05-09/25)
團體早鳥(5人以上) 
(07/13-09/04)
團體原價(5人以上)
(09/05-09/25)
學生(不含EMBA)
(07/13-09/25)
會員 非會員 會員 非會員 會員 非會員 會員 非會員 -
NTD4,000 NTD5,000 NTD5,500 NTD6,875 NTD3,600 NTD4,500 NTD4,500 NTD5,625 NTD1,200

*Tax Included

 

主辦單位 : 
 

 

                  

 
協辦單位 : 
 
   

    

 

贊助廠商 :

 

                                            

                                                              

                

    

參展廠商 : 

   

                                                                      
                
               

 

 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
View Full Agenda
Mr. Jong-Chin Shen 沈榮津
部長
行政院經濟部
Wednesday, September 18
1:50pm to 2:00pm
500 會議室/ 南港展覽館一館五樓 Thursday, September 24
1:30pm to 5:30pm

 

創新是企業維持領先競爭力的不二法門。半導體產業的研發支出向來居高不下,近年來更有愈來愈多半導體業者透過新創投資獲取外部創新能量。

2011年到2019年底,全球新創投資金額累計超過一兆美元,其中一半以上都是來自企業,而且企業投資比重 呈現逐年攀升趨勢。數位化引爆的各種破壞式創新是驅動近十年這波投資潮的關鍵力量,迫使企業在內部 R&D外積極向外尋求創新動能。

SEMI希望協助建構台灣半導體產業的外部創新平台,此次特別攜手台杉投資和台灣科技新創基地(TTA),透過此次 【高科技企業成長創新論壇】,一方面探討企業如何透過新創投資/合作獲取外部動能,進一步擴大競爭優勢,另一方面也提供新創Pitch舞台,協助新創事業鏈結半導體產業,促進投資及合作機會,使其站在巨人肩膀上前進世界。

 

ㄧ活動資訊ㄧ

Date:Thursday, September 24th, 2020
Time:13:30 – 17:30 (13:30-13:50 Registration)
Venue:南港展覽館一館5樓 500會議室

 

ㄧ活動聯繫ㄧ

活動為邀請制,相關問題請洽 林小姐 [email protected]

 

  * Forum agenda is subject to change    

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 

 

 

 

 

 

 

View Full Agenda
500會議室/ 南港展覽館一館五樓 Thursday, September 24
9:30am to 12:30pm

 

創新是企業維持領先競爭力的不二法門。半導體產業的研發支出向來居高不下,近年來更有愈來愈多半導體業者透過新創投資獲取外部創新能量。

2011年到2019年底,全球新創投資金額累計超過一兆美元,其中一半以上都是來自企業,而且企業投資比重 呈現逐年攀升趨勢。數位化引爆的各種破壞式創新是驅動近十年這波投資潮的關鍵力量,迫使企業在內部 R&D外積極向外尋求創新動能。

SEMI希望協助建構台灣半導體產業的外部創新平台,此次特別攜手台杉投資和台灣科技新創基地(TTA),透過此次 【高科技企業成長創新論壇】,一方面探討企業如何透過新創投資/合作獲取外部動能,進一步擴大競爭優勢,另一方面也提供新創Pitch舞台,協助新創事業鏈結半導體產業,促進投資及合作機會,使其站在巨人肩膀上前進世界。

 

ㄧ活動資訊ㄧ

Date:Thursday, September 24th, 2020
Time:09:30 – 12:30 (09:30-09:50 Registration)
Venue:南港展覽館一館5樓 500會議室

 

ㄧ活動聯繫ㄧ

活動為邀請制,相關問題請洽 林小姐 [email protected]

 

  * Forum agenda is subject to change    

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
 
 
 
 
 
 
 
View Full Agenda
High-Tech Facility 402abc 會議室/ 南港展覽館一館四樓 Thursday, September 24
8:30am to 5:30pm

2020內容持續更新中!

Date:Thursday, September 24th, 2020
Time:08:30 - 17:30 (08:30-09:00 for registration)
Venue:Room 402abc, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 402abc會議室
Theme: Intelligent Solutions Shaping Future Facilities in 5G Era​ / 5G世代廠房設施之智慧解決方案 
Outline: 

​有鑑於今年全球產業經濟受到COVID-19影響,我們將需要更有智慧更有效率的解決方案,幫助高科技廠房廠務和醫護設施之運轉,進行更有效益的溝通整合、執行與應變。
5G擁有傳輸速度(Speed)、低延遲(Low Latency)、大頻寬(Increased Bandwidth)優點,如此,將感測器蒐集的巨量資訊(big data),透過無線網路(internet)超速傳遞,並促使物物無隙連結(IoT)與畫面更細緻完美地相互呈現。雖,5G仍有待設施裝備之建設部署完整,其實用成效才能立竿見影,但為未雨綢繆,許多人一定對「5G能增益多少廠房設施的智慧」感到好奇。
2020年高科技設施國際論壇,將探討5G世代智慧廠房和研發設施的相關應用與發想,內容涵蓋: 感測器、大數據、雲端計算、物聯網(IoT)、擴增實境、虛擬實境、人工智慧、機械人、預知保養、節能減碳、環境生態保護、先進醫護設施等等議題,引領次世代廠房設施之發展趨勢及智慧解決方案。​
論壇將提供即時的中英文口譯服務。另特別安排座談會,邀請行業領導者與前瞻研究員和供應廠家代表,同臺相謀分享5G世代智慧廠房設施的應用及其他潛在的發展。藉此安排,使業主、廠家和學者得以直接誠摯地公開溝通,來相互激盪、共同協力解決新興的問題。歡迎各界人士前來參加。

 

【NEW!】2019 論壇 Highlight 請至 http://www.htftaiwan.org/
 
 

早鳥價
(7/13-8/31)

原價
(9/1-9/24)

學生價
(7/13-9/24)
NTD 4,200 NTD 4,600 NTD 800

*Tax Included

 
高科技廠房設施貴賓晚宴
Time : 18:00 - 21:00 
Venue:Ballroom, 3F, TaiNEX 1 / 台北南港展覽館一館 3樓 燴館宴會廳

 

早鳥價
(7/13-8/31)
原價
(9/1-9/24)
NTD 3,200 NTD 4,200

*Tax Included  

溫馨提醒您,晚宴活動以業主、講師、受邀貴賓或主辦單位工作人員為主,同時非常歡迎協力廠家共襄盛舉。
但因場地受限,若報名人數超過場地容量,屆時主辦單位可能會請協力廠家進行參與人數的調整,謝謝配合。

 
 
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

 

View Full Agenda
Special Features 402abc 會議室/ 南港展覽館一館四樓 Thursday, September 24
8:30am to 5:30pm
Special Features 宴會廳 A Room / 南港展覽館一館三樓 Thursday, September 24
12:30pm to 1:30pm
Special Features 攤位號#J3258, 高科技智慧製造未來展區/ 南港展覽館一館一樓 Thursday, September 24
10:30am to 2:30pm
Special Features 攤位號#J3258, 高科技智慧製造未來展區/ 南港展覽館一館一樓 Wednesday, September 23
10:30am to 4:30pm
Special Features 攤位號#J3258, 高科技智慧製造未來展區/ 南港展覽館一館一樓 Friday, September 25
10:30am to 2:30pm
Special Features 401 會議室/ 南港展覽館一館四樓 Wednesday, September 23
1:30pm to 4:50pm
SMART Manufacturing 401 會議室/ 南港展覽館一館四樓 Wednesday, September 23
8:50am to 11:30am

(僅將取得講師授權的錄影檔上傳至SEMICON Taiwan 2020 Hybrid Platform)

Date:Wednesday, September 23rd, 2020
Time:08:50 - 11:30 (08:50-09:20 for registration)
Venue:Room 401, 4F, TaiNEX 1 / 台北南港展覽館一館 4樓 401會議室

Theme: How Companies Win with Smart Manufacturing

Forum Chair:

  • Mr. James Lin 林京沛, 副處長, 聯華電子股份有限公司/ 共同主席, SEMI Taiwan智慧製造委員會
  • Dr. Scott Yu 游志源, 部經理, 台積電/ 共同主席, SEMI Taiwan智慧製造委員會
  • Dr. Cheney Chiu 邱煜程, 副處長, 日月光集團/ 共同主席, SEMI Taiwan智慧製造委員會

Moderators:

  • Mr. James Lin 林京沛, 副處長, 聯華電子股份有限公司/ 共同主席, SEMI Taiwan智慧製造委員會

Outline: 

Smart Manufacturing has been the buzz word and industrial movement around the manufacturers. AI and 5G as the new powers, enabling smart manufacturing and possible applications to benefit companies' daily operations, from production flexibility to operation efficiency, from energy-saving to cost reduction.

With the full automation and data-driven manufacturing fabs, IC and high-tech industry manufacturers got more chance to leverage the benefits from smart manufacturing, to makes continuous progress in technology innovation which benefits the world and human life, accompanied with the opportunity, they also face multiple critical issues from the road to digital transformation, like cybersecurity threats, data storage strategy and protection and cross-functional roles’ communication gaps.

How Companies win with Smart Manufacturing would be the key topic of this year’s main theme of SMART manufacturing forum, during this forum, speakers will share about practical experiences on how companies develop smart to intelligent manufacturing under the conditions of estimable ROI and effective benefits, we will invite manufacturer to share the insights and expectations of current smart manufacturing and cybersecurity on how ecosystem can assemble together and solution providers from IoT, Edge, Cloud, AI and Cybersecurity segments to bring out valuable best practices to inspire the audiences.

 
 
 
早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)
學生價 (不含EMBA)
(7/13-9/25)
NTD 2,000 NTD 2,500 NTD 2,000 5人以上再享9折 NTD 800

*Tax Included

 
 
Sponsored by:
   

 

 

 
 
* Forum agenda is subject to change
 
 
如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。
 
 
     
       
       

 

View Full Agenda
Ms. Ying-Ying Lai / 賴瑩瑩
Director General, Department of Waste Management/處長
EPA, Executive Yuan/行政院環境保護署
Ms. Gina Shaw 蕭淑云
Director/處長
Micron Memory Taiwan Co. Ltd./台灣美光記憶體股份有限公司
Mr. James Lee 李嘉峰
Deputy Manager/副經理
Taiwan Kanken Techno Co. Ltd./台灣康肯環保設備股份有限公司
Mr. Wei Wang Chen/陳偉望
General Manager/總經理
Everlight Chemical Industrial Co. Ltd./台灣永光化學工業股份有限公司
Mr. Apaul Chang 張家帆
Deputy Director/副處長
Macronix International Co. Ltd./旺宏電子
Sustainable Manufacturing and Circular Economy Forum 500 會議室/ 南港展覽館一館五樓 Wednesday, September 23
12:40pm to 5:00pm

Date    :Wednseday, September 23rd , 2020
Time     : 12:40 – 17:00 (12:40-13:05 for registration)
Venue :台北南港展覽館一館 5樓 500會議室 

Theme : 技術創新與永續發展

Forum Chairs : Dr. 于樹偉 / 董事長 / 財團法人安全衛生技術中心, SEMI Taiwan Sustainable Manufacturing Committee

Outline : 

隨著對能源的需求與日俱增,節能減廢與循環經濟成為高科技產業近年永續營運重要指標。

SEMI(國際半導體產業協會)長期服務半導體產業,推動全球電子業供應鏈發展,為創新前瞻科技趨勢,而隨著全球高科技產業逐步升級智慧製造,加上國際對環境、產業永續以及企業社會責任的呼籲,強調零廢棄、永續發展的循環經濟商業模式承為產業共同努力的方向與目標。去年更號召15公協會組成「15T台灣永續供應鏈循環經濟聯盟」,大力推動綠色製造的在地耕耘,共同宣示以創新與踏實的策略,攜手合作成就永續共榮平台,期望台灣產業的團結能夠開創科技永續新格局。

SEMICON Taiwan 2020年國際半導體展,以綠色製造為主題,藉由循環經濟及今年首度設立的綠電展覽主題館,與高科技產業永續發展暨循環經濟論壇,期望串聯產業市場供需雙方,帶領業者實踐半導體產業的循環經濟,使台灣成為亞洲循環經濟的關鍵,並協助半導體業者早日達成「零廢棄、100%循環利用」的綠色製造終極願景

  • 半導體設備能資源有效運用
  • 製程廢棄物回收與再利用 
  • 微污染控制技術
  • 永續生產營運模式
  • 永續發展與循環經濟案例分析 

Language: 中文/Chineses

 

早鳥價
(7/13-9/4)
原價
(9/5-9/25)
SEMI 會員價
(7/13-9/25)
團報價
(7/13-9/25)
學生價 (不含EMBA)
(7/13-9/25)
NTD2,000 NTD2,500 NTD2,000 5人以上再享9折 NTD800

*Tax Included

 

 

Sponsored by:

   
     

 

 

 * Forum agenda is subject to change    

如因天災、事變或其他不可抗力因素(如:颱風、地震),主辦單位得調整活動內容,甚至延期或取消活動。
主辦單位將根據行政院人事行政總處或臺北市政府發布之停班通知,另行於官方網站公告相關事宜。

   

 
View Full Agenda
Special Features 500 會議室/ 南港展覽館一館五樓 Wednesday, September 23
12:40pm to 5:00pm

聯絡人
SEMI Taiwan
李小姐 Lily Lee
TEL: 886.3.560.1777 EXT. 509
Email: [email protected]

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