Heterogeneous Integration Global Summit 2026 – Day 3
Friday, September 4 | 8:30 am - 3:30 pm
Theme
AI Packaging Supply Chain Ecosystem & Driving Technology
View outline
Overview
AI Packaging Supply Chain Ecosystem & Driving Technology has been widely used as one of the effective enablers for “More-than-Moore” technology since the advanced wafer node scaling down relying on front-end technology is getting hard to achieve the goal of business return.
Therefore, to help the audience understand Supply Chain Ecosystem, the speakers will provide a wide range of differentiated Driving Technology, in key technology trends, process flow and its process challenges, including the following ecosystem technology enabling solutions.
Grand Ballroom, 3F, Grand Luxe Banquet
Advised bySEMI Packaging & Testing Committee
Organizer
Sponsored by
Registration Fees (Tax Included)
Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17
SEMI Member
NT$ 5,145
Non-member
NT$ 6,689
Early-Bird
6/18 - 8/5
SEMI Member
NT$ 5,880
Non-member
NT$ 7,644
Regular
8/6 - 8/30
SEMI Member
NT$ 7,350
Non-member
NT$ 9,555
On-Site
8/31 - 9/4
SEMI Member
NT$ 9,555
Non-member
NT$ 12,422
Student
EMBA Excluded
Valid Student ID Required
NT$ 882
Day Pass
(Tax Included)
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.
