Skip to main content

Memory Executive Summit

Tuesday, September 1 | 1:00 pm - 5:00 pm
The Co-Design Era: Memory as the Strategic Heart of AI Intelligence​

The memory industry is entering a decisive new phase. What was once viewed as a standardized component is now
becoming a strategic asset at the heart of the AI era. As AI adoption accelerates—particularly at scale for inference—
memory is no longer defined by capacity alone, but by how early and how deeply it is integrated into system design.​

This shift is being driven by both market forces and structural realities. Global semiconductor revenues are expected to
approach US$975 billion by 2026, with memory emerging as one of the fastest-growing segments, projected to exceed
US$440 billion. At the same time, supply constraints and rising system complexity are pushing the industry beyond
traditional supplier–customer relationships toward closer, long-term co-design partnerships across the ecosystem.​

Rather than solving isolated performance bottlenecks, the next phase of innovation is redefining where value is created.
Memory is increasingly shaping system architectures, influencing platform strategies, and determining differentiation across
data center, enterprise, and edge deployments.​

SEMICON Taiwan 2026 Memory Executive Summit is designed for leaders navigating this transition. The summit will bring
together executives across the memory, logic, and manufacturing landscape to align perspectives, anticipate strategic
inflection points, and explore how memory can become a lever for growth and competitive advantage in an increasingly
intelligent and autonomous world.

Venue: Platinum Ballroom A, 3F, Grand Hilai Taipei
Organizer
Logo
 
Registration Fees (Tax Included)

Register Now

Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17

SEMI Member

NT$ 2,132

Non-member

NT$ 2,793
Early-Bird
6/18 - 8/5

SEMI Member

NT$ 2,436

Non-member

NT$ 3,192
Regular
8/6 - 8/30

SEMI Member

NT$ 3,045

Non-member

NT$ 3,990
On-Site
8/31 - 9/4

SEMI Member

NT$ 3,959

Non-member

NT$ 5,187
Student
EMBA Excluded
Valid Student ID Required
NT$ 882
Day Pass
(Tax Included)
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.

Featured Speakers

Nikhil Cherian

Mr. Nikhil Cherian

Senior Director, Supply Chain Infrastructure, Alphabet Inc.

Speaker

Jangseok Choi

Mr. Jangseok Choi

Corporate Vice President, Memory Product Planning of Samsung Electronics

Speaker

Dr. Hoshik Kim

Dr. Hoshik Kim

Senior Vice President, SK hynix Inc.

Speaker

Dr. Chris Nicol

Dr. Chris Nicol

Vice President, d-Matrix

Speaker

Dr. Wei Lin

Dr. Wei Lin

Chief Technology Officer, Phison Electronics Corporation

Speaker

Dr. Mark Kiehlbauch

Dr. Mark Kiehlbauch

Corporate Vice President, Micron Technology

Speaker

Mr. Rajeev Nagabhirava

Mr. Rajeev Nagabhirava

Vice President, Systems Design Engineering, Sandisk

Speaker

Dr. (Oliver) Hang-Ting Lue

Dr. (Oliver) Hang-Ting Lue

Director, Macronix International Co., Ltd.

Speaker

Prof. Chih-Huang Lai

Prof. Chih-Huang Lai

Associate Dean, National Tsing Hua University

Speaker

Mr. Skip Wong

Mr. Skip Wong

Head of Global Sourcing and Procurement, Solidigm

Speaker

Agenda

Registration

1:00 pm - 1:20 pm

Opening Remarks

1:20 pm - 1:25 pm

Squeezing the Silicon - How Google’s Dual Hardware-Software Playbook is Breaking the AI Memory Wall

Mr. Nikhil Cherian

Alphabet Inc.
1:25 pm - 1:45 pm

Powering the AI Era with 3D Integration

Mr. Jangseok Choi

Memory Product Planning of Samsung Electronics
1:45 pm - 2:05 pm

How AI Is Redefining the Role of Memory: From Component Cost to Strategic AI Infrastructure

Dr. Hoshik Kim

SK hynix Inc.
2:05 pm - 2:25 pm

From Memory Supplier to Architecture Partner: Co-Design Opportunities in AI Inference

Dr. Chris Nicol

d-Matrix
2:25 pm - 2:45 pm

The New Brain of AI: Why Memory Architecture Is the Next Competitive Frontier

Dr. Wei Lin

Phison Electronics Corporation
2:45 pm - 3:05 pm

Break Time

3:05 pm - 3:20 pm

From Silicon to System: Memory Innovation for the AI Era

Dr. Mark Kiehlbauch

Micron Technology
3:20 pm - 3:40 pm

Flash innovations in the AI era: From Storage to an Active Memory Tier

Mr. Rajeev Nagabhirava

Sandisk
3:40 pm - 4:00 pm

Prospect of Flash Memory Devices in the AI Era

Dr. (Oliver) Hang-Ting Lue

Macronix International Co., Ltd.
4:00 pm - 4:20 pm

Beyond Memory: MRAM as the Computing Engine for AI in the Co-Design Era

Prof. Chih-Huang Lai

National Tsing Hua University
4:20 pm - 4:40 pm

Leading Supply Chain Beyond NAND into the AI Era

Mr. Skip Wong

Solidigm
4:40 pm - 5:00 pm

Adjournment​​

5:00 pm