Silicon Photonics Global Summit
Monday, August 31 | 8:30 am - 5:05 pm
Theme
From Die-to-Die to Rack-to-Rack: Engineering the Photonic Fabric for Hyperscale AI Clusters
View outline
Overview
As AI and high-performance computing workloads continue to surge, interconnect bandwidth and power efficiency have become the defining constraints of next-generation data center architecture. Silicon photonics is rapidly emerging as the critical enabler to overcome these limitations.
This summit brings together global industry leaders across the ecosystem—from system architecture, interconnect technologies, to advanced manufacturing—to explore how silicon photonics can scale from innovation to high-volume deployment.
With a focus on architecture evolution, integration innovation, and manufacturing readiness, the program aims to provide a comprehensive view of how the industry is converging to support AI infrastructure at scale.
Advised bySEMI Silicon Photonics Industry Alliance
Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17
Valid Student ID Required
NT$ 882
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.
Featured Speakers
Deputy Program Director, TSMC
Chief Technology Officer, Lumentum
Senior Vice President & Chief Technology Officer, Marvell Technology, Inc.
Founder, CEO, Lightmatter
Vice President IC-Link | imec silicon solutions, imec
Head of Photonics & Sensing Segment Marketing, Soitec
VP Specialty Technologies, Lam Research
Sr. Director, Product Marketing, Onto Innovation
President, ficonTEC Service GmbH
Global Photonics CoE Manager, Advantest Europe GmbH
CTO, ENLI TECHNOLOGY CO., LTD.
Agenda
Opening Remarks
Dr. Herbert Chen
Browave Corporation
How COUPE Redefines AI Interconnects
Optical interconnect technology for AI / ML networks
Mr. Matthew Sysak
Lumentum
Enabling Data Center Hyper Connectivity in the AI Era
Dr. Radha Nagarajan
Marvell Technology, Inc.
Breaking through the data rate barrier
Foundational Photonic Building Blocks Empowering Next Generation AI Infrastructure
Dr. Nicholas Harris
Lightmatter
Opening Remarks
Dr. Robert Blum
Lightwave Logic, Inc.
Advanced Packaging for Elevating AI System Performance
The Photonic Fabric, a heterogeneous integration challenge
Advancing TFLN and InP Silicon Photonics Hybridization to Enable Next-Generation High-Speed Modulators
Mr. Yannick Larvor
Soitec
Enabling Silicon Photonics with Advanced Fabrication Solutions
Dr. David Haynes
Lam Research
The Critical Role of Inspection and Metrology in Silicon Photonics Manufacturing
Mr. Timothy Kryman
Onto Innovation
From Wafer to Optical Interconnect: Enabling Scalable Silicon Photonics Manufacturing Through Test, Assembly and Fiber Preparation Technologies
Mr. Andre Lalonde
ficonTEC Service GmbH
Scaling Silicon Photonics and Co-Packaged Optics Test for High-Volume Manufacturing
Mr. Aether Lee
Advantest Europe GmbH
Spectral Imaging–Based Optical Loss Mapping for Efficient Failure Analysis and Wafer-Level Screening of Silicon Photonic Integrated Circuits
Dr. Joseph Liao
ENLI TECHNOLOGY CO., LTD.
