Mr. Teck Lee
Technical Director, ASE Inc.
Teck Lee is the Technical Director of Advanced Fanout solutions in the Corp. R&D organization at ASE. He joins ASE in 2000 as a Bumping process engineer, later he worked on the Glass based Wafer Level IPD development. Since 2018, he has been leading the Advanced Fanout on RDL and Silicon Bridge based interposer development, most recently he has extended his work from Wafer to Panel Level Fanout solutions for HPC and AI applications.