Dr. Rick Tsai
Vice Chairman and CEO, MediaTek
Dr. Lih Shyng Tsai (Rick) currently serves as Vice Chairman & CEO of MediaTek Incorporated, a global fabless semiconductor company that enables 2 billion connected devices a year; an industry leader in innovative systems-on-chip (SoC) platforms for mobile, home, connectivity, client computing, IoT, automotive and data center. He was the 2023 winner of the Dr. Morris Chang Exemplary Leadership Award honored by Global Semiconductor Alliance (GSA).
Since joining the company in 2017, Dr. Tsai has led MediaTek to record growth and established it as a global leader in many markets. Under his leadership, MediaTek has invested in advanced technologies, expanded its product portfolio, and grown its presence in Asia, North America, Europe, and Japan.
Prior to his current role at MediaTek, from 2014 to 2016, Dr. Tsai served as Chairman and CEO of Chunghwa Telecom Co., Ltd., Taiwan’s largest integrated telecom service provider. Under his leadership, Taiwan’s 4G service growth was recorded as the fastest growth among worldwide markets. During his tenure, Dr. Tsai was elected by Finance Asia as one of Taiwan’s three best CEOs in 2016.
Dr. Tsai joined TSMC in 1989 as an engineering manager and advanced through several key executive roles such as Fab Director, EVP of Operations, EVP of Worldwide Sales and Marketing, President and COO, and became President and CEO of TSMC in 2005. He also served as President of Vanguard International Semiconductor, a TSMC affiliate, from 1998 to 2000, and was appointed President of New Businesses at TSMC from 2009 to 2011, whereafter Dr. Tsai concurrently served as Chairman and CEO of TSMC Solar Ltd. and TSMC Solid State Lighting Ltd. until 2014.
Prior to joining TSMC, Dr. Tsai was an IC engineering manager in Hewlett Packard between 1981 to 1989.
Dr. Tsai has served on the boards of several companies, including Taiwan Semiconductor Industry Association, Lam Research, NXP Semiconductors, USI Corporation, Chunghwa Telecom, TSMC and MediaTek.
Dr. Tsai received his B.S. in Physics from National Taiwan University and Ph.D. degree in Material Science and Engineering from Cornell University, U.S.A.