Advanced Packaging Solutions and Applications with FOPLP Technology

3:15 pm - 3:40 pm

As the need for a smarter future, powered by automotive, AI, robot and IoT, combined with the advancement of semiconductor wafer node is still strong. However, advanced wafer node with higher I/O density which means the I/O pitch and density of substrate can hardly keep up with that of IC's. In order to bridge the ever widening gap between IC and substrate, we have to turn to the advanced packaging for bridging the two.

The term "Fan-out Packaging" became a hot topic for the advanced packaging. While many of the players focus on the wafer form Fan-out, PTI developed panel form with 510x515mm which provides more flexibilities and manufacturing efficiency to meet customer's demand. The solution can cover a wide array of application ranging from small I/O device to complex multi chiplets integration, either heterogeneously or homogeneously. Although FOPLP (Fan-out Panel Level Package) technology has many challenges, PTI still rolled into mass production. Nowadays we are engaging with many new applications.

Key Technologies Covered

HPC/AI Applications of FOPLP
Chiplets in FOPLP
Panel level warpage control

Featured Speakers

Dr. Jim Lin

Senior Vice President, Powertech Technology Inc.

Dr. Jim Lin currently serves as the Senior Vice President of Advanced Package Technology Development & Operation at Powertech Technology Inc. (PTI) and is a member of the Board of Directors for both PTI and Greatek Electronics Inc. With over 20 years of expertise in IC packaging technology, Dr. Lin spearheads PTI’s R&D and operational strategies, focusing on pioneering next-generation solutions.

Throughout his distinguished career, Dr. Lin has been instrumental in developing advanced technologies, including 32-chip memory stacking, System-in-Package (SiP), Package-on-Package (PoP), and Heterogeneous Multi-Chip Modules (MCP). He has also led significant breakthroughs in 3D TSV interconnection for High Bandwidth Memory (HBM) and Fan-out Panel Level Packaging (FOPLP). Under his leadership, PTI has solidified its position at the forefront of FOPLP innovation, driving industry-wide progress.

Dr. Lin earned his M.S. and Ph.D. in Power Mechanical Engineering from National Tsing Hua University.