From Lab to Line: Accelerating AI Packaging Innovation Through Ecosystem Coordination

4:05 pm - 4:30 pm

AI hardware is evolving rapidly, demanding packaging solutions that integrate high-performance compute, memory, and interconnect with exceptional thermal and mechanical reliability. Chiplet architectures, HBM, and 3D integration push the limits of material capabilities—yet material development often trails the pace of system innovation.

This session explores how early coordination across the ecosystem—materials suppliers, OSATs/IDMs/AI Chip Designers, and equipment makers—can reduce development risk and accelerate readiness. When requirements are shared early and validation efforts are aligned, materials can be optimized in parallel with package design and process definition.

We’ll examine one real-world case study: the development of a solution tailored for wafer thinning and 3D stacking in AI packaging. The example highlights early sampling, collaborative validation, and iterative feedback—executed in close coordination with IDM and equipment partners—without compromising IP boundaries. The case underscores how tool-material integration and early engagement are critical to ensuring rapid innovation coupled with manufacturability at scale.

For next-generation AI systems, packaging is the integration frontier. Early ecosystem coordination isn’t just helpful—it’s essential. Join us in redefining how we bring materials from lab to line—faster, smarter, and together.

Key Technologies Covered

2.5D/3D heterogeneous integration challenges
Temporary bonding materials for wafer thinning a
Collaborative validation across materials, OSATs/IDMs, and equipment partners
Tool-material-process alignment for manufacturability
Ecosystem coordination models for accelerated development
Iterative feedback loops in material and package co-optimization

Featured Speakers

Ms. Poupak Khodabandeh

Chief Business Officer, Brewer Science Inc.

Ms. Khodabandeh brings over two decades of leadership experience in the semiconductor and advanced materials industries. Prior to joining Brewer Science, she held senior roles at Chemtrade, where she launched a new ultrapure chemicals business for semiconductor fabs, and at Henkel, where she led the global semiconductor packaging materials business and later spearheaded digital and pricing transformation initiatives across Henkel’s €10B adhesives division. Her work has consistently focused on aligning technical innovation with market needs, scaling growth, and executing complex change agendas in global organizations.

She began her career as an integrated circuit design engineer and holds degree Electrical Engineering from the University of Toronto and advanced business training at IESE Business School in Barcelona.

She has lived and worked across North America, Europe, and Asia and is fluent in English and Farsi.