Keynote: Breaking the 1/0 Wall: Co-Packaged Optics and the Next Frontier of Heterogeneous Integration
As compute 1/0 densities continue to scale and bandwidth demands soar, traditional electrical interconnects arebecoming a limiting factor in system performance, energy efficiency, and scalability. Co-Packaged Optics (CPO) based on high density silicon photonics and advanced semiconductor packaging represents a transformative shift in how the industry addresses these challenges-ushering in a new paradigm of heterogeneous integration where photonics and silicon coalesce at the package level to deliver unprecedented performance and reliability at scale.
This talk will explore how CPO is redefining the performance envelope of high-speed networking, datacenter interconnects, and Al infrastructure. The talk will cover breakthroughs in optical-electrical co-design, packaging technologies, and system architecture that enable ultra-low latency and energy-efficient bandwidth at scale. Drawing from Broadcom's leadership in this space, we'll examine the technical and ecosystem challenges that must be overcome to bring CPO to mass deployment-and highlight how heterogeneous integration of optics and ASICs will unlock the next generation of scalable, high-performance systems.
Key Technologies Covered
- Co-Packaged Optics
- Photonics Advanced Packaging
- Heterogenous integration of photonics and electronics
- Al networks