Development of new workflows to address metrology and Failure analysis challenges at macroscale, microscale and nanoscale

9:50 am - 10:30 am

Modern integrated circuits (ICs) increasingly rely on advanced scaling, 3D integration, chiplet architectures, and complex packaging approaches such as interposers and heterogeneous integration. These innovations present new challenges for metrology and failure analysis, where traditional spot-focused cross-sectioning and delayering techniques are becoming insufficient—particularly when applied in isolation.


To meet these evolving demands, the integration of stand-alone ultrashort pulse lasers with complementary techniques—such as X-ray micro-computed tomography (micro-CT) and Xenon plasma FIB systems—has become essential. Ultrashort pulse lasers offer high configurability for a wide range of materials, depths, and complex geometries. Unlike conventional tools constrained by mechanical setup, these lasers enable non-contact, high-precision material removal with minimal thermal impact.


When combined with non-destructive 3D imaging from X-ray micro-CT and high-throughput milling from Xenon plasma FIB, this integrated workflow provides a powerful and flexible solution. It accelerates root cause analysis, improves precision in region-of-interest targeting, and delivers greater ROI by addressing a broader array of advanced semiconductor device challenges—from initial defect localization to high-resolution cross-sectioning and analysis.

 

Key Technologies Covered

Technologies:

  • Ultrashort Pulse Lasers (stand-alone systems)
  • X-ray Micro-Computed Tomography (micro-CT)
  • Xenon Plasma Focused Ion Beam (plasma FIB) Systems

Methodologies:

  • Hybrid Sample Preparation Workflows
  • Multi-Modality Defect Localization and Cross-Sectioning
  • High-Throughput Milling for Deep Structures

Innovations:

  • Integration of Ultrashort Pulse Lasers with Micro-CT and Plasma FIB
  • Configurable Laser Processing for Varied Materials and Geometries

Application Areas:

  • Failure Analysis of Advanced ICs
  • Preparation for TEM, SEM, and FIB Analysis
  • Quality Assurance in High-Volume Semiconductor Manufacturing

Featured Speakers

Mr. Herve Mace

Mr. Herve Mace

Semiconductor Solution Sales Development Director, TESCAN GROUP, a.s.

Hervé Macé is a Director of Business Development at TESCAN GROUP, with over 20 years of international experience in the field of scientific instrumentation, particularly in electron microscopy and advanced analytical technologies. Prior to joining TESCAN, he held several senior commercial and strategic roles at Applied Materials, Thermo Fisher Scientific and FEI Company, including Director of Sales for EMEA, Senior Manager for Global Semiconductor Sales, and Global Accounts Manager. Throughout his career, he has been responsible for driving business development, managing global key accounts, and leading sales and service operations in high-tech domains such as semiconductors, materials science, and life sciences.