Unlocking the Future: HBM and Advanced Packaging in the AI Era

10:05 am - 10:35 am

In the AI era, memory is no longer a supporting player—it’s a central force shaping performance, efficiency, and innovation. This presentation explores why memory matters more than ever, with High Bandwidth Memory (HBM) emerging as a leading-edge solution powering AI workloads. We’ll dive into the complexity and challenges of heterogeneous integration and advanced packaging, which are essential to unlocking HBM’s full potential. Finally, we’ll look ahead to future trends and opportunities, including how packaging innovations will continue to redefine the boundaries of AI computing.

Featured Speakers

Mr. Alex Chang

Vice President of Advanced Packaging and Testing Operations, Micron Taiwan

Alex Chang is the Vice President of Advanced Packaging and Testing Operations at Micron Taiwan. He is responsible for leading Micron Taiwan’s back-end assembly and test operations, including advanced packaging and testing technologies, 3D packaging, and flip-chip technologies.

Since joining Micron in 2021, Alex has rebuilt and established a strong team, significantly reduced supply costs, and ensured product quality. Under his leadership, the team has achieved record-high yields in both high-volume manufacturing and the introduction of new products.

With over 20 years of industry experience, prior to joining Micron, he served as Vice President and General Manager of NXP Semiconductors’ Kaohsiung site. During his tenure, he set a record for the shortest delivery cycle, achieved peak production output, and improved customer satisfaction.

Alex holds both a Master’s and a Bachelor’s degree in Mechanical Engineering from National Sun Yat-sen University.