Mr. SEUNGTAEK YANG
Director, SK Hynix
Seungtaek Yang is a highly experienced semiconductor packaging expert with over two decades of industry experience. As of 2026, he is based at the company's Taiwan subsidiary, where he leads strategic collaborations and HBM-focused partnerships with major Taiwanese tech companies.
He joined Hynix in 2003, beginning his career as a Wafer-Level Packaging (WLP) Process Development Engineer. After building a strong foundation in advanced packaging processes, he transitioned to WLP Product Development in 2006. Since 2010, he has played a pivotal role in the development of cutting-edge HBM (High Bandwidth Memory) and 3DS products by pioneering work on Through-Silicon Via (TSV) technology. He earned a B.S. in Metallurgical Engineering from Ulsan University in 2001 and an M.S. in Materials Science and Engineering from Hanyang University in 2003.