Featured Talk & Panel Discussion

10:50 am - 12:15 pm

Mr. Aveek Sarkar, Head of Ecosystem and Alliance Management Division, TSMC

Topic: The Road to Trillion-Transistor Multi-Die Systems and Beyond

The proliferation of AI is placing unprecedented demands on silicon infrastructure as intelligence spreads beyond the data center to the edge. This presentation will explore the critical requirements for compute, memory, connectivity, and power, and how advanced-node silicon, multi-die advanced packaging, and associated technologies enable the performance and energy efficiency metrics needed for the next generation of AI. We conclude with a vision for how the collaboration across the stack—from the system companies and ODMs to the chip design companies, and TSMC along with its Open Innovation Platform® (OIP) partners, can address the requirements for co-design and multi-physics convergence, paving the road to trillion-transistor multi-die systems and beyond.

Key Technologies Covered

Advanced-Node Silicon
Multi-Die Advanced Packaging
DTCO / STCO

Featured Speakers

Mr. Roger Lee

S&A Country Manager, Taiwan, Synopsys

Roger Lee is the S&A Country Manager for Taiwan at Synopsys, leading the company’s business strategy and engagement with Taiwan’s semiconductor ecosystem. He works closely with customers and industry partners to accelerate innovation across the semiconductor value chain through AI-powered simulation, Multiphysics simulation, and digital engineering. His focus is on enabling silicon-to-system co-design for next-generation IC design, advanced packaging, AI infrastructure, and high-performance computing (HPC).

With more than 30 years of leadership experience in the technology industry, Roger has held executive roles spanning enterprise software, consulting services, computing platforms, semiconductor technologies, and manufacturing solutions across Greater China and Southeast Asia. Before joining Ansys in 2018, he served as Greater China General Manager at JDA Software, VP at Hewlett-Packard (HP) Taiwan, and Sales Director at Oracle Taiwan, where he built extensive expertise in business leadership, strategic planning, and market development. Mr. Lee holds a Bachelor’s degree in Industrial Engineering from Chung Yuan Christian University.

Mr. Aveek Sarkar

Head of Ecosystem and Alliance Management Division, TSMC

Aveek Sarkar is Head of Ecosystem and Alliance Management Division at TSMC. Along with his team, he is responsible for enabling TSMC’s Open Innovation Platform and its partner ecosystem covering EDA, IP, Cloud, design services and 3DFabric. Prior to TSMC, Aveek held leadership roles in Synopsys, Ansys, Apache Design Solutions and Sun Microsystems. He has a MBA (Santa Clara University), MSEE (Oregon State University) and B.Tech. (Indian Institute of Technology, Kanpur, India).

Dr. Da Yang

Senior Director of Product, Semiconductor and EDA, NVIDIA

Da Yang is Senior Director of Product at NVIDIA, where he leads the AI product development for Semiconductor and EDA applications. Before joining NVIDIA, Da was Vice President of Technology at Tokyo Electron America, leading new product development for fabless design customers. Prior to Tokyo Electron, Da had worked at Qualcomm and IBM covering various design optimization and process development roles.