Scaling Silicon Photonics and Co-Packaged Optics Test for High-Volume Manufacturing

4:15 pm - 4:40 pm

Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) are moving from early development into high-volume manufacturing (HVM), driving new requirements on test cell integration, calibration, scalability, as well as throughput and test cost in general. This paper examines the current state of the industry and outlines a roadmap for production-ready test solutions, focusing on system-level integration, optical instrumentation, and automation. It highlights key challenges observed during early deployments and presents a path toward standardized, scalable, and high-throughput test architectures suitable for volume production.

 

Key Technologies Covered

  • Silicon Photonics and Co-Packaged Optics development
  • SiPh/CPO High-Volume Manufacturing
  • Scalable Test Architectures

Featured Speakers

Mr. Aether Lee

Mr. Aether Lee

Global Photonics CoE Manager, Advantest Europe GmbH

Aether Lee is a seasoned technical consultant and global photonics leader with over 25 years of experience in semiconductor test, RF systems, and photonics engineering. Currently leading initiatives within the Photonic Center of Expertise, he drives advanced test program development and oversees critical engineering activities for next-generation platforms, including V93000-Triton deployments with major industry partners.

Aether has a strong track record of pioneering first-of-their-kind solutions, having successfully delivered multiple landmark customer rollouts across leading semiconductor companies. His expertise spans Photonics, RF, mixed-signal, and PMIC domains, complemented by deep experience in verification, system integration, and test methodology development.

Known for his leadership and collaborative approach, Aether excels at building high-performing teams, fostering cross-functional alignment, and partnering with global stakeholders to ensure successful product delivery. His career reflects a consistent ability to translate complex technical challenges into scalable, high-impact solutions.