Automated Inspection for Advanced Packaging — A New End‑to‑End Approach to Pass/Fail Judgment from R&D to Mass Production —
In recent years, advanced packaging using glass interposers, glass core substrates, and TGV has attracted increasing attention along with the progress of chiplet technology.
OMRON has addressed these new materials and structures from an early stage by working closely with research institutes and customers to tackle inspection challenges such as how to define quality and how to evaluate it.
Currently, OMRON is focusing on establishing automated pass/fail judgment methods that start from technical issues identified in the early R&D stage and seamlessly connect research and development with mass production.
In this presentation, based on joint research with Professor Jun Mizuno of the Academy of Innovative Semiconductor and Sustainable Manufacturing at National Cheng Kung University (NCKU), as well as insights gained from evaluation projects with multiple customers, we propose the role of automated inspection as a foundation for shaping industry standards in advanced packaging, including TGV.
Beyond inspection and evaluation in R&D and prototyping stages, OMRON continues to pursue both high throughput and high-quality manufacturing as advanced semiconductor technologies evolve.
Key Technologies Covered
- Automated 3D‑CT X‑ray inspection for advanced packaging
- TGV (Through Glass Via) inspection technologies
- Glass interposer and glass core substrate inspection and evaluation
- Automated pass/fail judgment methods from R&D to mass production
- High‑throughput inspection for advanced semiconductor manufacturing
