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From Silicon to System: Memory Innovation for the AI Era

3:20 pm - 3:40 pm

As AI rapidly reshapes industries, economies, and competitive advantage, memory has emerged as a defining factor in the next wave of computing. From edge devices to hyperscale data centers, the ability to move, store, and access data efficiently will determine how organizations scale AI performance while managing power, cost, and infrastructure complexity. This keynote will explore why memory-centric innovation is becoming a strategic imperative for the semiconductor ecosystem and how advances in packaging, process technology, and system architecture for DRAM, NAND, and HBM are enabling new levels of AI capability. The discussion will connect technology breakthroughs to business impact, highlighting how collaboration across the value chain can unlock more efficient, scalable, and sustainable intelligent systems from silicon to system.

Featured Speakers

Dr. Mark Kiehlbauch

Dr. Mark Kiehlbauch

Corporate Vice President, Micron Technology

Mark Kiehlbauch is the corporate vice president of the NAND Process Engineering and Equipment in the Technology and Products Group at Micron Technology. He is an expert in process development, equipment development, metrology, dry etch and advanced patterning/lithography technologies for DRAM, NAND and emerging memory technologies. has more than 25 years of experience in process engineering and equipment development for leading-edge memory technology.

 

Mark Kiehlbauch joined Micron in 2005 as a senior manager and has served in a variety of technical and managerial positions throughout his career, including leading DRAM and NAND process engineering. He was appointed to his current role as corporate vice president, leading the NAND Process Engineering & Equipment organization in 2024.

 

Dr. Kiehlbauch earned a Bachelor of Science in chemical engineering from the University of Houston and a Ph.D. in chemical engineering from the University of California, Berkeley. He also holds 111 U.S. patents and 82 worldwide patents and has authored dozens of technical publications.