Keynote: Beyond the Reticle: Orchestrating the AI Hardware Ramp

2:35 pm - 2:55 pm
  1. AI is the defining compute inflection of our lifetimes. 
  2. Monolithic scaling alone is no longer sufficient. Advanced nodes still matter, but xPU performance, bandwidth, and power efficiency now come from 3DIC and advanced packaging.
  3. 3DIC complexity is compounding risk. The economics are brutal. Stitching together multiple high-value dies means one packaging defect or yield dip destroys massive capital. 
  4. Deliver best AI hardware time-to-market and manufacturing-at-scale require entire ecosystem partners to innovate and deep collaborative supply chain.

 

Key Technologies Covered

  • Supply chain collaboration

Featured Speakers

Mr. TY Lau

Mr. TY Lau

General Manager, MediaTek, Inc.

TY Lau is the General Manager of Global Supply Chain Management FU at MediaTek.

He is responsible for corporate business planning, supply chain management,

procurement, and supplier development. He aims to continue to grow MediaTek’s

competitive advantage by building a world-class global supply management

organization, with scalability to power the next cycle of growth.