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Keynote: AI-Ready Equipment: Building Global Competitiveness in Advanced Packaging Equipment

2:55 pm - 3:15 pm

As AI, High-Performance Computing (HPC), and advanced packaging technologies continue to evolve, equipment competitiveness is no longer defined solely by mechanical design and high-precision control. Data readiness, digitization, and AI enablement are critical differentiators. Delta integrates high-precision, high-speed industrial automation components, equipment connectivity, Digital Twin, and cybersecurity technologies to help equipment manufacturers build AI-ready architectures that accelerate equipment development, shorten implementation timelines, and strengthen data usability. This keynote will explore how equipment digitization and Digital Twin technologies help the equipment industry transition from hardware excellence to equipment innovation and digital transformation to achieve global leadership.

 

Key Technologies Covered

  • AI-Ready Equipment Platforms
  • High-Precision Motion Control
  • High-Frequency Data (100Hz+) Acquisition
  • Software-in-the-Loop Digital Twin
  • Die Traceability Data Integration and Time Synchronization
  • Equipment Cybersecurity & E187/E9 Readiness
  • Digitalization for Faster Time-to-Value

Featured Speakers

Ms. Lisa Kao

Ms. Lisa Kao

GM, Industrial Automation BG, Delta Electronics

Lisa Kao, General Manager, Industrial Automation Business Group (IABG), Delta Electronics, Inc.

Lisa Kao (高璐華) was appointed General Manager of Delta’s Industrial Automation Business Group (IABG) in April 2026. She brings extensive leadership experience in global sales transformation and operational excellence.

Lisa joined Delta Electronics in 2023, taking on a key role in the Global Business Operations (GBO) team, where she led sales transformation and operational initiatives. Prior to Delta, she built a successful career in the IT industry, with significant experience in strategic planning, business development, marketing, and customer service at global technology companies, including IBM. These diverse experiences have given her a deep understanding of technology trends, customer needs, and operational efficiency.

Under Lisa’s leadership, IABG is deepening its focus on the semiconductor industry, especially advanced packaging, heterogeneous integration, and AI-driven manufacturing. By integrating high-precision motion, software-based control, smart equipment, and digital twin technologies, IABG helps customers enhance precision, yield, and efficiency as well as accelerate validation and time-to-market through close co-creation.

As the new leader of IABG, Lisa continues to deepen IABG’s commitment to the semiconductor field by strengthening the integration of automation, intelligent manufacturing, and digital solutions, delivering comprehensive support to customers in this high-growth sector.