Panel Discussion: Key Challenges from Deployment to Scalable Manufacturing

Dr. Mike (Sung-Ching) Hung joined ASE in 1998 and has been over 28 years of leadership experience across Packaging Research and Development, Design and Process Engineering, Operations, Quality Assurance, Customer Relationship Management, Business Development and Long-term Business planning and Strategy.  He currently serves as Executive Vice President of ASE Kaohsiung, overseeing Central Engineering, the System-in-Package (SIP) Business Unit and Quality Assurance.  From 2011 to 2016, he concurrently served as General Manager of ASE Nantou, a subsidiary of ASE Inc.

Dr. Hung earned his Ph.D. in Engineering Mechanics from the University of Texas at Austin in 1997.  In recognition of his outstanding achievements, he received the Distinguished Alumni Award from National Sun Yat-Sen University (NSYSU) in 2011.  Since 2012, he has spearheaded collaborations between ASE and leading universities such as NSYSU and NCKU, through research partnerships, scholarships, and ASE Chair Professorships.  These initiatives have since expanded to more than 10 universities across southern Taiwan, advancing research in Advanced Packaging, CIM and Environmental Sustainability.  He is also currently a Board Director of the Taiwan Semiconductor Industry Association (TSIA) since 2014.

A passionate advocate for employee well-being, Dr. Hung champions the philosophy of “Healthy Habits, Healthy Career".  He actively supports ASE's Sports and Social Clubs, especially Dragon Boat races.  He believes that sports foster teamwork, resilience, and a positive work culture.  Outside of work, Dr. Hung enjoys marathon running, cycling and mountain hiking.

Mr. Wen Chin Tseng is the Chief Operating Officer of C SUN MFG. LTD., a leading semiconductor equipment provider specializing in advanced packaging and PCB substrate manufacturing solutions. With extensive experience in semiconductor manufacturing, equipment development, and process technologies, he is committed to driving innovation in 3D IC integration and next-generation semiconductor solutions for the AI era.

Eric Lin serves as the General Manager of Jentech Precision Industrial. He brings extensive experience in strategic management, corporate governance, and global business development, supported by an MBA from Fairleigh Dickinson University.

Mr. Lin leads Jentech’s four key centers, including the Operations Center, Production Center, R&D Center, and Advanced Technology Development Center. Under his leadership, Jentech is committed to strengthening its vertically integrated capabilities across thermal, electrical, and mechanical domains.

Leveraging its precision manufacturing expertise, Jentech develops advanced thermal solutions for applications such as high-performance computing (HPC) and AI servers. These include high-precision heat spreaders and next-generation Micro Channel Lid (MCL) solutions designed for future high-wattage computing platforms. Through these comprehensive capabilities, Jentech provides high-quality total thermal solutions that enable global semiconductor leaders to overcome increasingly demanding thermal challenges in advanced semiconductor applications.

Mr. William Lin is the President and CEO of Wiwynn Corporation. Prior to joining Wiwynn, he was the Group President of the Enterprise and Networking Business Group at Wistron Corporation, where he successfully led multinational and multidisciplinary teams.

Mr. Lin has more than three decades of experience in the IT industry, including expertise in server and AI-related industries, as well as cross-domain expertise in product development, sales, supply chain management, and customer services.

Mr. Lin holds a Bachelor of Science degree in Electronic Engineering from Feng Chia University in Taiwan and a Master of Business Administration (MBA) from Wright State University in Ohio, USA.

Dr. He is Vice President of Advanced Packaging Technology and Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). As industry veteran with over 30 years of semiconductor development experience, his current responsibility spans across company's 3DIC packaging manufacturing and testing technology development/operation. His organization spearheaded the fast expansion of CoWoS capacity supporting AI eco-system. In additional to relentless push for better 3DIC yield and cycle time, his organization’s track record on annual cadence of steep ramping new backend technologies provides critical building blocks for both HPC and mobile markets. His another focus is expanding TSMC 3DIC manufacturing network by collaborating closely with OSAT partners to further accelerate capacity expansion.  By collaborating with substrate, memory, and backend tool/material suppliers, his organization delivers customers an integrated one-stop 3DIC service, significantly shortening time to market of customer products with accelerated HVM ramp.

Dr. He joined TSMC in 2017 as Senior Director of Advanced Technology Quality and Reliability. In this role, he was leading the development of analytical and test methodology to effectively detect reliability defects as well as screen risky Si wafers and packaging units. Such innovations accelerated launch and steep production ramp for 7nm and 5nm technologies. Dr. He also revamped TSMC’s quality management system for incoming materials in 2019 and strengthened collaborative relationship with key suppliers. In 2020, Dr. He was promoted to Vice President of the Quality and Reliability Organization at TSMC. During this period, he further established a foundry eco-system, such as incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. His contributions supported the development and production ramp for 3nm technology.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, with excellent technical track record and extensive leadership experience in Si and packaging process technology development and global manufacturing. Up to now, Dr. He holds 141 patents globally, including 60 U.S. patents and published over 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.