Dr. Yu-Po Wang

In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. 

He joins SPIL in 1998 and leads the R&D Package Application and Technology Support Team in substrate/package design, material characterization and advanced package. 

Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has over 83 patents in US.