Dr. Bob Wei-Ming Chen

Dr. Bob Chen received his M.S. and Ph.D. in Electrical Engineering specialized in microelectronics from the University of Texas at Austin, USA in 1990, and 1994. respectively. He has an EMBA degree from National Chiao-Tung University, Taiwan, and a B.S. degree in Materials Science from National Tsing-Hua University, Taiwan. 

He has 30 year’s experience in the semiconductor related industries. He began his career at Motorola‘s Advanced Product Research Laboratory(Austin, Texas) in 1994, working on power PC and embedded memory R&D. He joined TSMC in 1998, later becoming deputy director, and then moved to TSMC’s subsidiary Xintec Inc. in 2008 as R&D VP, pioneering wafer-level packaging and 3DIC packaging. He founded MOS Art Packaging in 2009 and joined Neo Solar Power in 2011 as R&D VP, later becoming president of the cell business unit. Since 2017, he has been with Foxconn Technology Group, contributing to semiconductor start-ups and innovations. He currently serves as the President of Foxconn S Business Group. 

He has been involved in the development of 8 semiconductor technology nodes and led the integration of 2 process technology nodes at TSMC. He has published over 40 academic papers and 30 patents. His expertise spans over logic processes, embedded memory, image sensors, advanced packaging, and solar energy. He has extensive experience in managing R&D teams, bringing up new companies, and corporate governance. He currently serves as a board member of various semiconductor companies including Foxconn subsidiaries, HYS(SiC foundry), Koresemi(advanced package), Socle(Design service), LYG(Design service), Fortunebay(IC distributer) and FXN invested companies DNeX(IT & Technology), SFL(Sharp semiconductor & Laser), and GIS(touch panel).