【July 29, 2025 – Hsinchu】Amid soaring demand for high-performance memory in AI computing, Taiwan is solidifying its position as a key hub for memory innovation, powered by its robust supply chain, advanced packaging expertise, and system integration strengths. To meet this industry shift, SEMICON Taiwan 2025 will debut the “Memory Executive Summit” on September 9 at Taipei Nangang Exhibition Center, Hall 2. Centered on the theme “Empowering AI: Exploring the Possibilities of Memory Innovation,” the summit will spotlight breakthroughs and challenges in AI-driven memory, from co-designing memory and compute chips to integrating advanced packaging and fostering collaboration across the entire value chain.

Memory Titans SK hynix, Samsung, and Micron Share the Stage to Shape the AI Era

For the first time, the Memory Executive Summit unites top executives from the world's three leading memory industry giants on a single stage to unveil their respective AI-era R&D innovations and views on market prospects. The discussion will spotlight next-gen technologies, like High-Bandwidth Memory (HBM) and DDR5, and future memory architectures driving AI and accelerated computing.

  • Jeff (Joonyong) Choi, VP of SK hynix – Examining key trends in the AI-era memory industry and partnering to redefine standards for HBM and AI computing infrastructure.
  • Jangseok Choi, VP, Memory Product Planning of Samsung Electronics – Exploring how next-generation memory innovations are driving AI performance gains and shaping the diverse evolution of memory technologies.
  • Nirmal Ramaswamy, Corporate VP of DRAM Technology Development, Micron – Showcasing how the company advances AI with breakthrough DRAM, spotlighting the global memory industry’s diverse innovation paths.

From Design to Integration, SEMICON Taiwan Sparks Industry-Wide Dialogue

The Summit will encompass the full memory supply chain, featuring in-depth conversations between memory executives and industry pioneers in AI chip design, system integration, and specialized applications. This multifaceted dialogue will examine the industry’s future from all perspectives, addressing market demand, real-world applications, and core technology breakthroughs.

  • Anki Nalamalpu, Senior VP, Datacenter and AI of MediaTek – Focusing on how leading AI chip designers leverage global partnerships to build the next-generation smart computing ecosystem and define the new industrial framework for the AI era.
  • Pei-Ming Chen, President of Winbond – Sharing how Taiwan’s memory makers are securing niche technology advantages amid the AI wave and capturing future growth through customized memory solutions.
  • Keh-Chung Wang, Head of Emerging R&D of Macronix – The seasoned Macronix technology leader will share how customized memory innovations address diverse AI-era applications, showcasing the technical strengths of Taiwanese companies.

Register now and enjoy early bird discounts until August 20. Discover the momentum of memory-driven AI under the theme “Leading with Collaboration. Innovating with the World.” For more details: Official Website.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit www.semi.org or join SEMI Facebook, SEMI LinkedIn, and SEMI Official Line Account.