| Sep. 2 | 12:40 - 13:00 | Pibond Oy | Innovative Materials Driving the Next Wave of Semiconductor Evolution | English |
| Sep. 2 | 13:00 - 13:20 | Dalian High Purity Chemical Co., LTD | Developments in Gas Purification Technology | Mandarin |
| Sep. 2 | 13:20 - 13:40 | Qnity Electronics | Next-Generation Slurries for Advanced Packaging | English |
| Sep. 2 | 13:40 - 14:00 | EZBOND CHEMICAL CO., LTD. | Silicone solutions for optical devices | English |
| Sep. 2 | 14:00 - 14:20 | Heraeus Materials Singapore Pte Ltd | AI Power Management Solutions | Mandarin |
| Sep. 2 | 14:20 - 14:40 | Dyfenco International Co., Ltd. | Low-Void Solder Paste Technology | Mandarin |
| Sep. 2 | 14:40 - 15:00 | Suzhou Jinhong Gas Co., Ltd | Application of fluorocarbon gases in etching processes | Mandarin |
| Sep. 2 | 15:00 - 15:20 | AMAZING COOL TECHNOLOGY CORPORATION. | Thermal managment through Graphene-Metal Hybrid material | English |
| Sep. 2 | 15:20 - 15:40 | NIPPON SHOKUBAI Co., Ltd. | Technical Introduction of Spherical Silica Fine Particles, and a Wide Variety of Water-Soluble Synthetic Polymers | English |
| Sep. 2 | 15:40 - 16:00 | Zeon Corporation | Why COP is suitable for semiconductor-related applications. | Mandarin |
| Sep. 2 | 16:00 - 16:20 | ION ELECTRONIC MATERIALS CO., LTD. | Road to Excellence | Mandarin |
| Sep. 2 | 16:20 - 16:40 | Ever Island Corporation | Presentation title: From Mobile SiP to Photonics: Enabling high-yield with Heraeus Electronics’ advanced packaging fine-pitch solder materials | English |
| Sep. 3 | 13:00 - 13:20 | Kanematsu Taiwan Corp. | Au and Pd Plating Technologies for Semiconductor and Advanced Packaging Applications | English |
| Sep. 3 | 13:40 - 14:00 | Carpenter Technology | Advancing Fab Reliability Through High-Purity Gas Systems | English |
| Sep. 3 | 14:00 - 14:20 | MACDERMID PERFORMANCE SOLUTIONS TAIWAN LTD. | Electrochemical Materials Driving the Future of Advanced Packaging | Mandarin |
| Sep. 3 | 14:20 - 14:40 | MITSUBISHI CHEMICAL TAIWAN CO., LTD. | Materials that Power the Tools that Power the Fab | English |
| Sep. 3 | 14:40 - 15:00 | TAIWAN DAIKIN ADVANCED CHEMICALS, INC. | Liquid cooling technology to be realized by DAISAVE | English |
| Sep. 3 | 15:00 - 15:20 | NAGASE (TAIWAN) CO., LTD. | Breaking Interconnect Barriers in Chiplet Architectures Using Laser-Assisted Bonding | English |
| Sep. 3 | 15:20 - 15:40 | Corning Incorporated | Accelerating AI Infrastructure through Glass Innovations | English |
| Sep. 3 | 15:40 - 16:00 | TANAKA PRECIOUS METAL GROUP CO., LTD. | Advancing Die Attach Materials | English |
| Sep. 3 | 16:00 - 16:20 | PENTAPRO MATERIALS INC. | Innovation and Localization of High-Purity Precursor Materials for Advanced Semiconductor Manufacturing | Mandarin |
| Sep. 3 | 16:20 - 16:40 | Dow Chemical Taiwan Ltd | Silicone Thermal Interface Materials for Advanced Packaging | Mandarin |
| Sep. 4 | 10:20 - 10:40 | Shenmao Technology Inc. | Application of Low Temperature Solder Ball in Advanced Packaging | Mandarin |
