TechXPOT Stage 3F, TaiNEX 2 (Booth #: X0047)
| Date | Time | Company Name | Topic | Language |
| 9/10 | 11:00 ~ 11:20 | Trendforce | SiPh/CPO:The Engine Driving AI-era Interconnects | Chinese |
| 9/10 | 13:00 ~ 13:20 | SixSense Singapore | Why the Fabs & OSATs of 2030 be AI-First | English |
| 9/10 | 13:40 ~ 14:00 | Cheng Mei Instrument Technology Co., Ltd. | AI-Enhanced AOI for Silicon Photonics | Chinese |
| 9/10 | 14:00 ~ 14:20 | SHINCRON.CO.,LTD. | RF sputtering deposition of thin-film lithium niobate for photonic integrated circuit applications | English |
| 9/10 | 14:20 ~ 14:40 | MSSCORPS Co., Ltd | Critical Testing of Silicon Photonic Devices — Challenges from Measurement to Anomaly Analysis | Chinese |
| 9/10 | 14:40 ~ 15:00 | PARK SYSTEMS TAIWAN CO., LTD. | The Evolving Role of Metrology in Adv. Packaging and CPO ( Co-Packaged Optics) | English |
| 9/10 | 15:00 ~ 15:20 | SuZhou Guangduo Micro, Nano Devices Co., Ltd | Application of Nano-Imprinting Lithography in Micro Nano Optics | English |
| 9/10 | 15:20 ~ 15:40 | NTT Advanced Technology Corporation | NTT-AT Optical Solutions for CPO Packaging | Chinese |
| 9/10 | 15:40 ~ 16:00 | BIZLINK INTERNATIONAL CORPORATION | Enabling Photonics Systems with Reliable Box-Build & Integrations Services | English |
| 9/10 | 16:00 ~ 16:20 | EFAB International Technology Co., Ltd. | Redefining Asset Value · Strengthening Supply Chain Resilience | Chinese |