AI晶片世紀對談 AI Chip Fireside Chat

漢密度．迪亞 (Hamidou Dia) 領導 Google Cloud 的應用人工智慧部門。他同時也是環聯公司 (TransUnion or TU) 董事會的獨立董事，以及 Alphabet 旗下獨立成長基金 CapitalG 的市場拓展顧問委員會成員。漢密度．迪亞 (Hamidou Dia) 先生曾於 2019 年 4 月至 2023 年 4 月期間擔任Google Cloud 副總裁暨全球解決方案工程部主管，領導全球解決方案工程團隊。在此之前，Dia先生自 1999 年至 2019 年在 甲骨文 (Oracle) 擔任多項職務，最近的職位是北美技術解決方案工
程與雲客戶成功部資深副總裁。作為北美技術部門的首席架構師，他管理著超過 1,600 名銷售工程師的團隊，並推動銷售工程團隊從內部部署由地端轉型為雲端銷售工程團隊。漢密度．迪亞 (Hamidou Dia) 先生擁有法國南特大學的電腦科學學士與碩士學位。

Dr. Jung-Bae Lee is the President and General Manager of Memory Business at Samsung Electronics' Device Solutions Division.

Since joining Samsung in 1992, Dr.Lee has markedly contributed to the advancement of DRAM technology. He participated in the development of various DRAM products, most notably DDR, DDR2, DDR3, GDDR, LPDDR2, LPDDR3. 

His business acumen was instrumental in strategically productizing and gaining market acceptance of Samsung's most advanced technologies such as 3D-NAND and HBM (High Bandwidth Memory) during his tenure as Senior VP in the Product Planning Team from 2013 to 2017.

While being Executive VP of Quality Assurance Department of Memory Business, Dr.Lee took charge of DRAM Product and Technology Development prior to being promoted to President and General Manager of Memory Business.

Dr.Lee has also served as the chairman of Korea Semiconductor Industry Association (KSIA) in 2021, leading the growth of the country’s semiconductor business at its very forefront. 

He received his B.S., M.S., and Ph.D. degrees in electrical engineering at Seoul National University.

Education:

• Ph.D., Electrical Engineering, University of California, Los Angeles, USA

Experience:

• Senior Vice President, Research & Development, TSMC
• Vice President, Research & Development, TSMC

Biography:

Dr. Y.J. Mii is Executive Vice President and Co-Chief Operating Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Mii joined TSMC in 1994 as a manager at Fab 3 and then joined the company's R&D organization in 2001. In 2011, Dr. Mii was appointed Vice President of Research and Development and later he was promoted to Senior Vice President in November 2016.

In more than two decades of services at TSMC, Dr. Mii has contributed greatly to the development and manufacturing of advanced CMOS technologies in both Fab Operations and R&D. He successfully managed the development of 90nm, 40nm and 28nm technologies. By spearheading the research and development of 16nm, 7nm, 5nm, 3nm, and beyond, he has helped maintain TSMC's technology leadership in the foundry segment of the global semiconductor industry.

Dr. Mii received the IEEE Frederik Philips Award in 2022, recognizing his outstanding accomplishments in the management of research and development. Before joining TSMC, Dr. Mii was a research staff member at IBM Research Center.

Dr. Mii has 34 patents globally, including 25 US patents, and holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).