Building AI Future from the Atomic Level with AI

下午 3:15 - 下午 3:35

AI is pushing silicon and the entire semiconductor ecosystem beyond its traditional limits. It is no longer just about shrinking features; it is about rearchitecting how semiconductors are built, driven by the rise of 3D scaling, heterogeneous integration, and new approaches to performance, power, and density.

Meeting this demand requires a new wave of breakthroughs: atomic-scale etch and deposition, high-aspect-ratio patterning and advanced packaging. These innovations are transforming logic, memory, and packaging and redefining what is possible, while also enabling more sustainable, manufacturable solutions at scale.

At the same time, AI is becoming a catalyst within the industry itself — accelerating lab-to-fab transitions, optimizing equipment performance, and fostering deeper collaboration across the ecosystem. Leveraging AI in wafer fabrication and process development is now essential to keep pace with its rapid evolution.

As global leaders share how their companies are advancing AI, Lam is delivering the atomic-scale innovations that make it all possible. Join Sesha Varadarajan, Head of the Global Products Group at Lam Research, for a forward-looking exploration of how the semiconductor industry is enabling AI and evolving with it. The future isn’t waiting. It’s being built atom by atom.

Featured Speakers

Mr. Sesha Varadarajan

SVP, Global Products Group, Lam Research

Sesha Varadarajan is senior vice president of the Global Products Group at Lam Research. He is responsible for overseeing all aspects of products groups at Lam, worldwide lab network and Lam India.

Sesha has held various technical and leadership positions throughout his 25-year tenure at Lam Research. Prior to his current role, he led the Deposition Business Unit and the PECVD/Electrofill Business Unit. Before Lam’s acquisition of Novellus in 2012, he held several leadership roles at the company, including as general manager of the PECVD and Electrofill Business Units.

Sesha holds over 170 global patents in semiconductor wafer processing and equipment design. He earned his M.S. degree in manufacturing engineering and material science from Boston University and a B.S. degree in mechanical engineering from the University of Mysore.