Panel Discussion

Jeff Lin is in charge of Government Think Tank, Corporate Advisory, and International Strategic Cooperation within ITRI (Industrial Technology Research Institute). while also serving as Deputy Director of the AI Application Strategy Office and the Southern Taiwan Innovation Strategy Office. 
He is a board member of ITIC, an independent director of CDIB, and Chairman of the Asia Pacific Industrial Analysis Association (APIAA). With over 25 years of international consulting and 10 years of investment experience, he previously held senior leadership roles at BCG, Roland Berger, and Booz, specializing in strategic planning, cross-domain innovation, and global collaboration.
Mr.Lin holds an MBA from the University of Chicago, USA, and a B.S. in Political Science from National Taiwan University, Taiwan.

Dr. Mike (Sung-Ching) Hung joined ASE in 1998 and has been over 28 years of leadership experience across Packaging Research and Development, Design and Process Engineering, Operations, Quality Assurance, Customer Relationship Management, Business Development and Long-term Business planning and Strategy.  He currently serves as Executive Vice President of ASE Kaohsiung, overseeing Central Engineering, the System-in-Package (SIP) Business Unit and Quality Assurance.  From 2011 to 2016, he concurrently served as General Manager of ASE Nantou, a subsidiary of ASE Inc.

Dr. Hung earned his Ph.D. in Engineering Mechanics from the University of Texas at Austin in 1997.  In recognition of his outstanding achievements, he received the Distinguished Alumni Award from National Sun Yat-Sen University (NSYSU) in 2011.  Since 2012, he has spearheaded collaborations between ASE and leading universities such as NSYSU and NCKU, through research partnerships, scholarships, and ASE Chair Professorships.  These initiatives have since expanded to more than 10 universities across southern Taiwan, advancing research in Advanced Packaging, CIM and Environmental Sustainability.  He is also currently a Board Director of the Taiwan Semiconductor Industry Association (TSIA) since 2014.

A passionate advocate for employee well-being, Dr. Hung champions the philosophy of “Healthy Habits, Healthy Career".  He actively supports ASE's Sports and Social Clubs, especially Dragon Boat races.  He believes that sports foster teamwork, resilience, and a positive work culture.  Outside of work, Dr. Hung enjoys marathon running, cycling and mountain hiking.

Dr. He is Vice President of Advanced Packaging Technology and Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). As industry veteran with over 30 years of semiconductor development experience, his current responsibility spans across company's 3DIC packaging manufacturing and testing technology development/operation. His organization spearheaded the fast expansion of CoWoS capacity supporting AI eco-system. In additional to relentless push for better 3DIC yield and cycle time, his organization’s track record on annual cadence of steep ramping new backend technologies provides critical building blocks for both HPC and mobile markets. His another focus is expanding TSMC 3DIC manufacturing network by collaborating closely with OSAT partners to further accelerate capacity expansion.  By collaborating with substrate, memory, and backend tool/material suppliers, his organization delivers customers an integrated one-stop 3DIC service, significantly shortening time to market of customer products with accelerated HVM ramp.

Dr. He joined TSMC in 2017 as Senior Director of Advanced Technology Quality and Reliability. In this role, he was leading the development of analytical and test methodology to effectively detect reliability defects as well as screen risky Si wafers and packaging units. Such innovations accelerated launch and steep production ramp for 7nm and 5nm technologies. Dr. He also revamped TSMC’s quality management system for incoming materials in 2019 and strengthened collaborative relationship with key suppliers. In 2020, Dr. He was promoted to Vice President of the Quality and Reliability Organization at TSMC. During this period, he further established a foundry eco-system, such as incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. His contributions supported the development and production ramp for 3nm technology.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, with excellent technical track record and extensive leadership experience in Si and packaging process technology development and global manufacturing. Up to now, Dr. He holds 141 patents globally, including 60 U.S. patents and published over 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.

Dr. I-Shih Tseng is the President of Chroma ATE Inc. He joined Chroma in 1998 and involved in the development of semiconductor test equipment. Other positions I-shih served at Chroma including Deputy Chief Engineer, Research Vice President, Semiconductor Test Equipment Business Unit President, Chief Technology Officer, and President of Integrated System Solution BU. Particularly in semiconductor test solution, Chroma provides MCU/SoC/Analog test systems, Photonics/Optics test systems, HPC SLT & Burn-In test systems, as well as advanced packaging metrology systems . I-Shih received his Ph.D. in mechanical engineering from The Pennsylvania State University, Penn., and B.S. from National Taiwan University. His technical expertise includes semiconductor testing system, system automation, and mechanical engineering.

Work Experience

• BU President, Optical Inspection System BU, Chroma ATE Inc
• BU President, Integrated System Solution BU, Chroma ATE Inc
• Chief Technology Officer, Semiconductor Test Equipment BU, Chroma ATE Inc

Education

• Ph.D., Mechanical Engineering, The Pennsylvania State University, Pennsylvania, USA
• B.S. , Mechanical Engineering, National Taiwan University

Ben-Li SHIH, CEO of GPTC

Ben-Li SHIH is the CEO of Grand Process Technology Corporation, a leading company in the semiconductor industry. He has a distinguished career spanning over 30 years, with extensive experience in semi-conductor process development, engineering, manufacturing, and foundry service operations.

Before his current role, Mr. Shih served as the General Manager of Grand Process Technology Corporation, where he played a pivotal role in the company's growth and technological advancements. He also held a leadership position as Chairman, General Manager,  and Board Director at Chemleader Corporation、Challentech International Corporation, both of these two companies are subsidiaries of GPTC.

Academically, Mr. Shih holds a Master's degree in Materials Science and Engineering from National Tsing-Hua University and a Master of Business Administration for Executives (EMBA) from National Cheng-chi University. He is also a respected speaker at industry events such as SEMICON Taiwan, where he shares his insights on the latest developments in semiconductor technology.