王金勝博士

Dr Wang received his Master and Doctorate in Chemical Engineering from National Taiwan University. He worked for Industrial Technology Research Institute (ITRI) from 1992 to 1997.

Jason Wang joined Unimicron since 1997 and devoted to IC substrate development for three years. Afterwards, he shifted to Subtron after Unimicron acquired this company in 2000. He served as the Vice President of Engineering in Subtron. He and his team focused on the development of substrates for the applications of RF and LED products in which the heat dissipation becomes more challenging. He and his team created many novel solutions and acquired many patents. He also has many years of experience and expertise in electroplating and surface finishing.     

He was back to Unimicron in 2016 and started to take over R&D department of PCB II business division as senior Vice President from September of 2017. He and his team dedicated to the development of PCB for high speed and high frequency, high power applications. He is currently in charge of the New Business Development Division and Advanced Technology Development Center as VCTO.