Market Trend’s for MEMS & Sensors for Intelligent Robotics

下午 4:35 - 下午 5:00

The convergence of Physical AI and intelligent robotics is driving a structural transformation across the global MEMS and sensor ecosystem. As autonomous systems transition from rule-based automation to edge-native cognitive intelligence, the sensor's role shifts from a basic data collector to the fundamental hardware foundation of machine perception.

This presentation delivers a data-driven analysis of the global MEMS and advanced sensing market, mapping the critical inflection points shaping the robotics super-cycle through 2030. We deconstruct the architecture of modern robotic perception, detailing how high-precision inertial measurement units (IMUs), tactile force/torque sensors, solid-state LiDAR, and imaging radar enable human-level spatial awareness.

Beyond component-level dynamics, the session explores critical hardware-level integrations: the rise of edge-native sensor fusion and Machine Learning Cores (MLC) to eliminate latency; the transition to advanced 3D packaging and heterogeneous integration to satisfy strict real-power and spatial constraints; and the macroeconomic realities of 300 mm wafer fabrication scaling. Attendees will gain a precise macro-to-micro view of market volumes, growth trajectories, and the strategic roadmaps required to capture value.

 

Key Technologies Covered

  • Tactical-Grade MEMS Inertial Measurement Units (IMUs)
  • Multi-Axis Tactile Force and Torque Sensor Arrays
  • Edge-Integrated Machine Learning Cores (MLC) & ISPUs
  • Optical MEMS (MOEMS) Solid-State LiDAR & Terahertz Radar
  • 2.5D/3D Heterogeneous Co-Packaged Integration

Featured Speakers

Mr. Bruce Bateman

劉永道

Chief Analyst, Semiconductor, 台灣伊福曼科技有限公司

Bruce Bateman, Chief Analyst, Semiconductor at Omdia, is a market-intelligence leader with over four decades of experience, whose deep, hands-on knowledge of MEMS, sensors, and imaging technologies is helping shape the next generation of intelligent machines. His extensive MEMS expertise spans emerging sensing platforms, from inertial and environmental MEMS to advanced optical and imaging sensors, and how they're converging with AI to enable autonomous robotics, edge intelligence, and smart infrastructure.

 

At Omdia, Bruce delivers global analysis of the end-to-end semiconductor market report “Semi Dynamics”, forecasting demand, supply-chain dynamics, and the technology inflections that determine where growth accelerates. His perspective connects device-level innovation to the systems that consume it, giving audiences a clear view of both the components and the markets they serve.

 

Bruce brings rare depth across the hardware stack. As CTO at LITEON, a $16bn optical and electronic manufacturer, he set corporate innovation and technology roadmaps and introduced AI-driven factory automation across global semiconductor and component operations, improving yield and quality. His expertise spans semiconductor processes, advanced packaging, and silicon photonics, foundations now central to AI compute and optical sensing. Earlier, at A4Vision he led biometric imaging and identification systems for government clients. as CEO of QO+, developer of the world's first gas chromatograph on a single silicon chip, a miniature, low-cost mems sensor that detects multiple airborne VOCs for uses from robotaxis to smart buildings.

 

Born in Taiwan and fluent in Mandarin, Bruce offers a distinctive vantage on the Asia-Pacific sensor and semiconductor supply chain, the manufacturing engine behind the world's MEMS and imaging devices. His insight into where sensing technology is heading makes him a compelling voice on the market trends defining intelligent robotics.