The Photonic Fabric, a heterogeneous integration challenge

下午 1:55 - 下午 2:20

Optical networking is today at the heart of the AI infrastructure scaling, from the rack-to-rack to the campus-wide interconnectivity. In the near future, photonics links will displace copper for the short distance data exchange within the racks and even within the server blades. To realize this, the photonic-enabled fabric must demonstrate superior performance while keeping power consumption under control. In this presentation, we will review how heterogeneous integration addresses this challenge.

Key Technologies Covered

Silicon photonics platforms for AI datacenters
Co-packaged optics
Integrated photonics
Heterogeneous integration
Optical interconnects
AI infrastructure
Photonic fabrics
Low-power data movement
High-bandwidth data exchange architectures
Advanced packaging

Featured Speakers

Dr. Philippe Absil

Vice President IC-Link | imec silicon solutions, imec

At IC-Link / imec silicon solutions, Philippe Absil leads programs enabling custom ASIC design, prototyping, and advanced semiconductor integration. With over 20 years of experience in CMOS technology development and system design, Philippe has driven innovation in advanced nodes, 3D integration, and heterogeneous packaging. He holds a Ph.D. in Electrical Engineering and has authored numerous publications and patents in semiconductor process technology. At imec, Philippe focuses on bridging research and industry to accelerate time-to-market for next-generation chips in AI, automotive, and high-performance computing applications.