Materials Innovation and Ecosystem Resilience Enabling AI Performance

上午 10:05 - 上午 10:25

The semiconductor industry faces mounting challenges as logic and memory architectures become increasingly complex. Meeting the performance, power, and scaling demands of AI-driven platforms requires more than roadmap awareness - it requires early identification of technology inflection points and the ability to industrialize new materials with speed, quality, and scale.

 

Merck Electronics addresses these challenges by combining deep insight into the technology landscape with a globally connected capability base spanning R&D, technical marketing, and manufacturing. This footprint enables rapid response to local customer needs wherever innovation occurs, while providing the scale, robustness, and continuity needed to strengthen ecosystem resilience.

 

We will illustrate this approach through selected examples: spin-on dielectrics that enable advanced packaging integration; novel organometallic precursors for deposited semiconductor channels in advanced logic and DRAM; and area-selective deposition challenges that demand molecular-scale understanding of surface chemistry, supported by close co-development partnerships with equipment makers and semiconductor manufacturers. Together, these examples show how material innovation, executed within a resilient global ecosystem, can accelerate time to solution and help meet the next wave of AI performance demands.

 

Key Technologies Covered 

  • Materials Innovation and ecosystem
  • Spin-on dielectrics that enable advanced packaging integration
  • Novel organometallic precursors for deposited semiconductor channels in advanced logic and DRAM
  • Area-selective deposition challenges

Featured Speakers

Mr. Bing Han

Dr. Bing Han

Executive Vice President and Head of Thin Films Business Unit, Merck

Bing Han is Executive Vice President and Head of the Thin Films Business at Merck KGaA, Darmstadt, Germany, bringing more than 20 years of experience in semiconductor R&D and commercial leadership. He joined Merck through the acquisition of Versum, where he held progressive leadership roles spanning marketing and asset management. Prior to his current role, he served as Head of Global Marketing for Thin Films and later General Manager of the Dielectrics business. Bing has led business development and management across the full product life cycle—from new product introduction and market positioning to capital project execution and end-to-end value chain improvement. He has authored more than 20 peer-reviewed publications and holds more than 25 issued patents, and earned a B.Sc. in Chemistry from Peking University and a Ph.D. in Materials Science and Engineering from Northwestern University.