Accelerating Semiconductor Innovation in the AI Era: An Integrated Workflow from EFA to Automated TEM for Materials and Device Characterization

上午 11:20 - 上午 11:40

The rapid expansion of AI, high-performance computing (HPC), advanced packaging, and heterogeneous integration is driving unprecedented complexity in semiconductor materials, devices, and manufacturing processes. As critical dimensions continue to shrink and novel materials are introduced, semiconductor manufacturers require faster, more comprehensive analytical workflows to accelerate process development, yield improvement, and failure analysis.

This presentation will demonstrate how Thermo Fisher Scientific's Materials & Structural Analysis Division (MSD) enables a connected characterization ecosystem spanning Electrical Failure Analysis (EFA), plasma- and various ion sourced FIB-SEM technologies, wafer-scale dual-beam solutions, and advanced transmission electron microscopy (TEM). We will discuss how integrated workflows can efficiently bridge fault localization, site-specific sample preparation, and multi-modal nanoscale characterization.

Advanced analytical capabilities including energy-filtered TEM (EFTEM), EDS/EELS, 4D-STEM, strain mapping, and 3D imaging provide critical insights into device architectures, interfaces, dopant distributions, process-induced defects, and next-generation materials. Combined with automation, workflow standardization, and high-throughput sample preparation, these technologies help reduce time-to-result while improving data quality and reproducibility.

Through industry-relevant examples, we will illustrate how a comprehensive EFA-to-TEM workflow supports semiconductor R&D, process optimization, yield enhancement, and root-cause analysis, ultimately helping manufacturers meet the demands of the AI era with greater speed, confidence, and productivity.

Key Technologies Covered

Electrical Failure Analysis (EFA) & Fault Localization
EMMI (Emission Microscopy)
OBIRCH/EBIRCH
PEM (Photon Emission Analysis)
Advanced FIB Sample Preparation
- TEM Lamella Preparation
- Cross-sectioning/Delayering/Rocking Milling
Advanced TEM Imaging & Measurements
High-Resolution TEM (HRTEM)
STEM Imaging- BF/DF/HADDF
3D imaging
Multislice Electron Ptychography
Light-element Visualization
Atom-scale Chemistry and Metrology Analysis
- EDS (Energy Dispersive Spectroscopy)
- EELS (Electron Energy Loss Spectroscopy) & EFTEM (Energy-Filtered TEM)- Dopant Distribution, Interface Chemistry, Contamination Analysis
- STEM-EDS
- 4D STEM-Strain Mapping- Lattice Distortion

Featured Speakers

Mr. Pierre-Yves Guittet

Sr. Director/ General Manager, Thermo Fisher Scientific

Pierre-Yves Guittet is a business and technology leader with extensive experience in the semiconductor, materials analysis, and advanced instrumentation industries. He has built his career at the intersection of innovation, product strategy, and commercial execution, helping organizations translate complex technologies into impactful customer solutions.

At Thermo Fisher Scientific, Pierre-Yves leads initiatives focused on product strategy, market development, and business growth for advanced microscopy and analytical technologies serving semiconductor and industrial customers worldwide. His work spans product management, marketing, business development, and strategic planning, with a strong emphasis on customer-centric innovation and long-term value creation.

Prior to joining Thermo Fisher Scientific, Pierre-Yves held leadership positions at ASML, where he contributed to the development and commercialization of data-driven and process-control solutions for semiconductor manufacturing. Earlier in his career, he worked at Nanometrics and Nanda Technologies in product development, applications, and engineering roles supporting inspection and metrology technologies.

Pierre-Yves combines deep technical expertise with a broad understanding of market dynamics, enabling him to bridge the gap between engineering innovation and business outcomes. He holds graduate degrees in Optics and Photonics from Institut d’Optique Graduate School and the University of Toronto and is a co-inventor on multiple patents related to semiconductor inspection, metrology, and process optimization technologies.