Keynote: Advancing 3DIC Technologies to Propel AI Innovations

上午 9:45 - 上午 10:05

AI innovation has significantly increased the demand for advanced packaging solutions, which offer numerous benefits such as cost efficiency, design flexibility, and enhanced system performance. However, as AI product cycles accelerate toward an annual cadence, they present unprecedented challenges related to rapid development cycles, steep manufacturing ramps, and stringent system yield requirements. Therefore, ecosystem partnerships among chip designers, chiplet integrators, tool/material suppliers, HBM/substrate manufacturers, and system providers are essential to the continued advancement of packaging technologies for AI applications.

Featured Speakers

Ms. April Li

李湘

處長, 台積公司

April Li is the Global Head of AI and HPC (High-Performance Computing) Business Development at TSMC. She’s responsible for driving hypergrowth in the AI/HPC segment through integrated platform roadmaps, global business strategies, and deep customer and ecosystem partner engagements.

With decades of semiconductor leadership, Ms. Li previously served as GM and Head of the Semiconductor Industry at Capgemini. She also spent years at Intel, holding executive roles including Senior Director of Global Sales & Business Development and Director of Engineering Program Management. Throughout her career, she has spearheaded cross-functional alliances that scaled multibillion-dollar products and systems globally. Ms. Li holds a Master of Science in Electrical Engineering and Physics from Cornell University and an MBA from the University of Chicago Booth School of Business.