Lewis Huang has been a key figure at SMIC (Senju Metal Industry Co.) Taiwan since its establishment in November 1999, where he was the first employee. Over the past 25 years, he has risen to the role of Vice President, overseeing sales, marketing, soldering technology support, and management. His career has been deeply connected to major shifts in the semiconductor industry, including the transition from Tin-Lead to lead-free soldering and the adoption of advanced packaging technologies such as BGA, flip chip, WLP, Fan Out, 2.5DIC, 3DIC, heterogeneous integration and thermal solutions.
Lewis is currently pursuing a Ph.D. in Material Science and Engineering at National Cheng Kung University (NCKU), having attained Ph.D. candidacy status. His academic focus enhances his ability to contribute to technological advancements in the semiconductor sector.
He is also actively involved in industry associations, including SEMI Taiwan, TPCA, IMPACT, ECTC, and EPTC, where he plays a significant role in advancing industry standards. Known for his ability to bridge technology between customers and SMIC, Lewis continues to innovate and push the boundaries of semiconductor packaging technologies, driven by a passion for excellence and a commitment to the future of the industry.
