Dr. Gang Duan
Executive Vice President, Samsung Electro-Mechanics
Dr. Gang Duan is Executive Vice President at Samsung Electro-Mechanics, leading substrate application engineering and technology marketing for US customers. Previously, he was a Senior Director and Senior Principal Engineer at Intel Foundry, pioneering advanced substrate packaging technologies like EMIB, EMIB-TSV, glass substrates, and RDL PLP. A prolific innovator, Dr. Duan holds over 350 US patents (600+ worldwide) and has published more than 50 technical papers with over 5,500 citations. He earned his Ph.D. in Materials Science and his M.S. in Electrical Engineering from California Institute of Technology (Caltech).