Keynote: Beyond Moore for the AI Factory Era: Heterogeneous Integration, Chiplets and Photonic Interconnects as the Foundations of Future Intelligent Systems

下午 2:00 - 下午 2:30

The emergence of AI factories, hyperscale data centers and next-generation autonomous robotic systems is driving an unprecedented demand for computing performance, memory bandwidth and energy-efficient connectivity. As conventional monolithic scaling reaches its physical and economic limits, heterogeneous integration has become a fundamental enabler for the next generation of intelligent computing platforms.

Future architectures will increasingly rely on the seamless integration of heterogeneous chiplets combining advanced logic, memory, RF functions, sensing, and optical communication within highly integrated 2.5D and 3D systems. In this context, silicon photonics and co-packaged optics are emerging as key technologies to overcome the limitations of electrical interconnects, enabling the massive bandwidth density and energy efficiency required by AI infrastructures. CEA-Leti has developed a unique portfolio of technologies spanning advanced packaging, active interposers, 3D integration, RF heterogeneous integration, silicon photonics, III-V integration on silicon, and photonic packaging, bridging the gap from device innovation to system-level demonstrations.

This presentation will discuss the technological roadmap towards future AI computing systems and illustrate how heterogeneous integration will become the cornerstone for building sustainable, high-performance and scalable AI infrastructures.

Key Technologies Covered

Advanced Chiplet Architectures for AI Systems
2.5D/3D Integration and High-Density Interconnects
Co-Packaged Optics (CPO) for AI Factory Connectivity
Silicon Photonics and Heterogeneous III-V Integration
RF and Millimeter-Wave Heterogeneous Integration
Next-Generation Memory and Compute Integration
Advanced Thermal Management and Power Delivery
Design-Technology Co-Optimization (DTCO) and System Co-Design

Featured Speakers

Mr. Michael TCHAGASPANIAN

Executive Vice President Technology Strategic Partnerships, CEA LETI

Michael Tchagaspanian is Executive Vice President of Strategic Partnerships at CEA-Leti, one of the world’s leading research institutes in microelectronics and semiconductor technologies. He is responsible for developing long-term strategic collaborations with global industrial leaders and accelerating the transfer of breakthrough technologies from research to high-volume manufacturing.

With more than 30 years of experience in the semiconductor industry, Michael has built a career spanning integrated circuit design, smart sensing, imaging systems, advanced microelectronics, and international technology partnerships. During his career at CEA-Leti, he has initiated and led numerous collaborative programs with major industrial partners in the fields of smart sensing and imaging, embedded systems, integrated circuits, and emerging semiconductor technologies. He previously served as Business Development Manager for the Integrated Circuits and Embedded Systems Division and headed the Image Sensor Design Laboratory, where he developed intelligent imaging solutions integrating advanced algorithms and circuit architectures for defense, security, smart buildings, and medical applications.

Prior to joining CEA-Leti, Michael spent 11 years in the semiconductor industry with STMicroelectronics and ON Semiconductor, where he led the design of advanced System-on-Chip solutions for RF and power management applications, and managed strategic projects for automotive and mobile markets.

Michael received his Engineering Degree from ENSERG and his Master of Science in Electronics Engineering from the Grenoble Institute of Technology (INPG) in 1994.