AGC Inc., a global leader in advanced materials technology, is set to give two forum talks on its latest innovations in semiconductor packaging technologies and on its advances in photonic interconnects at the upcoming Semicon Taiwan 2025. Moreover, join AGC at Booth Number Q5752, Hall Q, 1st floor, TaiNEX 2 to discover how our innovative materials and photonics technologies are shaping the next era of the semiconductor industry.

Pioneering Glass Core and Interposer Solutions for High-Performance Computing

In an exclusive session, Mr. Yoshiki Takahashi, Deputy General Manager of the Advanced Semiconductor Packaging Group, will present in the Strategic Materials Conference forum on September 11th, AGC’s cutting-edge portfolio of material solutions designed to accelerate the adoption of chiplet technology in data centers and high-performance computing environments. Highlights include advanced glass substrates for core, interposer, and unique silica fillers for dielectric layers.

Attendees will gain insight into the benefits of glass core and interposer technologies, such as enhanced electrical performance and integration capabilities. AGC will unveil proprietary advancements in glass reliability, through glass via (TGV) formation, cavity creation, and ultra-thin glass handling. A special focus will be placed on novel TGV metallization techniques, with simulation results demonstrating their impact on power integrity in advanced semiconductor packages.

Additionally, the session will spotlight AGC’s innovative hollow and solid silica filler technology, which enables superior processability for vacuum press and precise via formation. AGC will also introduce solutions for customizable copper layer thickness and line width through advanced filler dispersion methods.

Revolutionizing Optical Interconnects with Polymer Optical Waveguides

In an invited talk, Dr. Hiroyuki Mieno, Photonics & Materials Specialist of the Technology Development General Division, will also present groundbreaking research on polymer optical waveguides (PWGs) for high-density optical interconnects in Co-Packaged Optics (CPO) in the Heterogeneous Integration Global Summit Day 3 on September 12th. The presentation reveals a novel waveguide design that achieves shorter adiabatic coupling lengths, enabling increased shoreline density and higher channel counts on photonic integrated circuits (PICs).

The session will address optical performance, thermal reliability, and advanced coupling strategies between PICs and fibers. AGC will also introduce integrated photonics solutions that combine polymer and glass waveguide technologies, paving the way for scalable intra-package optical interconnects and expanded use cases such as PIC-to-PIC and package-to-package applications.

Join AGC at Semicon Taiwan 2025

Don’t miss the opportunity to learn about AGC’s solutions engineered to meet the demands of semiconductor industry. In addition to glass substrates, silica fillers, and waveguides, AGC delivers a wide range of solutions, especially for advanced semiconductor packaging, covering front-end to back-end processes. AGC’s lineup includes plasma-resistant Yttrium coating which provide exceptional thermal stability and chemical resistance for semiconductor manufacturing equipment and process environments. Furthermore, AGC will feature Ceria slurry for semiconductor CMP processes to realize high planarization and selectivity control. Additionally, AGC offers leading-edge fluoropolymer, Fluon® ETFE, which includes materials and films that deliver outstanding chemical resistance and electrical insulation, making them ideal for use in harsh processing conditions and as protective barriers in semiconductor fabrication. These materials help safeguard device integrity and enhance process control throughout the manufacturing cycle.

About AGC

AGC Inc. is a world-leading manufacturer of glass, chemicals, and other high-tech materials, delivering innovative solutions across industries. For more information, visit https://www.agc.com/en/

Media Inquiries

AGC Inc. Electronics Company Advanced Semiconductor Packaging Group Business Development Please contact us at https://contact.agc.com/webapp/form/17985_tpab_181/index.do