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CEO Summit

Wednesday, September 2 | 10:00 am - 5:00 pm
AI X Hyperscaler X Semiconductor Define the Next Era of Human Progress

In the era where data has become the world's most valuable asset, the convergence of Cloud Computing, Artificial Intelligence, and Semiconductors is transforming the foundation of global innovation. This powerful triad is not only driving exponential growth in computing performance and energy efficiency but also redefining how industries, economies, and societies evolve in the intelligent age.


SEMICON Taiwan 2026 will open with a special Opening Keynote by Amin Vahdat, SVP & Chief Technologist of AI and Infrastructure at Google, offering Google's vision for the future of AI infrastructure and the evolving semiconductor ecosystem. Building on this vision, CEO Summit 2026 will convene global leaders across the semiconductor, cloud, and AI industries through three executive sessions - Global Ecosystem Leadership, Scaling AI Innovation, and Technology, Trust, and the Responsibility of Innovation - to explore how collaboration, technological leadership, and responsible innovation will define the next era of human progress.


The morning session, Global Ecosystem Leadership, will bring together global semiconductor leaders to discuss resilient supply chains, ecosystem collaboration, and the strategic partnerships driving the future of semiconductor innovation. The afternoon session, Scaling AI Innovation, will focus on hyperscale AI infrastructure, next-generation computing, and the technologies required to accelerate AI deployment at global scale. The summit will conclude with the executive Fireside Chat: Technology, Trust, and the Responsibility of Innovation, where industry leaders will exchange perspectives on AI governance, trusted partnerships, and the shared responsibility of shaping the future of technology.


From the cloud to the edge, from design to deployment, CEO Summit 2026 is more than a gathering of industry visionaries - it is a platform where the world's leading executives come together to shape the future through collaboration, foresight, and shared purpose. By bridging hyperscale infrastructure, semiconductor excellence, and AI innovation, we are not merely advancing technology - we are engineering the intelligence that will define the next era of human progress.

Venue: 701AB (Future Stage), 7F, TaiNEX 2
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Registration Fees (Tax Included)

Register Now

Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17

SEMI Member

NT$ 6,689

Non-member

NT$ 9,555
Early-Bird
6/18 - 8/5

SEMI Member

NT$ 7,644

Non-member

NT$ 10,920
Regular
8/6 - 8/30

SEMI Member

NT$ 9,555

Non-member

NT$ 13,650
On-Site
8/31 - 9/4

SEMI Member

NT$ 12,422

Non-member

NT$ 17,745
Student
EMBA Excluded
Valid Student ID Required
NT$ 882
Day Pass
(Tax Included)
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.

Featured Speakers

Dr. Asad Khamisy

Dr. Asad Khamisy

Senior Vice President and General Manager, Broadcom

Keynote Speaker

Mr. Alexander Gorski

Mr. Alexander Gorski

Chief Operations Officer, Infineon Technologies

Keynote Speaker

Ms. Rani Borkar

Ms. Rani Borkar

President, Azure Hardware Systems and Infrastructure, Microsoft

Keynote Speaker

Dr. Rick Tsai

Dr. Rick Tsai

Vice Chairman and CEO, MediaTek

Panelist

Mr. Benjamin Hein

Mr. Benjamin Hein

Member of the Executive Board Merck KGaA and CEO Electronics, Merck KGaA

Keynote Speaker

Mr. Jon Kemp

Mr. Jon Kemp

Chief Executive Officer, Qnity Electronics

Keynote Speaker

Mr. Shan-Chieh Chien

Mr. Shan-Chieh Chien

Chairman, Unimicron Technology Corporation

Panelist