Semiconductor packaging is a vital link between chips and external systems, evolving alongside diverse applications. This section covers the full spectrum from traditional to advanced packaging technologies, including flip chip, embedded packaging, and system-in-package (SiP), reflecting the entire supply chain and innovations.

 

SEMICON Taiwan 2026 Semiconductor Packaging Pavilion Exhibitors

M1154 3S Silicon Tech., Inc. M0954 ADTEC Plasma Technology N0862 ASCENTEX INDUSTRY Corp. N0970 AVVA R&D Corp. M1048 E and R Engineering Corporation M0948 Evatec AG N0982 Forge Nano M1055 Fu-Hwa Machine Co., Ltd. N1083 G.C MICRO TECHNOLOGY CO., LTD. M1056 GPAS OPTRONICS TECHNOLOGY CO., LTD. N0984 Hanwha Semitech Co.,Ltd M0958 Hesse Asia Limited M0957 iCometrue Company Ltd. N0962 Intelume LASER SYSTEMS CO., LTD. M1158 Ker Taur Company Ltd. N0868 Kingyoup Enterprises Co., Ltd. N0886 Kokusai Electric Corp. M0858 LAM RESEARCH (H.K.) LIMITED TAIWAN BRANCH M1248 Manz Taiwan Ltd. N0983 Maxell Taiwan Ltd M1355 Microsys Engineering Co., Ltd M1058 NDS (TAIWAN) CO., LTD. N0966 Park Systems Corp. M1242 PEMTRON Corporation M0856 PLANOPTIK AG M0848 PSK Asia Inc. N0882 PTW ASIA PTE. LTD. TAIWAN BRANCH N1067 RENA Technologies GmbH M1148 Resonac International(Taiwan) Co., Ltd N0876 Sanwa Engineering Corp. N0976 Saultech Technology Co., Ltd. M1255 Shenzhen Hanchi Technology Co.,LTD N0866 Shenzhen Merry Precise Electronic Co.,Ltd M1234 SINTECH TECHNOLOGY CO., LTD. M1157 Sunengine Corporation Ltd. N0967 SUTING PRECISION INDUSTRIAL CO., LTD. M1258 TAZMO Apprecia Formosa Inc. M1254 UVAT Technology Co., Ltd.