半導體封裝為連接晶片與外部系統之關鍵技術，隨應用多樣化持續進化。本區涵蓋從傳統封裝到先進封裝解決方案，包括倒裝、嵌入式封裝、系統級封裝等，展示完整供應鏈與技術突破。
SEMICON Taiwan 2026 半導體封裝專區參展廠商
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