| Time |
Topic |
Company |
|
| 11:30 - 12:00 |
Lincotec – Sputter and Plasma Etch Solutions for SiP and Advanced Substrate Application |
LINCO TECHNOLOGY CO., LTD |
1F #J3034 |
| 13:30 - 14:00 |
Assembly solutions for TWS SiP |
ASE Group |
1F #J3034 |
| 14:00 - 14:30 |
SiP: the Enabler of Innovations |
USI |
1F #J3034 |
| 14:30 - 15:00 |
Chip Development and Operation Process Optimizations with Altair HPC & Cloud Solutions |
Altair |
1F #J3034 |
| 15:00 - 15:30 |
The Capabilities of 5G PN: Security and Applications |
Far EasTone Telecommunications Co., Ltd. |
1F #J3034 |
| 15:30 - 16:30 |
INVEST KAOHSIUNG FORUM |
Invest Kaohsiung |
1F #J3034 |