Heterogeneous Integration Pavilion

With the rise of 5G, AI and other emerging technological applications, increasing requirements for packaging, and transistors continuing to go beyond the size limit, the highly ‘integrated’ heterogeneous packaging technology is regarded as the game-changer that will drive the development of the semiconductor industry in the post-Moore era.

Heterogeneous integration not only leads to evolutionary advances in packaging technology, but also brings about many drastic changes and innovations to the entire semiconductor industry chain. The semiconductor community is ready to jump on the bandwagon to explore new business opportunities of the coming HI age.

The Heterogeneous Integration Pavilion of SEMICON Taiwan 2024 will be joined by leading manufacturers in IC design, manufacturing, packaging and terminal system applications who are going to showcase their high performance computing (HPC) technology, along with innovative IC design, manufacturing, packaging and terminal system solutions, demonstrating what’s new on chiplets, 3D stacking and substrate design and outlining the blueprint for the future of semiconductors.

SEMICON Taiwan 2024 Heterogeneous Integration Pavilion Exhibitors