Dr. Bob Wei-Ming Chen

Dr. Bob Chen received his M.S. and Ph.D. in Electrical Engineering specialized in microelectronics from the University of Texas at Austin, USA in 1990, and 1994. respectively. He has an EMBA degree from National Chiao-Tung University, Taiwan, and a B.S. degree in Materials Science from National Tsing-Hua University, Taiwan.

He started his career with Motorola Advanced Product Research Laboratory (APRDL) doing power PC and embedded memory R&D at Austin Texas in 1994. He joined tsmc in 1998 as an R&D manager and then promoted to deputy director in charge of integration of several technology nodes and various technology flavors for 10 years. He joined tsmc’s package subsidiary Xintec Inc in 2008 as R&D VP doing research in wafer level package, pioneering on TSV and 3DIC package. In 2009 to 2011 he started his own company MOS Art Packaging to continue developing wafer level package products.

He joined Neo Solar Power (NSP) in 2011 as an R&D VP and then promoted to be the president of cell business unit. Through his leadership, NSP maintained the highest efficiency of p-type solar cell and module mass production, and built three solar cell fabs in three different countries outside Taiwan. He also realized the first n-type heterojunction solar cell (HJT) mass production in Taiwan.

He joined Hon Hai Technology group as VP and special assistant to founder Terry Guo in 2017. He joined Hon Hai semiconductor group in 2019. Since then he has served on the board of Hon Hai group’s subsidiaries or investment  including Sharp, Foxsemicon, Shun Sin Technology, Socle technology, DNeX and SilTerra. He has established several semiconductor start-up’s across fields from package to IC design within Hon Hai Technology group. He has about 30 patents