HVM Testing of SiPh and CPO: Challenges, Gaps, and Solutions

3:50 pm - 4:15 pm

As demand for higher bandwidth, lower power usage, and lower latency in data center communications continues to rise—especially with the growth of generative AI—silicon photonics (SiPh) and co-packaged optics (CPO) are becoming essential technologies.

However, large-scale adoption of SiPh and CPO has been slowed by the lack of fully automated and scalable testing tools at the wafer and chip levels. Key challenges in high-throughput testing include:

Fast and precise fiber alignment with high coupling efficiency

Reliable, automated handling of optical packages

A shortage of compact, scalable measurement instruments that offer fast throughput.

To overcome these issues, the industry needs to collaborate on innovation, automation, and standardization.

In a typical SiPh/CPO production process, multiple test insertions are required. Advantest is working with several partners to tackle these testing challenges. One prominent example is the V93000-Triton Photonic Test System (PTS), developed together with FormFactor. Another is a probe card–based optical coupling solution that integrates Jenoptik’s UFO® Probe Card into the V93000 EXA Scale test system.

The V93000-Triton PTS is designed for high-volume production and focuses on testing devices at the wafer level with single-sided access of electrical and optical IOs. It uses active alignment probing, leveraged from FormFactor’s proven CM300xi-SiPh system, and includes a standard TEL electrical prober for fully automated wafer handling and probe card exchange.

The UFO® Probe Card from Jenoptik provides an alternative to traditional fiber alignment methods. It includes an optical module that’s robust against misalignment and optimized for use with grating couplers. When used with the V93000 EXA Scale system, it turns a standard electrical probe card into a fully functional opto-electronic test solution, ready for production use with a standard electrical HVM prober.

To tie it all together, the Advantest Optical Instruments Control Library allows third-party optical measurement instruments to be easily integrated into the SmarTest 8 programming environment. It offers a unified set of commands and test routines, giving users the flexibility to handle a wide range of test scenarios.

In summary: Advantest is committed to solving the full spectrum of test challenges in SiPh and CPO manufacturing. The goal is to make testing these advanced photonic devices as standardized and streamlined as testing traditional silicon CMOS.

Key Technologies Covered

Next generation solutions for higher data rates, lower latency and energy efficiency in data centers.
Enable high-throughput, automated testing of photonics devices at different stages (PIC, EIC-PIC)
Fully automated wafer handling and automated probe card change
Seamless integration of third-party optical instrument using Advantest Optical Instrument Control Library
High-Volume Manufacturing Automation and Test

Featured Speakers

Dr. Clemens Leichtle

Director, Optical Business Lead, Advantest V93000 PU

Clemens holds a PhD in physics, his thesis was focusing on quantum optics.

He has over 25 years of experience in the semiconductor industry, specializing in testing, and developing respective application solutions for emerging technologies.

For more than 15 years, he has been leading the V93000 Center of Expertise at Advantest and, more recently, co-led the test solution development for Silicon Photonics & Co-packaged Optics targeting data center applications. His current position is Business Lead for the V93000 optical solutions.